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Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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EIPC Speednews: News from the European PCB Industry
June 1, 2015 | EIPCEstimated reading time: Less than a minute

- AT&S goes for Ucamco's Ledia Direct Imager
- Huntsman is joining a research programme combining industry and academic expertise
- Your questions answered: Large Hadron Collider restart
- New Sales Manager at Viking Test Ltd
- ICT Annual Symposium, Black Country Museum, Dudley, 3rd June 2015
- IMAPS UK Advanced Packaging Workshop, 4th June 2015
- OLEDS as wallpaper
- Concrete solar wall
News from WECC members
- IPC Releases Market Research Report on Issues and Outlook for Lead-Free Electronics in Military and Aerospace Applications
- IPC Standards Committee Reports - Data Generation and Transfer, Supplier Declaration, Electronic Documentation, EHS, Management, Intellectual Property
Suggested Items
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
Eiyu Electronics Launches Pre-Assembled Module Product Line to Simplify Sourcing for Embedded Projects
07/02/2025 | BUSINESS WIREEiyu Electronics Co., Ltd., a Hong Kong-based electronic component trading company, today announced the official launch of its pre-assembled module product line, designed to help engineers and procurement teams save time when sourcing complex modular components.
Kitron Receives EUR 4 Million Contract for Defense Airborne Radar Application
07/02/2025 | KitronKitron has received an order valued at EUR 4 million to produce electronics modules for airborne radar application, destined for the US market.
Horizon Sales Celebrates 10 Years of Exceptional Service by Sales Leader David Smith
07/02/2025 | Horizon SalesHorizon Sales, a premier manufacturers’ representative and distributor for the electronics assembly industry, is proud to announce that David Smith is celebrating 10 years with the company this month.
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.