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Chip and component demand for 5G related applications, including network equipment, and antennas for handsets and IoT devices, is set to grow robustly starting 2020, according to Digitimes. In the PCB industry supply chain, suppliers of copper clad laminates (CCLs), IC substrates and flexible PCBs are seen to be ramping up their production in line with trend.
In particular, with CCL (copper clad laminate) deemed as the most crucial material for high-end PCBs for 5G applications, major suppliers in Taiwan and China are actively proceeding with capacity expansions seeking to ready sufficient capacities to meet explosive demand expected to come after 5G commercialization, Digitimes reports.
Another trend seen is the significantly enlarged main boards for 5G smartphones to accommodate many more RF modules. According to Digitimes, Taiwan-based PCB makers including Zhen Ding Technology, Unimicron and Compeq Manufacturing are expected to benefit from this requirement.
