KP Performance Antennas Unveils New ProLine, 8-Port, Horizontal/Vertical Polarized Sector Antenna
November 21, 2019 | Infinite ElectronicsEstimated reading time: Less than a minute
KP Performance Antennas, a manufacturer of wireless network antennas, has just launched a new horizontal/vertical polarized, 8-port ProLine sector antenna that is ideal for broad-frequency, point-to-point, point-to-multipoint and backhaul applications.
KP’s new KPP-2HV5HVX8-65 ProLine horizontal/vertical polarized sector antenna operates in the 2.3 GHz to 2.7 GHz and 4.9 GHz to 6.4 GHz frequency ranges. It features a 65-degree azimuth beamwidth and zero-degree fixed electrical downtilt. It also boasts 8 ports, gain performance of 17 dBi and 16.8 dBi respectively and excellent front-to-back of 31 dB and 34 dB. This antenna is engineered to deliver high, stable gain over wide bandwidths and suppress side-lobes and back-lobes for mitigating inter-sector interference.
“Our new horizontal/vertical polarized ProLine sector antenna combines two individual radiating systems within a single rugged radome, allowing complete dual-spectrum coverage while reducing leased space on the tower and installation costs,” said Ken Izatt, Antenna Product Line Manager.
Suggested Items
Intel Gaudi, Xeon and AI PC Accelerate Meta Llama 3 GenAI Workloads
04/22/2024 | Intel CorporationMeta launched Meta Llama 3, its next-generation large language model (LLM). Effective on launch day, Intel has validated its AI product portfolio for the first Llama 3 8B and 70B models across Intel® Gaudi® accelerators, Intel® Xeon® processors, Intel® Core™ Ultra processors and Intel® Arc™ graphics.
Cadence Unveils Palladium Z3 and Protium X3 Systems
04/18/2024 | Cadence Design SystemsThe Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance.
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Northrop Grumman Honors Calumet Electronics with Supplier Excellence Award
04/17/2024 | Calumet ElectronicsNorthrop Grumman Corporation has recognized Calumet Electronics during the company’s 2024 Supplier Excellence Awards for “exceptional performance and unwavering commitment to delivering with excellence.” Calumet is one of 70 suppliers recognized from across the globe. In its award category of “Supplier Strategic Excellence,” Calumet was honored alongside global corporations such as Amazon Web Services, Dell Technologies, and Eaton Corporation.
Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms to Power AI in Vehicles
04/17/2024 | MicronMicron Technology, Inc. announced that it has qualified a full suite of its automotive-grade memory and storage solutions for Qualcomm Technologies Inc.’s Snapdragon® Digital Chassis™, a comprehensive set of cloud-connected platforms designed to power data-rich, intelligent automotive services.