The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Bay Area Circuits Selects Seica Flying-Probe PCB Test System
June 23, 2015 | Zero Defects InternationalEstimated reading time: 1 minute
Bay Area Circuits, Inc. has purchased a Rapid 270 bare-board tester as announced by Seica Inc's sales representative in Northwestern USA, Zero Defects International. This tester will augment a Seica S240 fully automated tester which has been in use at Bay Area Circuits for the past four years. The Rapid 270 vertical system is equipped with 8 independent measurement probes enabling high speed testing and was delivered to Bay Area Circuits pre-configured for full automation functionality.
“The performance and reliability of our existing Seica S240 were key factors in selecting the Seica 270 to expand our testing capabilities,” said Stephen Garcia, President of Bay Area Circuits. “Both Seica and Zero Defects have provided us with an outstanding level of service and support over the years and we look forward to continuing our relationship with them both.”
About Bay Area Circuits
Bay Area Circuits was founded more than 40 years ago and has continued to prosper by meeting and exceeding the quick turn printed circuit board needs of customers in Silicon Valley and beyond. The company has also developed higher levels of technology and logistical methods which gives it an edge in a very competitive marketplace.
About Seica Inc.
Seica Inc. is a subsidiary of SeicaSpA, a leading Italian manufacturer of printed circuit board assembly (PCBA) test equipment as well as bare-board testers. Seica Inc. has achieved major success in the sale of both types of this equipment in the USA, Canada and Mexico.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
HT Global Circuits Adds Two atg Luther & Maelzer Flying Probe Test Systems
10/15/2025 | atg Luther & Maelzer GmbHAtg Luther & Maelzer GmbH, a leading supplier of electrical testing solutions for the PCB industry, and IEC USA, a distributor of consumables, equipment, and services in the North American PCB market, confirm the order for high-speed bare board testing technology.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Green Circuits Boosts Midwest Presence with New Regional Sales Manager Ray Ponder
10/08/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced the appointment of Ray Ponder as Regional Sales Manager for the Midwest region.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.