Park Electrochemical Promotes DiGaudio to VP of Marketing Technology


Reading time ( words)

Park Electrochemical Corp. announced the promotion of Anthony W. DiGaudio to the position of Vice President of Marketing Technology. Mr. DiGaudio will continue to report to Christopher T. Mastrogiacomo, the President and Chief Operating Officer of Park Electrochemical Corp.

Mr. DiGaudio originally joined Park Electrochemical Corp. in May 2002 as Product Director and was promoted to Vice President of Quality in May 2004, Vice President of Sales in June 2005, Vice President of Sales and Marketing in June 2006, Vice President of Sales and Marketing – Asia and Europe in September 2009, Vice President of Sales and Marketing – Asia in January 2010 and Vice President of Global Marketing in November 2014. Prior to joining Park, Mr. DiGaudio had over eight years of technical and customer interface experience. For several years prior to joining Park, he was Technical Manager for Metro Circuits, Division of PJC Technologies, Inc. in Rochester, New York. Mr. DiGaudio received a Bachelor of Science degree in Ceramic Engineering from Alfred University in 1993.

About Park Electrochemical Corp.

Park Electrochemical Corp. is a global advanced materials company which develops and manufactures high-technology digital and RF/microwave printed circuit materials principally for the telecommunications and internet infrastructure and high-end computing markets and advanced composite materials, parts and assemblies and low-volume tooling for the aerospace markets. Park’s core capabilities are in the areas of polymer chemistry formulation and coating technology. The Company’s manufacturing facilities are located in Singapore, France, Kansas, Arizona and California. The Company also maintains R & D facilities in Arizona, Kansas and Singapore.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/26/2021 | Andy Shaughnessy, Design007 Magazine
This week, we have a round-up of stories from around the industry, including a Real Time with… IPC APEX EXPO interview with Ventec, an article by Tamara Jovanovic about eliminating “garbage in, garbage out,” a review of an EIPC webinar by Pete Starkey, and news about another trade show going virtual this summer. And last but certainly not least, we bring you our one-minute video salute to all the fantastic people in this industry who we’ve worked with for decades. Enjoy!

Bonding Hybrid Multilayer Constructions at Rogers Corporation

03/10/2021 | Real Time with...IPC
John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing. SpeedWave is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.

Focus on Smart Processes, Not Just Smart Factories

03/02/2021 | Nolan Johnson, PCB007
Nolan Johnson talks to Audra Thurston, Todd Brassard, and Meredith LaBeau about how Calumet is focusing on smart processes, and not as much on smart factories. While modern manufacturing equipment and next-gen technologies can be impressive, so much innovation still hinges on human beings. Calumet believes by investing in their workforce and instilling a culture of innovation throughout their company and supply chain, they’ll see faster advancement.



Copyright © 2021 I-Connect007. All rights reserved.