The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Taiyo Announces New Director & COO at Taiyo America, Inc. Facility in Nevada
July 22, 2015 | Taiyo AmericaEstimated reading time: Less than a minute
Taiyo America, Inc. announced that the company has promoted Tadahiko Hanada to Director & COO, effective July 1, 2015.
Mr. Hanada earned a B.S. degree in physics from Kyoto University in Japan and started his career as a researcher of fiber optic devices at NEC Corporation in 1991.
Since then he has contributed to broad areas including R&D, Product Development, Design, Product Release, Marketing, Sales, Product Strategy, Product Planning for Telecommunications, Data Communication, Mobile Phones, as well as the Cloud Service industry.
Mr. Hanada joined TAIYO INK MFG. CO., LTD. in January 2014 as General Manager leading the IC Packaging Material business.
“Tadahiko Hanada is a great endowment to Taiyo America and I look forward to his valuable management of the Carson City facility”, said Kashima, Taiyo America’s President.
About Taiyo America, Inc.
Established 25 years ago TAIYO AMERICA, INC. is a subsidiary of TAIYO HOLDINGS CO., LTD., the world's leading manufacturer of specialty inks and solder masks for printed circuit boards. Taiyo offers conductive inks for manufacturing printed electronics, solar cells and other applications. For more information, visit www.taiyo-america.com.
Melanie Wylie Binzel
775.885.9959, ext. 139
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.