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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
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Call For Papers Printed Electronics Europe: Flexible Structural Hybrid
January 30, 2020 | IDTechExEstimated reading time: Less than a minute

IDTechEx is now accepting applications to present at Printed Electronics Europe in Berlin on 13−14 May 2020. Tell us about your new concepts, technologies, materials and applications. Successful submissions will be speaking alongside global experts flying in from all over the world.
From material opportunities in electric vehicles, to electronics skin patches in healthcare, to new form factors of electronics in consumer devices; these are among the topics covered at Printed Electronics Europe; the conference and exhibition of the printed and flexible electronics industry. 2,500 attendees, over 250 speakers and over 200 exhibitors will converge at the event, which focuses on the business of printed electronics—with key OEMs and value chain participants moving the industry forward.
Some of the topics we will be covering this year include:
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Flexible, Hybrid & Stretchable Electronics
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Flexible Displays
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Flexible and Printed Batteries
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Flexible Transparent Films & Barriers
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Hybrid Electronic Manufacturing
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Materials for Printed Electronics
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Printed Electronics in Automotive
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Printed Electronics in Healthcare
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Printed Electronics Manufacturing
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Printed Electronics in Retail
If you wish to apply to speak, please send a proposed title and short abstract by 31 January, to Chris Clare at C.Clare@IDTechEx.com or download a submission form here.
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