Automation in Probe Testing Provides Throughput Benefits


Reading time ( words)

The general migration from grid to prober for bare board testing continues, and even high-volume users now see the benefits of automation. Klaus Koziol explains how package testing is driving prober development.

Watch the interview here.

Share




Suggested Items

Test and Inspection: Competitive Advantage and Cost of Doing Business

12/08/2021 | Nolan Johnson, I-Connect007
In this interview, Charlie Capers of Zentech breaks down the changing requirements he’s seeing in test and inspection in the industry, and the growing importance of investing in testing for the future growth and success of your company. According to Capers, "When you collect statistics on defects, you will start to see a trend that says, for example, we’ve got a lot of shorts and opens, meaning that our solder paste process is not tight. If you’re collecting statistics and really studying them, you will see trends in your processes."

Test and Inspection: Far Beyond Opens and Shorts

12/07/2021 | I-Connect007 Editorial Team
Gardien Vice President Todd Kolmodin talks about test and inspection market drivers from his perspective as a test service provider. Andy Shaughnessy and Happy Holden go down the “microvia rabbit hole” with Todd, as well as explore how OEM design requirements are driving test and inspection functionality and processes. When board layer counts and feature densities force longer test times, the tradeoffs to profitability for manufacturers become time and accuracy. Minimizing time while maximizing accuracy calls for new methods, which Kolmodin explains.

Alex Stepinski: A Philosophical View

11/30/2021 | I-Connect007 Editorial Team
"My philosophy is to rely more on sensors throughout the process to measure things non-destructively, then build a model for how you’re going to perform, and just validate against the model," said Alex Stepinski. "It’s the next step slowly happening worldwide. For instance, we’ve had 2D AOI for many years. Sometimes, this is complemented with electrical tests. Now, you start to see more 3D AOI happening. You see them putting more sensors on the AOI equipment for direct measurement. Then, you also have the traditional signal integrity testing."



Copyright © 2022 I-Connect007. All rights reserved.