Management Change at the Würth Elektronik eiSos Group
June 25, 2020 | Wurth Elektronik eiSosEstimated reading time: 1 minute
After 27 years in the Würth Elektronik Group, Oliver Konz has decided to resign his position as Executive Vice President of the Würth Group and CEO of the Würth Elektronik eiSos Group for personal reasons and leave the company.
"We very much regret his decision. This is a major loss for us,” says Thomas Schrott, Executive Vice President Würth Group and CEO of the Würth Elektronik eiSos Group. "Oliver Konz was there right from the start and has made an extraordinary contribution to Würth Elektronik eiSos becoming one of the leading manufacturers of electronic and electromechanical components,” adds Alexander Gerfer, CEO Würth Elektronik eiSos GmbH & Co. KG and CTO of the Würth Elektronik eiSos Group. Oliver Konz began as a product developer for components and soon assumed responsibility in other areas. From 2002 onwards, he shaped the company's destiny as CEO and in 2019 was appointed Executive Vice President of the Würth Group. "We respect his decision and are now looking ahead,” says CEO Würth Elektronik eiSos GmbH & Co. KG and CFO of the Würth Elektronik eiSos Group, Thomas Wild.
Bettina Würth, Chairwoman of the Advisory Board of the Würth Group and Robert Friedmann, Chairman of the Central Managing Board of the Würth Group, thank Oliver Konz who, together with his management team and all employees, built up and developed the start-up company into the successful, globally active group of companies it is today: "On behalf of the Advisory Board and the Central Managing Board, we would like to thank Oliver Konz for his successful work for the Würth Elektronik eiSos Group and therefore also for the Würth Group, and wish him all the best for the future.”
Thomas Schrott (CEO), Alexander Gerfer (CTO) and Thomas Wild (CFO) will continue to manage the company.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
09/16/2025 | Technica USATechnica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Zhen Ding Expands PCB into Semiconductors at SEMICON Taiwan 2025; Advantech Drives AI Smart Parks
09/12/2025 | Zhen DingZhen Ding Technology Holding Co., Ltd., a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025. Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.