Dan’s Biz Bookshelf: ‘Dream First, Details Later
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
HiPhi X Launches With Handle-Less, Touch-Free, Electronically Controlled NT Door System
September 2, 2020 | PR NewswireEstimated reading time: Less than a minute
HiPhi, Human Horizons' premium, smart, all-electric vehicle brand, is excited to announce the application of its world-first NT Door system on the HiPhi X. The innovative new entry to the premium automotive segment will debut at the 2020 Beijing Auto Show.
HiPhi X, the first model of the HiPhi brand, is positioned as a self-learning, supercar-inspired SUV, adopting the world's first Human Oriented Architecture (HOA) enabling a secure, developer-open software platform. HOA comprises of 6 "super brain" domain controllers, connected by 1G Ethernet, over 500 sensors, and a 5G-V2X technology network.
HiPhi X comes with 2 battery options, the larger being a 96 kWh unit. The battery technology, highly efficient electric drive system and a low drag coefficient of 0.27, delivers a range of 610 km (NEDC). The HiPhi X will accelerate from 0 to 100km/h in just 3.9s. The advanced vehicle has been developed with dual-redundant systems which is a key enabler for its Level 3 autonomous driving capability. The HiPhi X is equipped with the worlds-first NT Door system, Programmable Matrix Lighting (PML), Intelligent Signal Display (ISD), a theatre-style co-pilot screen and other leading technologies to bring users a truly new experience.
Share on:
Suggested Items
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.