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High-end Assembly Requirements for Precision Dispensing
March 18, 2015 | Real Time with...IPCEstimated reading time: Less than a minute

Dispensing is the cost-effective solution for repeatably placing precise amounts of underfills, encapsulants and sealants in otherwise inaccessible areas as packaging complexity inceases, particularly in the third dimension. Brian Chung sees mobile and wearable electronics as the drivers of the leading edge of precision dispensing technology.
Watch the interview here.
Suggested Items
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Murray Percival Company Welcomes CeTaQ to Its Line Card, Optimizing SMT Processes for PCB Manufacturers
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RBB’s Jeff Schartiger Appointed to SMTA Ohio Board as Technical Advisor
07/03/2025 | RBBRBB, a trusted leader in electronics manufacturing since 1973, is proud to announce that Jeff Schartiger, Operations Manager at RBB, has been appointed to the SMTA Ohio Chapter Board as a Technical Advisor.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
Eiyu Electronics Launches Pre-Assembled Module Product Line to Simplify Sourcing for Embedded Projects
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