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After years of trying to get the funding for the CHIPS Act passed via several different vehicles, the U.S. Congress acted quickly last week to approve a slimmed-down version of the competitiveness package formerly known as “USICA” and “America COMPETES” before the August recess. In the end, Congress passed the CHIPS and Science Act, the research and development legislation also referred to as “CHIPS Plus”, which includes more than $52 billion for U.S. companies that manufacture semiconductors as well as billions in tax credits to encourage investment in chip manufacturing. It also provides tens of billions of dollars to fund scientific research, innovation, and development of other U.S. technologies. This legislation is expected to be signed by President Biden within the next few days.
IPC advocated strongly for the passage of legislation that would fund the CHIPS Act and urged Congress to include $2.5 billion in the first fiscal year for the National Advanced Packaging Manufacturing Program. IPC applauds both the Senate and the House for reaching an agreement and sending the bill to the President’s desk.
Given the importance of advanced packaging to our industry’s future, IPC is hosting an Advanced Packaging Symposium on October 11-12 at the Kimpton Monaco Hotel in Washington, D.C. Confirmed speakers include senior executives from leading electronics companies, including Intel, AMKOR, Skywater, Schweizer, TTM, Calumet, Northrop Grumman and SEMCO. The participation of senior government officials from the United States and Europe is also in the process of being confirmed. Register today!
Ken Schramko, Senior Director, North American Government Relations, IPC
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