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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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'CHIPS Plus' Bill Passed with IPC’s Active Support
August 2, 2022 | IPCEstimated reading time: 1 minute

After years of trying to get the funding for the CHIPS Act passed via several different vehicles, the U.S. Congress acted quickly last week to approve a slimmed-down version of the competitiveness package formerly known as “USICA” and “America COMPETES” before the August recess. In the end, Congress passed the CHIPS and Science Act, the research and development legislation also referred to as “CHIPS Plus”, which includes more than $52 billion for U.S. companies that manufacture semiconductors as well as billions in tax credits to encourage investment in chip manufacturing. It also provides tens of billions of dollars to fund scientific research, innovation, and development of other U.S. technologies. This legislation is expected to be signed by President Biden within the next few days.
IPC advocated strongly for the passage of legislation that would fund the CHIPS Act and urged Congress to include $2.5 billion in the first fiscal year for the National Advanced Packaging Manufacturing Program. IPC applauds both the Senate and the House for reaching an agreement and sending the bill to the President’s desk.
Given the importance of advanced packaging to our industry’s future, IPC is hosting an Advanced Packaging Symposium on October 11-12 at the Kimpton Monaco Hotel in Washington, D.C. Confirmed speakers include senior executives from leading electronics companies, including Intel, AMKOR, Skywater, Schweizer, TTM, Calumet, Northrop Grumman and SEMCO. The participation of senior government officials from the United States and Europe is also in the process of being confirmed. Register today!
Ken Schramko, Senior Director, North American Government Relations, IPC
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