ZESTRON Intros New Enhanced Maintenance Cleaner, VIGON RC 303


Reading time ( words)

ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions for the electronics industry, is pleased to introduce VIGON RC 303, a new water-based cleaning agent specifically developed for the removal of baked-on fluxes in reflow ovens and wave solder systems. It also removes re-condensed fluxes and emissions from condensation traps and heat exchangers.

VIGONRC 303’s new formulation offers improved cleaning across a wide range of lead-free and lead-based solders and reduced VOC emissions. VIGONRC 303 does not have a flashpoint, therefore it can be directly applied to warm surfaces as well as safely operated in wave solder systems. This environmentally friendly cleaning agent is available in a 1 liter spray bottle, as well as 5, 25 and 200 liter containers.

For more information on ZESTRON’s complete maintenance cleaning process solutions, please email infousa@zestron.com or visit www.zestron.com. Our expert team is available to provide comprehensive solutions to your cleaning needs.

About ZESTRON:

Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide technical centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.

 

Share

Print


Suggested Items

Advancement of SPI Tools to Support Industry 4.0 and Package Scaling

08/06/2019 | A. Prasad, L. Pymento, S.R. Aravamudhan, and C. Periasamy, Intel Corp.
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.



Copyright © 2019 I-Connect007. All rights reserved.