-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Nano Dimension Strengthening its Leadership Position in 3D Printed Electronics with AME Design Methodology
January 13, 2021 | Nano Dimension Ltd.Estimated reading time: 1 minute

Nano Dimension Ltd., a leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider, offers quick solutions and easy access to complex PCBs and 3D printed electronics. Its unique and novel technology allows for rapid prototyping and production of high-performance electronic devices (Hi-PEDs™).
Nano Dimension offers two solutions:
A. DragonFly LDM® 3D-printing system for Hi-PEDs catering to cross-industry needs by enabling in-house printing of free-form, complex, multiple layered boards.
B. A printing service dubbed, NaNoS?, for entities that wish to explore 3D printing of their own designs while gaining access to Nano’s 3D printing and design experts.
“Nano Dimension bridges the gap between PCB and semiconductor integrated circuits,” said Yoav Stern, CEO of Nano Dimension. “A revolution at the click of a button: From CAD to a functional high-performance AME device in hours, solely for the cost of the consumable materials. The DragonFly LDM® should be in everyone’s design workshop for rapid prototyping and testing. AME technology provides the capability to design and create free-form, multilayer complex circuit boards, bringing companies one-step closer to industry 4.0. With NaNoS?, the AME fabrication service becomes the first point of contact and an effective and affordable exploration of AME technology’s capabilities. This is a wake-up call for entities that wish to explore adoption of 3D revolutionary design, manufacturing, and fabrication technology.”
The DragonFly LDM® system enables in-house 3D printing of highly complex, multilayered circuits containing embedded capacitors, antennas, coils, converters, and electro-mechanical components, in just hours.
Nano Dimension’s DragonFly LDM® systems are utilized in cutting edge research institutes, such as CBN-IIT (Italy) and the University of Technology in Sydney (Australia). These institutes continuously expand the design envelope by breaking free from traditional 2D PCB design rules, resulting in miniaturized, performance enhanced 3D AME devices.
With approximately 60 systems sold worldwide, Nano Dimension is also cooperating with customers and partners such as Hensoldt (Germany), L3Harris (USA), and others, to provide insights into how AME technology can drive forward electronics’ design.
Nano Dimension has initiated a webinar-series where scientists and engineers share findings and AME-based solutions in 3D-printed 5G antennas, advanced microwave devices, embedding, micro-electromechanical systems (MEMS) packaging and heterogeneous integration. This knowledge sharing series provides a platform for the free flow of information and an open dialogue between industry experts who are looking for innovative solutions.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
LITEON Technology Reports Consolidated September Sales of NT$15.4 Billion, Up 30% YoY
10/09/2025 | LITEON TechnologyLITEON Technology reported its September consolidated revenue of NT$15.4 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 30% Y-o-Y. The cumulative sales for January to September totaled NT$121.7 billion, up 23%, Y-o-Y.
Nomination Committee Appointed for HANZA AB's 2026 Annual General Meeting
10/09/2025 | HANZAAccording to a decision at HANZA AB's most recent Annual General Meeting, a Nomination Committee consisting of four members, including the Chairman of the Board, shall be appointed by the three largest shareholders or shareholder groups in terms of voting rights.
Quilter Secures $25M Series B to Eliminate Manual PCB Design with Physics-Driven AI
10/09/2025 | BUSINESS WIREQuilter, the first and only company to publicly demonstrate fully autonomous PCB layout through physics-driven AI, announced $25 million in Series B funding led by Index Ventures.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.