Magnetically Aligned Novel ACA Revolutionizes 3D Chip Stacking

Reading time ( words)

The use of anisotropic conductive adhesive (ACA) is not new within the electronics industry; however, drop-in replacements don't exist for lead-based and lead-free solder assemblies. Current ACAs require pressure and sequential assembly of components. Sunray Scientific's Novel ACA (ZTACH) is an excellent drop-in ACA replacement that will revolutionize the packaging industry and make electronic products more sustainable and green. ZTACH has been proven to enable the use of existing SMT equipment, lower the processing temperatures (75–150°C), and also eliminate the need to apply pressure, thereby eliminating the need to invest in new equipment and processes and reducing energy consumption.

ZTACH is composed of conductive, ferromagnetic particles in an epoxy matrix, which is printed or dispensed on the individual pads or the entire footprint of the components. The material is cured in a reflow oven, after all components are in place, in the presence of a magnetic field. The magnetic field aligns the conductive particles in the Z-axis direction, during curing, thereby eliminating the need for pressure. The formation of conductive columns within the adhesive matrix during cure provides a very high insulation resistance between adjacent conductors and also eliminates the need for precise printing or dispensing of adhesives onto individual fine pitch pads. Modification of the filler size and filler proportion enables control of the column density, column spacing and the required contact pad area for minimum resistance. ZTACH can be mass cured, eliminating the need for sequential component assembly. The formation of many parallel columns especially with micron and sub-micron sized particles between mating pads reduces the resistance considerably.

Read The Full Article Here

Editor's Note: This article originally appeared in the February 2016 issue of SMT Magazine.

01/20/2021 | Nolan Johnson, I-Connect007

Nolan Johnson gets an update from Tom Forsythe on KYZEN’s Tech 2 Tech sessions. These brief 15-minute sessions were set up during the pandemic by KYZEN for customers, prospects, and new engineers around cleaning, and have since found traction with their manufacturers, reps and distributors.

01/04/2021 | I-Connect007 Editorial Team

X=Xc – 1 is a conceptual equation for continuous improvement. You define X and work to reduce it by a factor of 1. This could be one work hour, one process step, one day less in a cycle, and so on. We recently met with Dr. Ron Lasky to discuss the concept of X=Xc – 1 and get his advice on generating enthusiasm among readers and the next generation about continuous improvement. As this discussion illustrates, many process improvements are small in scale, not yearlong, major efforts.

12/31/2020 | I-Connect007

As 2020 comes to a close, the I-Connect007 Editorial Team takes a look back at its most read articles. Here are the top 10 reads in SMT from the past year.