High-end Assembly Requirements for Precision Dispensing

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Dispensing is the cost-effective solution for repeatably placing precise amounts of underfills, encapsulants and sealants in otherwise inaccessible areas as packaging complexity inceases, particularly in the third dimension. Brian Chung sees mobile and wearable electronics as the drivers of the leading edge of precision dispensing technology.

Watch the interview here.

07/08/2020 | Nolan Johnson, PCB007

Robb Engle, executive VP of Sono-Tek, and Nolan Johnson discuss what the company has seen as far as supply chain challenges and changes to respond to in the past few months in response to COVID-19 and its related effects.

07/01/2020 | I-Connect007 Editorial Team

Chris Peters represents the U.S. Partnership for Assured Electronics, where he advocates for electronics manufacturing as a critical industry. Here, he describes the current status, the supply chain, and what he sees in Washington, D.C.

06/01/2020 | Pete Starkey, I-Connect007

iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.