Lockheed Martin Persistent Threat Detection System Team Wins Aviation Week Award
November 23, 2015 | Lockheed MartinEstimated reading time: 1 minute
The Lockheed Martin Persistent Threat Detection System (PTDS) team was presented a 2015 Aviation Week Program Excellence Award for its role in sustaining the U.S. Army PTDS system.
PTDS is an Army aerostat-based system that serves as the U.S. Army’s “eyes in the sky” – leveraging advanced sensors to provide intelligence, surveillance, reconnaissance and communications in support of forward-deployed troops.
“PTDS has saved countless lives through its capability to identify threats, track insurgents, and enhance overall readiness for the men and women in theater,” said Dr. Rob Smith, vice president of C4ISR for Lockheed Martin. "We’re honored by this award and the role we play supporting our troops. We have an exceptional partner – the U.S. Army.”
Aviation Week presented the award to the PTDS team in the “System Level Sustainment” category.
Since 2004, Lockheed Martin has supplied, sustained and operated PTDS aerostats that have been deployed by the U.S. Army to help protect coalition forces overseas. Providing panoramic 24/7 surveillance in extremely challenging weather, PTDS offers a persistent surveillance mission capability not possible with manned and unmanned aircraft which encounter flight-time limitations dictated by fuel consumption and payload capacity. With the troop drawdown, more of the systems are becoming available for other mission areas. In 2014, Lockheed Martin worked with the U.S. Army to deliver PTDS operations to the Department of Homeland Security for border security in the southern United States.
“PTDS was named one of the Army’s “Greatest Inventions of 2005” by the Department of the Army Engineers and Scientists” said Paula Hartley, vice president of Advance Product Solutions for Lockheed Martin. “Since then, PTDS has repeatedly proven its mission value while continuously improving affordability through operational efficiencies and reduced cycle time.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).