It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
MixComm Names James Martin Vice President of Business Development
June 24, 2020 | PRWEBEstimated reading time: 1 minute
MixComm announced the appointment of James “Jay” Martin as Vice President of Business Development. Martin will drive growth in 5G and related markets for the millimeter wave startup. He brings to MixComm an extensive background in wireless business development, design and engineering management with a history of building successful and deep technical relationships with customers in the RF and millimeter wave industries. With 25 years of experience, he has led significant value creation through new opportunity identification and customer engagement.
Most recently, Martin was the Senior Marketing and Business Development Manager at IDT (now Renesas), where he led wireless infrastructure marketing and business development. Prior to that role, he was the Senior Business Development Director at Anadigics (now Skyworks) and has held senior engineering roles at RF Micro Devices, Paratek Microwave and Anadigics.
“Joining the MixComm team will allow me to work alongside a gifted team of thought leaders during an exceptionally exciting time given the company’s recent product announcements and innovative projects in the works,” said Martin. “I look forward to helping our customers realize the power of MixComm’s unique technology to bring the full potential of millimeter wave 5G to the world.”
As Vice President of Business Development, Martin joins the leadership team that includes MixComm’s CTO and Co-Founder Dr. Harish Krishnaswamy, Co-Founder and VP of Engineering Frank Lane, VP of RF Technology Dr. Arun Natarajan, and CEO Mike Noonen. MixComm introduced its first production device, the SUMMIT 2629, earlier this year.
Dr. Harish Krishnaswamy, MixComm CTO and Co-Founder said, “Millimeter wave 5G technology is at a crucial juncture and will require a combination of both technological advancement and sound business strategy to be successful. Jay is unparalleled in his expertise and understanding that ranges from dBs to dollars. We at MixComm are excited to have Jay lead the effort to bring our technology to the market."
"Jay’s deep technical experience, customer relations expertise and unique insight into millimeter wave opportunities makes him a vital addition to the MixComm team,” said Mike Noonen, CEO. “He is the ideal person to maximize the potential of MixComm’s breakthrough performance.”
Share on:
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.