-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Nano Dimension Strengthening its Leadership Position in 3D Printed Electronics with AME Design Methodology
January 13, 2021 | Nano Dimension Ltd.Estimated reading time: 1 minute

Nano Dimension Ltd., a leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider, offers quick solutions and easy access to complex PCBs and 3D printed electronics. Its unique and novel technology allows for rapid prototyping and production of high-performance electronic devices (Hi-PEDs™).
Nano Dimension offers two solutions:
A. DragonFly LDM® 3D-printing system for Hi-PEDs catering to cross-industry needs by enabling in-house printing of free-form, complex, multiple layered boards.
B. A printing service dubbed, NaNoS?, for entities that wish to explore 3D printing of their own designs while gaining access to Nano’s 3D printing and design experts.
“Nano Dimension bridges the gap between PCB and semiconductor integrated circuits,” said Yoav Stern, CEO of Nano Dimension. “A revolution at the click of a button: From CAD to a functional high-performance AME device in hours, solely for the cost of the consumable materials. The DragonFly LDM® should be in everyone’s design workshop for rapid prototyping and testing. AME technology provides the capability to design and create free-form, multilayer complex circuit boards, bringing companies one-step closer to industry 4.0. With NaNoS?, the AME fabrication service becomes the first point of contact and an effective and affordable exploration of AME technology’s capabilities. This is a wake-up call for entities that wish to explore adoption of 3D revolutionary design, manufacturing, and fabrication technology.”
The DragonFly LDM® system enables in-house 3D printing of highly complex, multilayered circuits containing embedded capacitors, antennas, coils, converters, and electro-mechanical components, in just hours.
Nano Dimension’s DragonFly LDM® systems are utilized in cutting edge research institutes, such as CBN-IIT (Italy) and the University of Technology in Sydney (Australia). These institutes continuously expand the design envelope by breaking free from traditional 2D PCB design rules, resulting in miniaturized, performance enhanced 3D AME devices.
With approximately 60 systems sold worldwide, Nano Dimension is also cooperating with customers and partners such as Hensoldt (Germany), L3Harris (USA), and others, to provide insights into how AME technology can drive forward electronics’ design.
Nano Dimension has initiated a webinar-series where scientists and engineers share findings and AME-based solutions in 3D-printed 5G antennas, advanced microwave devices, embedding, micro-electromechanical systems (MEMS) packaging and heterogeneous integration. This knowledge sharing series provides a platform for the free flow of information and an open dialogue between industry experts who are looking for innovative solutions.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.
TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
09/16/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB West 2025, taking place Wednesday, October 1, 2025, at the Santa Clara Convention Center in California. Visitors are invited to Booth 113 to explore the companies’ complementary expertise in test engineering services and workforce development for the electronics industry.