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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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i3 Electronics Wins Prototype Opportunity
September 10, 2015 | i3 ElectronicsEstimated reading time: Less than a minute
i3 Electronics, Inc. announced today that it has earned the opportunity from an industry leading technology/computing company for the development and manufacture of advanced substrates utilizing embedded component technology. The product will be used in the company’s next generation communications devices.
“i3’s substrate technology is second-to-none in the industry. Our expertise in fabricating substrates with embedded components provides a reduction in size, weight and power (SWaP) which enables us to support our customers in ways our competition cannot,” said Dale Kersten, Executive Vice President and Chief Business Officer at i3 Electronics.
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of design and fabrication of printed circuit boards and advanced semiconductor packaging, high speed laminates, advanced assembly, reliability and signal integrity reliability labs, high speed back plane & press fit assembly, and flexible electronics & assembly. i3 product lines meet the needs of markets including defense and aerospace, communications and computing, industrial and medical, where highly reliable products built in robust manufacturing operations are critical for success.
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