Maxim Provides First and Only Automotive-Grade Secure Authenticator to Enhance Vehicle Safety
November 1, 2019 | Maxim Integrated Products Inc.Estimated reading time: 2 minutes

Designers can now enhance safety, security and data integrity for connected vehicle systems while also reducing both complexity and code development time with the DS28C40 DeepCover® automotive secure authenticator from Maxim Integrated Products, Inc. (NASDAQ: MXIM). As the industry’s first and only AEC-Q100 Grade 1 solution for automotive systems, this authenticator IC reduces the design complexity and software vulnerability of current approaches to ensure only genuine components are used for many electronic systems, such as advanced driver assistance systems (ADAS) and electric vehicle (EV) batteries.
As cars become more sophisticated with the features they offer, safety and security risks grow as well. Automotive manufacturers use authentication to ensure only OEM-certified components are safely connected to vehicle systems, as well as reduce the growing threat of malware attacks. However, full-blown secure microcontrollers usually have a relatively big footprint and require software development teams to create, rigorously test and debug their code. The bigger the code base is, the higher the risk of bugs or malware adversely affecting performance.
The DS28C40 DeepCover authenticator is the only authenticator that meets the AEC-Q100 standard with Grade 1 performance. It replaces microcontroller-based approaches and reduces both system design complexity and associated code development efforts. The authenticator deters theft of high-value components such as front-light modules. It also offers public/private key asymmetric ECDSA (ECC-P256 curve) and other key authentication algorithms built into the IC, allowing OEMs to skip development of proprietary device-level code. This and other algorithms in the authenticator IC provide the strongest defense against unauthorized components that could compromise performance, safety and data integrity. The DS28C40 comes in a compact, 4mm-x-3mm TDFN package and operates over the -40-degree to +125-degree Celsius temperature range.
Key Advantages
- Robust Security: Built-in symmetric key secure hash algorithm (SHA-256) support; secure storage of ECDSA and SHA-256 keys; one-time programmable nonvolatile memory for storage of digital certificates and manufacturing data; hardware-based security stronger than software approach.
- Simple Integration: Device-level development code efforts eliminated with authentication algorithms built into IC; industry-standard I2C interface and low software overhead on host side simplifies design integration.
Commentary
- “As electronic content increases in automotive platforms, so does the threat of substandard aftermarket components that could compromise vehicle safety and performance,” said Tanner Johnson, senior IoT and connectivity analyst at IHS Markit, now a part of Informa Tech. “Leading manufacturers are appropriately concerned about these threats, and any standards-based security technology that promises to thwart the use of uncertified components and makes the process more cost effective will draw strong interest from designers.”
- “Automotive OEMS and Tier-1s are faced with time and resource constraints when it comes to implementing security for advanced electronic systems,” said Michael Haight, director, Embedded Security at Maxim Integrated. “Our latest small-footprint authenticator ICs help them add the most advanced crypto-security available without adding new development teams to write and debug the code that is typically required for microcontroller and software-dependent approaches.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
PCBA Market Poised to Reach $147.5 Billion by 2035
10/20/2025 | Globe NewswireGlobal printed circuit board assembly market is projected to reach $147.5 billion by 2035, at a CAGR of 4.7% during the forecast period 2025-2035
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Sumitomo Riko Boosts Automotive Design Efficiency 10x with Ansys AI Simulation Technology
10/13/2025 | SynopsysSumitomo Riko is implementing Ansys, part of Synopsys, Inc. AI technology to accelerate time-to-solution and improve efficiency during the design and manufacturing of automotive components.
productronica: Increasing Demand for Tamper-proof Electronics
10/08/2025 | productronicaThe electronics industry will get together at productronica in Munich from November 18 to 21, 2025. One of the three key topics this year will be secure microelectronics.