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TopLine and VPT Components Announce Column Attachment Services for RadHard FPGA Devices
November 18, 2019 | TopLineEstimated reading time: Less than a minute
Teresa Farris, TopLine Business Development Manager of Radiation Hardened Technology (RadHard) announces expanded collaboration and technical cooperation with VPT Components, a JANS-certified semiconductor manufacturer to provide CCGA column attachment services to the RadHard community as presented by Joe Benedetto, CEO of VPT Components at a recent RHET conference held in Melbourne, FL.
TopLine is a California-based manufacturer of copper-wrapped Pb80/Sn20 solder columns for ceramic column grid array (CCGA) packages.
Benedetto says that “VPT Components is working towards DLA certification with a goal of reaching QML Q-level qualification in early in 2020.”
Martin Hart, CEO of TopLine Corporation, remarks, “We are pleased to extend close technical cooperation and support to VPT Components, who serves as an independent contract assembler to provide column attachment services to the greater defense and aerospace industries. VPT has demonstrated excellent skills and workmanship with attaching TopLine made solder columns to FPGA devices.”
Benedetto add that, “There is a need in the radiation hardened IC community for faster turn-times. VPT developed a CCGA process using TopLine columns with excellent attachment and pull-strength test results. We are working on automating the process to give customers quick turn services at competitive pricing.”
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