Boeing and U.S. Navy Complete First Super Hornet IRST Block II Flight
January 15, 2020 | BoeingEstimated reading time: 1 minute
For the first time, Boeing and the U.S. Navy flew an F/A-18 Super Hornet equipped with an Infrared Search & Track (IRST) Block II pod in late 2019. IRST Block II is a critical component of the Block III Super Hornet. The Block III conversion will include enhanced network capability, longer range with conformal fuel tanks, an advanced cockpit system, signature improvements and an enhanced communication system. The updates are expected to keep the F/A-18 in active service for decades to come.
IRST is a passive, long-range sensor incorporating infrared and other sensor technologies for highly accurate targeting.
“The IRST Block II gives the F/A-18 improved optics and processing power, significantly improving pilot situational awareness of the entire battle space,” said Jennifer Tebo, Boeing Director of F/A-18 Development.
Currently in the risk reduction phase of development, IRST Block II flights on the Super Hornet allow Boeing and the Navy to collect valuable data on the system before deployment to the fleet. The Block II variant will be delivered to the Navy in 2021, reaching Initial Operational Capability shortly thereafter.
“The IRST Block II sensor gives Navy fighters extended range and increasing survivability. This technology will help the Navy maintain its advantage over potential adversaries for many years,” said Kenen Nelson, Lockheed Martin Director of Fixed Wing Programs, supplier of the IRST sensor.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Key Tronic Earns Bronze ‘Partner2Win’ Medallion from BAE Systems
11/24/2025 | Key Tronic Corp.Key Tronic Corporation received a Bronze Medallion at BAE Systems’ ‘Partner2Win’ suppler symposium, recognizing its exceptional performance and commitment to operational excellence this year.
OpenAI and Foxconn Collaborate toStrengthen U.S. Manufacturing Across the AI Supply Chain
11/21/2025 | OpenAIOpenAI announces a collaboration with Foxconn focused on design work and U.S. manufacturing readiness for the next generation of AI infrastructure hardware. As part of this work, OpenAI will share insight into emerging hardware needs across the AI industry to help inform Foxconn’s design and development efforts for hardware to be manufactured at Foxconn’s U.S. facilities.
Inside the Machine: Power Electronics Driving the Road to Reliability
11/21/2025 | Stanton Rak, SF Rak CompanyThe silent, seamless propulsion of an EV masks the incredible complexity and engineering finesse required to make it all happen. Beneath the vehicle’s floor or under its hood lies a dense cluster of power electronics systems comprised of coordinated, high-performance modules that collectively control, convert, and condition energy from the battery to the wheels. These systems not only govern how smoothly an EV accelerates or how efficiently it uses its charge but also play a defining role in the long-term reliability, safety, and serviceability of the vehicle.
Setting the Standards for AI-era Packaging: Key Takeaways from IMPACT 2025
11/17/2025 | Sydney Xiao, Global Electronics Association East AsiaDiscussions on component-to-system-level integration took center stage at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) 2025, Asia-Pacific’s leading conference for microsystems, packaging, and circuit technology, which celebrated its 20th year in October. Co-organized and supported by the Global Electronics Association, the event in Taipei, Taiwan, brought global industry leaders together to explore how packaging innovations are shaping the AI era.
Beyond the Board: Why More Defense Primes Are Moving Toward Rigid-flex for Lighter, More Reliable Systems
11/18/2025 | Jesse Vaughan -- Column: Beyond the BoardOver the past decade, the conversation around PCB innovation in aerospace and defense has often centered on high-density interconnects, advanced materials, and tighter design-to-fabrication collaboration. But the move toward rigid-flex is a quieter shift that has been gaining momentum, and it’s changing how primes and system integrators approach the physical architecture of mission-critical electronics.