-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Magnetically Aligned Novel ACA Revolutionizes 3D Chip Stacking
February 18, 2016 | Dr. S. Manian Ramkumar, Rochester Institute of TechnologyEstimated reading time: 1 minute
The use of anisotropic conductive adhesive (ACA) is not new within the electronics industry; however, drop-in replacements don't exist for lead-based and lead-free solder assemblies. Current ACAs require pressure and sequential assembly of components. Sunray Scientific's Novel ACA (ZTACH) is an excellent drop-in ACA replacement that will revolutionize the packaging industry and make electronic products more sustainable and green. ZTACH has been proven to enable the use of existing SMT equipment, lower the processing temperatures (75–150°C), and also eliminate the need to apply pressure, thereby eliminating the need to invest in new equipment and processes and reducing energy consumption.
ZTACH is composed of conductive, ferromagnetic particles in an epoxy matrix, which is printed or dispensed on the individual pads or the entire footprint of the components. The material is cured in a reflow oven, after all components are in place, in the presence of a magnetic field. The magnetic field aligns the conductive particles in the Z-axis direction, during curing, thereby eliminating the need for pressure. The formation of conductive columns within the adhesive matrix during cure provides a very high insulation resistance between adjacent conductors and also eliminates the need for precise printing or dispensing of adhesives onto individual fine pitch pads. Modification of the filler size and filler proportion enables control of the column density, column spacing and the required contact pad area for minimum resistance. ZTACH can be mass cured, eliminating the need for sequential component assembly. The formation of many parallel columns especially with micron and sub-micron sized particles between mating pads reduces the resistance considerably.
Editor's Note: This article originally appeared in the February 2016 issue of SMT Magazine.
Suggested Items
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.
TE Connectivity Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/09/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that TE Connectivity has finalized the purchase of a Pulsar solderability testing system.