Fourth Series of IPC Standards Committee Reports


Reading time ( words)

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports.

Data Generation and Transfer

The 2-16 Product Data Description (Laminar View) Subcommittee continued discussion of potential new requirements and possible changes to IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology. The group continues to work on development of user guides that show designers how to implement 2581 concepts in their transfer between design and manufacturing.

Supplier Declaration

The 2-18 Supplier Declaration Subcommittee did not meet due to conflicts in the chair’s schedule.

The 2-18b Materials Declaration Task Group discussed further enhancements to IPC-1752A Materials Declaration Management. The task group continues to work in concert with the IEC 62474 Materials Declaration Standards Group to ensure harmonization of the standards. The task group is in the process of organizing the annual solution provider review.

The 2-18j Laboratory Declaration Task Group is now looking at the next revisions of IPC-1753, Laboratory Report Declaration Standard. The standard allows for laboratory data to be seamlessly exchanged among supply chain partners.

Electronic Documentation Technology

The 2-40 Electronic Documentation Technology Committee and 2-41 Product Data Description Subcommittee discussed the IPC-261X series. Discussion included modifications to IPC-2611, Generic Requirements for Electronic Product Documentation, IPC-2612, Sectional Requirements for Electronic Diagramming Documentation and IPC-2612-1, Sectional Requirements for Electronic Diagramming Symbol Generation Methodology, as well as IPC-2614, Sectional Requirements for Board Fabrication Documentation.

Environment, Health, and Safety

The 4-30 Environmental, Health, and Safety Committee heard presentations and discussed several EHS issues impacting the electronics industry. The committee will help write the EHS section of the 2015-2016 IPC Roadmap. A presentation on the EICC Code of Conduct sparked good debate and discussion on what requirements may be seen in the future. IPC staff gave an update on their advocacy efforts on substance restrictions, both nationally and internationally. The presentations are available to IPC Members at www.ipc.org/ehs.

The 4-32 Equipment Safety Subcommittee discussed the continued efforts to develop a joint equipment safety standard with SEMI. Committee members present at the meeting discussed the need to move forward with a draft standard.

The 4-33 Halogen Free Laminate Materials Subcommittee was re-activated to try to provide both technical as well as financial information that helps prove the case of why tetrabrominated bis-phenol A should not be restricted any further as a flame retardant for printed board laminate.

The 4-34b Marking, Symbols and Labels for Identification of Assemblies, Components & Devices Task Group reviewed updates needed on J-STD-609A, IPC/JEDEC Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes, including adding references to the recast RoHS Directive and clarification that markings under this standard do not denote EU RoHS compliance or any other regional substance restriction legislation addressing lead content. The standard was intended to label PCB surface finishes, component terminal finishes, and attachment solders, as opposed to the lead used internal to the component.

Management

The 8-41 Technology Roadmap Subcommittee celebrated the publication of the 2015 IPC International Technology Roadmap for Electronic Interconnections. The roadmap represents two years of work by an international team and provides the vision and needs assessments of OEM, ODM, and EMS companies between now and 2015. In addition to discussing the newly published roadmap, the subcommittee also gathered comments on areas of improvement or need for the 2017 edition.

Intellectual Property

The E-21EMS Intellectual Property Subcommittee met to discuss the working draft version of IPC-1072, Intellectual Property Protection in Printed Board Manufacturing. Following the meeting, the document was to be distributed as a draft for industry review to generate feedback from industry and prepare a ballot document. The goal is to ballot the document by June and publish in fall or winter 2015. Changes made to this standard may be reflected in an amendment to IPC-1071A.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/03/2020 | Andy Shaughnessy, Design007 Magazine
The USMCA trade agreement was just the tip of the iceberg in news affecting our industry this week. We also saw more young people getting involved in the industry, an HDP User Group webinar on automotive thermal issues, and more questions for our own Happy Holden—this time, on stacked microvia reliability, or the lack thereof.

Materials for Automotive Applications: Thermal Management Issues

07/02/2020 | Pete Starkey, I-Connect007
For Pete Starkey, the highlight of the recent HDP User Group Automotive Technology Webinar was Alun Morgan’s presentation on materials for automotive applications. This forward-looking informational session covered the latest developments in automotive standards and automotive electronic packaging.

IPC: Shawn DuBravac and Chris Mitchell on USMCA

07/02/2020 | Nolan Johnson, I-Connect007
On July 1, 2020, the USMCA trade act (United States-Mexico-Canada Act) phased in as a trade agreement guiding economic trade and growth in North America. Nolan Johnson spoke with both Shawn DuBravac, IPC’s chief economist, and Chris Mitchell, IPC’s vice president of global government affairs and an I-Connect007 columnist, about the impact of USMCA on North American electronics manufacturing.



Copyright © 2020 I-Connect007. All rights reserved.