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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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i3 Electronics to Exhibit at SC15
November 4, 2015 | i3 ElectronicsEstimated reading time: Less than a minute
i3 Electronics, Inc. (i3) will be exhibiting at SC15, which will be held at the Austin Convention Center in Austin, Texas November 16-19.
“i3 Electronics is a world-class supplier of high performance computing design and manufacturing services. Exhibiting at this show is essential for us as a means of showcasing our technology and expertise”, stated Dale Kersten, Executive Vice President and Chief Business Officer at i3 Electronics.
- “High Performance Compute Cluster Constructed With High Density Rigid-Flex Based Modules” from 4:00-4:30 PM on 11/17 in 12AB
i3 will be in booth #2802
About i3 Electronics
i3 Electronics, Inc., with headquarters in Endicott, NY, is a vertically integrated provider of high performance electronic solutions consisting of: design and fabrication of printed circuit boards & advanced semiconductor packaging; high speed laminate expertise; advanced assembly services; reliability & signal integrity reliability lab services; high speed back plane & press fit assembly; and flex, rigid-flex & 2.5 & 3D die assembly. i3 product lines meet the needs of markets including aerospace & defense, medical, high performance computing, industrial, telecom, semiconductor & test and alternative energy, where highly reliable products built in robust manufacturing operations are critical for success.
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