Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Ventec International Group and TMT Trading Announce Intention to Merge
January 4, 2016 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group, a world leader in the production of polyimide and high reliability epoxy laminates and prepregs, announced the intention to merge with TMT Trading GmbH, a leading distributor of PCB base-materials including consumables and flex- and rigid-flex circuit board materials. The intention to merge was officially announced today and is expected to take effect in early 2016.
The management of Ventec International, headquartered in Suzhou, China, and TMT Trading GmbH, headquartered in Kirchheimbolanden, Germany, announced today that they have entered into discussions to merge TMT with the Ventec International Group. The merger is planned for early 2016. Until that time, both companies will remain fully independent entities and business will continue as usual.
The merger will widen Ventec’s product offering to include complementary products such as back-up, entry & routing materials, foils, clean room products and coatings, offering a one-stop-shop for customers of laminates and PCB base materials.
Tony Lau, Ventec International Group’s CEO commented: “Our combined company will be in a stronger position for continued growth over the long term. We will have enhanced product offerings, allowing us to better serve our global clients, as well as the opportunity to attract new customers and expand into new niche markets.”
Thomas Michels, CEO of TMT and Managing Director of Ventec Central Europe added: “TMT has been working in partnership with Ventec for a number of years. A merger is a natural progression in the relationship, which will greatly benefit both our customer bases through the synergies our partnership bring.”
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.
About TMT Trading GmbH
TMT Trading GmbH is a leading distributor of base-materials, laminates, drilling boards and other consumables for the manufacture of printed circuit boards for a diverse range of applications. TMT's global distribution network enables the supply to customers in all regions of the world. For more information, visit www.tmt-company.com.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.