Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Pemtron Goes Public on KOSDAQ Stock Market
December 1, 2022 | Pemtron TechnologyEstimated reading time: 1 minute
Pemtron Technology, an inspection equipment developer and supplier, is pleased to announce that the company went public on the Korea Stock Exchange (KRX), effective November 24, 2022, under the ticker symbol: 168360:KS. The company plans to continuously expand policies to enhance shareholder value by supplying state-of-the-art products through continuous technology development and maximizing corporate profits.
Pemtron aims to become the unrivaled global No. 1 company in the field of inspection equipment based on state-of-the-art equipment equipped with the best hardware and software. Furthermore, the company continues to establish ethical management practices and creates and shares social values.
“On the semiconductor side, which has been growing recently, we plan to launch equipment for wafer pattern inspection in the mid-end process, wire bonding in the back-end process, MEMS automatic inspection, package automatic inspection and automatic memory module inspection,” stated YW Yoo, Pemtron CEO. “Some of this equipment is already contracted with leading global companies in Korea.”
Pemtron manufactures and sells 3D precision process inspection equipment in the SMT, semiconductor and secondary battery fields. Its equipment is based on inspection technology using 3D measurement and AI deep learning based on machine vision and image processing S/W technology using industrial high-speed camera images.
Primary product offerings include SMT inspection equipment that precisely measures the state of solder paste and mounted parts in the manufacturing process (SMT process) such as IT electronics and autonomous vehicles, as well as inspection equipment of semiconductor wafer, wire bonding, package, memory module, FC -BGA PCB circuit, secondary battery, etc.
The Korea Stock Exchange is a division of the much larger Korea Exchange (KRX or the Exchange). Previously, Korea’s stock market was a standalone entity. In 2005, the Korea Stock Exchange merged with the Korea Futures Exchange and the electronic market, KOSDAQ, to form the Korea Exchange. The exchange is the only securities exchange operator in South Korea, making markets in equities, bonds, stock index futures, stock index options, and equity options.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.