Microchip and Arrow Electronics Announce Collaboration on Edge IoT Security
January 30, 2020 | Business WireEstimated reading time: 1 minute

Microchip Technology and Arrow Electronics announced an engineering services collaboration to simplify connectivity and security across industrial, smart building and energy markets.
According to NIST, cybersecurity and privacy risks for IoT devices can be thought of in terms of three high-level risk mitigation goals, including protecting: device security, data security, and individuals’ privacy. Arrow will augment Microchip’s smart, connected, secure portfolio with engineering services so that original equipment manufacturers (OEMs) can decrease their time to market and meet requirements in recent government legislation and NIST IoT security guidelines.
“Technology, pervasively, is embedded in everything. Every industry and every system are being fundamentally shaped by connected edge technology — it is happening in our homes, our work and our factories,” said Mitch Little, senior vice president of worldwide client engagement at Microchip Technology. “These intelligent edge systems are running fundamental and critical executions, and they must be secure.”
Microchip’s range of secure product features span secure root of trust, secured communication, crypto authentication, certificate management, cloud provisioning, data security, encryption services, secure boot and IP protection.
“OEMs are embracing engineering service collaboration so that they can augment internal work teams to tackle new technology integration and reduce risk in areas of certification and compliance,” said David West, senior vice president at Arrow. “Edge device and edge compute applications and systems must now be secured from the sensory layer all the way to the enterprise.”
The first secure end-to-end platform resulting from this collaboration is the Shield96. This platform enables OEMs to have the needed security foundation integrated into the reference design.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Corporation Earns Mexico Technology Award for New Halogen-Free Flux-Cored Wire
09/18/2025 | Indium CorporationIndium Corporation recently earned a Mexico Technology Award for its new high-reliability, halide- and halogen-free flux-cored wire, CW-807RS, which improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
09/17/2025 | BUSINESS WIREBlaize Holdings, Inc., a leader in programmable, energy-efficient edge AI computing, and Technology Control Company (TCC), a leading technology solutions provider in the Kingdom of Saudi Arabia (KSA), announced a strategic partnership to advance Saudi Arabia’s AI innovation infrastructure and accelerate its digital transformation goals.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).