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- Updated Programme – 3rd Workshop on PCB Bio-MEMs, June 12, 2019
- EIPC PCB Pavilion – What's New in Electronics, September 18–19, 2019
- Limited seats available – EIPC Summer Conference Leoben, June 13–14, 2019
- Atotech to Present Semiconductor Advanced Packaging Solutions and Innovations at ECTC Conference in Las Vegas
- US Reveals Tariffs on $300bn of Chinese Goods, Including Phones
- Zuken joins the UCLA CHIPS consortium
- WNIE Live 2019
- ICT Annual Symposium, 4 June 2019
- The Semiconductor Packaging Workshop, 6 June 2019
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SAP Utilizing Very Uniform Ultrathin Copper
08/29/2019 |
Steve Iketani and Mike Vinson, Averatek Corporation
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The semiconductor miniaturization brings significant economic and technical benefits and the semiconductor scale factor becomes the master for the associated package and PCB design.
Weiner’s World—March 2018
04/03/2018 |
Gene Weiner, Weiner International Inc.
SEMICON China 2018 was amazing in its size and attendance. More than 1,000 exhibitors filled an event record of more than 74,000 square meters of exhibition space—the size of nearly 10 professional soccer fields. This year's theme was "collect, collaborate, innovate."
Weiner’s World—August 2017
09/04/2017 |
Gene Weiner, Weiner International Inc.
IPC is planning to hold a special meeting on automotive electronics for senior executives during IPC APEX EXPO 2019. The meeting will be planned and produced by the IPC Ambassador Council. Its presentations will feature senior members of the entire automotive electronics supply chain.
