-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Ucamco Streamlines CAD-to-CAM Communications
June 26, 2019 | UcamcoEstimated reading time: 2 minutes
At Ucamco, we are dedicated to excellence in everything that we do. That includes our decades-long stewardship of Gerber, the de facto standard image format for PCB design: our ongoing work on Gerber ensures that this free, open format keeps abreast of, and indeed drives, beneficial developments in PCB design and engineering. As part of this, we are delighted to announce that our Gerber Job Editor is now available free of charge to the PCB design and manufacturing community. This standalone application allows designers to create and edit PCB job files complete with everything including non-image data, that is essential for quoting, planning, engineering, CAM and fabrication.
For decades, Gerber has been the de facto standard for describing 2D images—copper layers, solder mask, drills—in PCB fabrication data. Gerber X2 added intelligence to that image data by providing a standard for defining the layer structure and providing information such as via and SMD identification, pin numbers and reference descriptions.
So far so good, but PCB fabrication data must also include essential information about IPC class, finish, soldermask colour, thicknesses and materials and so on, that cannot be conveyed using images. This is typically transferred manually using annotated drawings, PDF files and texts, which takes time, is prone to potential errors, can be limited by language and terminology barriers, and is not designed for automatic workflows.
Ucamco’s Gerber Job File specification changes this by providing designers with a standardised format with which the non-image-based elements in their PCB designs can be transferred to the PCB manufacturer in an unequivocal, machine-readable manner. Compatible with Gerber X1, Gerber X2 and ODB++, this is a simple add for CAD suppliers and indeed many of the leading CAD systems support it and can output complete Gerber job files. Where this is not the case, Ucamco’s new standalone Gerber Job File Editor allows PCB designers to create job files that fully describe their PCBs’ non-image characteristics, no matter which CAD system they use. It’s simple to download and simple to use. The designer chooses which characteristics are important to each specific PCB and ignores the rest, and even if the fabricator cannot yet handle the Job File automatically, the fabrication data is clear and presented in an unambiguous, standard, human-readable manner.
Gerber Job File Editor can be downloaded free of charge from https://www.ucamco.com/files/downloads/Gerber_Job_Editor_Installer.zip.
About Ucamco
Ucamco (formerly Barco ETS) is a market leader in PCB CAM software, photoplotting and direct imaging systems, with a global network of sales and support centers. Headquartered in Ghent, Belgium, Ucamco has over 35 years of ongoing experience in developing and supporting leading-edge photoplotters and front-end tooling solutions for the global PCB industry. Key to this success is the company's uncompromising pursuit of engineering excellence in all its products. Ucamco also owns the IP rights on the Gerber File Format through its acquisition of Gerber Systems Corp. (1998).
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.