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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Missed productronica 2015? Visit the New 'From the Show' site.
December 23, 2015 | I-Connect007Estimated reading time: Less than a minute
If you missed the productronica 2015 show, don't worry! I-Connect007 has comprehensive coverage of this long-running industry event, including in-depth interviews with some of the industry's top engineers, technologists and management.
We have just launched our From the Show website, which features articles and video interviews that we captured during our visit to productronica 2015. You will also find the photos we took of this event at this comprehensive site. In all, we captured 20 audio interviews that we have transcribed and are still in the process of publishing. Keep checking back for more updated content in the weeks ahead!
Click here for our From the Show site.
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Simon Khesin - Schmoll MaschinenSuggested Items
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.
A 60-Year Legacy of PCB Innovation from IEC
04/17/2026 | Real Time with... APEX EXPOChris Hrusovsky, director of business development for International Electronic Components (IEC), shares his company’s commitment to customer partnerships, seamless service, and technical support for fabricators. Chris updates us on technological advancements in direct imaging, copper-filled vias, and the company's global collaborations driving innovation in consumables and equipment.
Indium Faces Complex Soldering Head On
04/17/2026 | Real Time with... APEX EXPOKevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.
The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
Take the Mic: Smart and Flexible SMT Solutions from Essemtec
04/03/2026 | Real Time with... APEX EXPOEssemtec is known for naturally adaptive machines inspired by nature and designed for advanced HDI as well as package substrate manufacturing. Pierre-Jean Cancalon discusses new 2K dispensing and high-speed solder paste jetting technologies, perfect for NPI prototyping and flexible production environments.