-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
MKS Sees Strong Early Market Adoption in Asia for its Newest HDI PCB Laser Manufacturing Solution
September 2, 2020 | MKS Instruments, Inc.Estimated reading time: 2 minutes

MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, announced that Meiko Electronics Co. Japan has purchased multiple ESI® Geode™ Systems to enhance its high-volume HDI PCB manufacturing capability. The recently released CO2-laser-based systems will be deployed at Meiko’s high-end manufacturing facility in Vietnam.
“We are pleased with the market adoption of the Geode system,” said MKS President and CEO John T.C. Lee. “Geode is well-positioned to take advantage of the growing market for HDI PCB processing solutions, as electronics manufacturers continue the path of miniaturization in order to meet the demand for smaller and more capable devices.”
The Geode system delivers many benefits for high-end applications, such as 5G. According to Atsushi Sakate, Executive Officer, General Manager of Production at Meiko,
“Beyond the Geode system’s higher drilling throughput and accuracy, the system’s smaller footprint and lighter weight enables us to plan capacity expansion with much more flexibility. Add to this the broad range of applications and materials that Geode can process, and the decision is clear.”
Developed by MKS’ Equipment & Solutions Division, already a market leader in flex PCB laser drilling solutions, the Geode system is optimized to process the rigid HDI PCBs and package substrates widely used in consumer electronics, such as smartphones and other handheld devices. Building on MKS’ technology leadership in laser processing for flexible printed circuits, Geode’s new CO2 laser technology and control capabilities deliver breakthrough performance. Its superior throughput, refined power control and small system footprint meet the needs of high-volume PCB manufacturers. Learn more about the ESI Geode System at www.esi.com.
About MKS Instruments
MKS Instruments, Inc. is a global provider of instruments, systems, subsystems and process control solutions that measure, monitor, deliver, analyze, power and control critical parameters of advanced manufacturing processes to improve process performance and productivity for our customers. Our products are derived from our core competencies in pressure measurement and control, flow measurement and control, gas and vapor delivery, gas composition analysis, electronic control technology, reactive gas generation and delivery, power generation and delivery, vacuum technology, lasers, photonics, optics, precision motion control, vibration control and laser-based manufacturing systems solutions. We also provide services relating to the maintenance and repair of our products, installation services and training. Our primary served markets include semiconductor, industrial technologies, life and health sciences, research and defense. Additional information can be found at www.mksinst.com.
About the ESI Brand
ESI® is a brand within the MKS Instruments Equipment & Solutions Division. The ESI portfolio consists of laser-based micro manufacturing systems and component test systems that are used worldwide by manufacturers in the electronics industry to process the materials and components that are an integral part of the electronic devices and systems in use today. Leveraging over 40 years of laser-material interaction expertise and applied laser technology, ESI solutions enable customers to optimize production by providing more control, greater application flexibility and more precise processing of a wide range of materials. The result is higher production quality, increased throughput and higher back-end yields at a lower total cost-of-ownership. Additional information can be found at www.esi.com .
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
U.S. Manufacturing Jobs Decline Amid Tariffs and Immigration Crackdown
09/17/2025 | I-Connect007 Editorial TeamManufacturers in the U.S. are cutting jobs even as President Donald Trump pushes policies he says will revitalize the industry. Employers shed 12,000 manufacturing jobs in August, while payrolls in the sector have fallen by 42,000 since April, according to a new analysis from the Center for American Progress (CAP) based on government labor data.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
GlobalFoundries Joins World Economic Forum’s Global Lighthouse Network for Manufacturing Excellence
09/17/2025 | GlobalFoundriesGlobalFoundries announced that the World Economic Forum (WEF) has designated its 300mm fab in Singapore as part of the Global Lighthouse Network (GLN) of advanced manufacturers.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.