Dan's Biz Bookshelf: 'Move Your Bus'
Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Orbotech to Showcase its Nuvogo 1000 DI and Sprint 200 Solutions at productronica
November 10, 2015 | OrbotechEstimated reading time: 1 minute
At productornica this week, ORBOTECH LTD is exhibiting its recently launched, high accuracy Nuvogo™ 1000 Direct Imaging (DI) system which significantly enhances quality, production throughput and TCO and Sprint 200, the fast, high precision PCB legend inkjet printer.
Orbotech’s Nuvogo 1000 DI solution brings high accuracy and fast throughput to demanding patterning, solder mask and flex solder mask applications. Utilizing a high-power laser and Orbotech’s unique MultiWave Laser Technology, the Nuvogo 1000 delivers small undercut and excellent side walls. The high depth-of-focus achieved by field-proven Orbotech Large Scan Optics (LSO) technology ensures unmatched quality on the most challenging surface topographies. The system also offers advanced scaling modes for high precision registration, and a dual table mechanism to optimize imaging time.
When describing the Nuvogo 1000, Albert Angel, General Manager of Lab Circuits, a Spanish PCB manufacturer specializing in Quick Turnaround (QTA), said “With the Nuvogo 1000, our throughput increased by more than 65% on solder mask applications while maintaining the desired level of quality. Since one shift was eliminated, we also achieved significant cost savings.”
Powered by Orbotech DotStream Pro Technology, the new Sprint 200 delivers cost-effective, top quality industrial legend inkjet printing. It enables consistently accurate high volume production of even the most advanced legend designs on a wide range of substrate thicknesses and types, including rigid or flex. The Sprint 200 achieves close to 90% one-pass production coverage, significantly more than other leading solutions.
“Orbotech has always been committed to bringing innovative, cost-effective, high-quality solutions to Europe’s PCB manufacturers,” said Hadar Himmelman, Orbotech West President. “At Productronica 2015, our new Nuvogo 1000 DI and Sprint 200 Inkjet systems further demonstrate this commitment.“
Orbotech will also show other state-of-the-art PCB production solutions including the Fusion 22 Automated Optical Inspection (AOI) system and Frontline PCB Solutions’ CAM and Engineering software at Productronica show in Munich, Hall B1, Booth #321.
About Orbotech Ltd.
Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device is produced using Orbotech technology. For more information, visit www.orbotech.com
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.