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Beyond Design: Slaying Signal Integrity Villains

09/17/2025 | Barry Olney -- Column: Beyond Design
High-speed PCB design is a balancing act, where subtle oversights can develop into major signal integrity nightmares. Some culprits lie dormant during early validation, only to reveal themselves later through workflow disruptions and elusive performance bottlenecks. Take crosstalk, for example. What begins as a stray signal coupling between traces can ripple through the design, ultimately destabilizing the power distribution network. Each of these troublemakers operates with signature tactics, but they also have well-known vulnerabilities.

Integrating Uniplate PLBCu6 With the Digital Factory Suite

09/12/2025 | Giovanni Obino and Andreas Schatz, MKS' Atotech
Printed circuit board manufacturing is rapidly changing, driven by miniaturization, stringent reliability requirements, and growing pressure for sustainable production. Meeting these challenges requires more than incremental improvements; it demands a combination of precise equipment and real-time process intelligence. The pairing of Uniplate® PLBCu6 with the Digital Factory Suite (DFS) demonstrates how hardware and software can work together to create more responsive, resource-efficient manufacturing.

Connect the Dots: How to Avoid Five Common Causes of Board Failure

09/04/2025 | Matt Stevenson -- Column: Connect the Dots
Boards fail for various reasons, and because I’ve been part of the PCB industry for a long time, I’ve seen most of the reasons for failure. As part of my ongoing crusade to help designers design for the reality of manufacturing, here are five common causes for board failure and how to avoid them.

Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs

08/27/2025 | Michael Carano -- Column: Trouble in Your Tank
To quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons. 

The Knowledge Base: Cultivating Your Brand in the Age of Connection

08/19/2025 | Mike Konrad -- Column: The Knowledge Base
Audiences have evolved in how they consume information, form opinions, and make purchasing decisions. While marketing still relies on tried-and-true methods—get your name and message in front of your audience—you must also cultivate connection, credibility, and community. Your customers, particularly the younger generation of engineers, buyers, and program managers, want to discover value on their terms.
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