Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Amid Trade Row With Japan, South Korea Gains DuPont Investment to Make Chip Materials
January 14, 2020 | ReutersEstimated reading time: 1 minute
South Korea said on Thursday DuPont will invest $28 million in the country to produce advanced photoresists and other materials by 2021, a move that will help reduce its reliance on Japan for the products used in semiconductor manufacturing.
Amid a bilateral row over wartime laborers, Japan in July imposed curbs on exports of three materials including photoresists to South Korea, prompting a scramble among South Korean tech firms to diversify their supply chain.
Last month, Japan reversed the curbs on exports of photoresists, although tighter curbs on the two other materials - fluorinated polyimides used in smartphone displays and hydrogen fluoride used as an etching gas when making chips - remain.
“Although Japan has recently eased export controls of photoresists, which is partial progress, but it is not a fundamental solution,” South Korea’s Industry Minister Sung Yoon-mo said in a statement.
A trade ministry official said DuPont will invest in two existing factories in South Korea and build a new one.
Photoresists are thin layers of material used to transfer circuit patterns onto semiconductor wafers. Japan produces around 90% of photoresists.
The ministry official said Dupont’s Korean subsidiary currently produces photoresists, but not ones needed to make chips with an advanced technique known as extreme ultraviolet or EUV lithography.
The new investment will also go towards the production of CMP pads, which are polishing pads used during the semiconductor manufacturing process, the ministry said.
A representative for the U.S. industrial materials maker was not immediately available for comment.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area
08/28/2025 | Team NCAB -- Column: Fresh PCB ConceptsRigid-flex PCBs come in all shapes and sizes. Manufacturers typically use fire-retardant, grade 4 (FR-4) materials in the rigid section and flexible polyimide materials in the flex region. Because of the small size, some rigid-flex PCBs, like those for hearing aid devices, are among the most challenging to manufacture. However, regardless of its size, we should not neglect the transition area between the rigid and flexible material.