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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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DuPont and SCHMID Announce Partnership for New PCB Plating Applications
February 4, 2020 | DuPontEstimated reading time: 1 minute

DuPont Electronics & Imaging and SCHMID Group today announce that they have entered into a nonexclusive joint development agreement to explore new PCB plating applications to bring advanced innovations to ther global customers. The partnership will benefit high-end printed circuit board manufacturers by delivering next-generation interconnect products and metallization processes that can create faster, smarter and more reliable devices for the 5G era. The new solutions which will include equipment and chemistry are expected to be launched in late 2020.
“SCHMID and DuPont’s combined expertise in equipment and chemistries positions us well for the needs for innovations in areas such as 5G, automotive and artificial intelligence,” said Avi Avula, Global Business Director, Interconnect Solutions, DuPont Electronics & Imaging. “SCHMID is an outstanding partner with extensive engineering expertise, process knowledge and world-class metallization equipment. Coupled with DuPont’s broad offerings including metallization chemistry, flexible copper clad laminates and dry film imaging films, strong customer relationships and global footprint, this partnership will enable us to advance metallization solutions for leading-edge PCB and substrate applications.”
“Partnering with DuPont will allow us to introduce disruptive innovations to our customers in the advanced electronics manufacturing market,” said Christian Schmid, President & CEO of SCHMID Group. “We are committed to launching advanced metallization systems that will address the challenges that our customers face to meet the required performance and reliability. We are confident that the possibilities enabled with this partnership will significantly contribute to realization of our joint target – delivering better solutions to create superior value.”
The new equipment and chemistry solutions are expected to address the challenges from advanced circuit board designs that require enhanced performance and reliability, and improved cost of ownership for production.
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07/10/2025 | I-Connect007 Editorial TeamPresident Donald Trump stated on July 8 that he plans to impose a 50% tariff on copper imports, sparking concern in a global industry whose output is critical to electric vehicles, military hardware, semiconductors, and a wide range of consumer goods. According to Yahoo Finance, copper futures climbed over 2% following tariff confirmation.
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07/07/2025 | Michael Carano -- Column: Trouble in Your TankIn the movie “Friday Night Lights,” the head football coach (played by Billy Bob Thornton) addresses his high school football team on a hot day in August in West Texas. He asks his players one question: “Can you be perfect?” That is an interesting question, in football and the printed circuit board fabrication world, where being perfect is somewhat elusive. When it comes to mechanical drilling and via formation, can you drill the perfect hole time after time?
The Evolution of Picosecond Laser Drilling
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Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.