-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Ventec’s Martin Cotton to Present Paper on PCB Design Process at SMART Group European Conference
September 7, 2015 | Ventec EuropeEstimated reading time: 1 minute

Ventec Europe, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, today announced that Martin Cotton, Director OEM Technology, will present a paper entitled 'Making the right decisions at the right time in the PCB design process' at the 2015 SMART Group European Conference & Exhibition. The conference will be held on the 22-23rd September at the National Physical Laboratory (NPL), one of the UK’s leading science and research facilities, located in Teddington, London.
In PCB design, a key decision influencing the process and the eventual outcomes (quality, yield, cost) is the selection of material, particularly when the PCB in question requires significant performance parameters to be met. Martin's presentation will highlight the processes that lead to successful design and will explore how errors can be avoided that lead to risk, potential problems and compromises.
Martin commented: 'Over two days, The SMART Group Conference & Exhibition offers delegates and key suppliers of materials, equipment and testing services the opportunity to meet, network and discuss the latest industry developments and trends. Ventec and the SMART Group have a strong history together and we are excited about our participation at this year's European Conference.'
For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.ventec-europe.com.
About Ventec Europe
Ventec Europe is a member of the Ventec International Group and a world leader in the production of high quality and high performance copper clad laminates and prepregs, with full R&D and product development capabilities. With two fully equipped service centers in the UK and Germany, Ventec Europe is ideally set up to service the needs of the European PCB manufacturing industry providing quality products, reliable engineering support, on time delivery and quick-turn production.
For more information, visit www.ventec-europe.com, or use the Ventec app.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.