Dozuki Collaborates with 3M to Connect Factory Workers and Digital Transformation Strategies in Manufacturing
November 7, 2019 | PRNewswireEstimated reading time: 1 minute

Dozuki, a San Luis Obispo, Calif.-based software company, announces it has collaborated with 3M, through an investment by 3M Ventures, to bring its standard work and work instruction training software to manufacturers of all sizes to help them achieve digital transformation goals. The terms of the transaction were not disclosed.
"This collaboration with 3M Ventures is a vote of confidence in our process standardization and training platform," said Eric Doster, CEO and co-founder of Dozuki. "The ability to leverage the organizational and manufacturing expertise of an industry leader like 3M is a major milestone for our team. We are already building world-class software to help manufacturers tackle challenges such as sharing knowledge across teams, speeding up job training and engaging a younger workforce. This collaboration allows us to ramp up our product development and market outreach efforts."
3M Ventures identifies and invests in highly innovative companies and disruptive new technologies with strategic relevance for 3M.
Standardized processes and guides in Dozuki enable teams to execute work properly the first time, and provide feedback for future improvements quickly. By creating a collection of standard operating procedures (SOPs), training materials, and digital forms, Dozuki enables factory operations to:
- Perform work consistently to the company quality standards
- Improve training with on-demand resources including videos and guided process walkthroughs
- Communicate in real-time across teams, shifts, and factories
As part of the collaboration, Dozuki will continue to develop its standard work software to provide manufacturers with the ability to implement a continuous improvement culture and empower its workforce. These challenges are particularly timely as millions of domestic manufacturing jobs are expected to experience employee turnover in the coming years and the rise of automation is creating a demand for a higher skilled factory worker.
Says Doster, "Dozuki is building enterprise-level training solutions for the YouTube generation as they enter the workforce." Their platform makes capturing, standardizing, and sharing the tribal knowledge of retirees easy as the industry continues to recruit and train new employees.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
Integrating Uniplate PLBCu6 With the Digital Factory Suite
09/12/2025 | Giovanni Obino and Andreas Schatz, MKS' AtotechPrinted circuit board manufacturing is rapidly changing, driven by miniaturization, stringent reliability requirements, and growing pressure for sustainable production. Meeting these challenges requires more than incremental improvements; it demands a combination of precise equipment and real-time process intelligence. The pairing of Uniplate® PLBCu6 with the Digital Factory Suite (DFS) demonstrates how hardware and software can work together to create more responsive, resource-efficient manufacturing.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.