Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
3D Printing of PCBs: 'Forward Thinking' Nano Dimension to Present at IPC APEX 2016
March 1, 2016 | Business WireEstimated reading time: 1 minute
Nano Dimension will be a featured presenter at IPC APEX EXPO 2016, which is taking place March 13-17 in Las Vegas. The company, which is focused on the intersection of 3D printing and electronics, is sure to be a big draw at the premier event for the printed circuit board (PCB) and electronics manufacturing industry.
Simon Fried, Nano Dimension’s co-founder and chief business officer, will present, “What happens when 3D printing and conductive inks converge?” at 10am and 4:30pm on Wednesday, March 16.
The theme of IPC APEX EXPO 2016 is “Forward Thinking for Tomorrow’s Technology,” and it is a perfect fit for Nano Dimension. In recent months, the company has created enormous excitement for its DragonFly 2020 3D Printer, which is the world’s first desktop-sized 3D printer designed specifically for the production of professional multilayer PCBs.
The capability of rapidly producing functional multilayer PCB prototypes using 3D printing is new to the printed electronics design and manufacturing industry. Nano Dimension’s DragonFly 2020 3D Printer will allow users to build functional, multilayer circuit board prototypes in-house – in a matter of hours.
Nano Dimension is meeting an important need in the electronics industry for faster and more efficient innovation. The company combines patented 3D printing hardware, advanced software and advanced nanoparticle inks, offering a complete solution for professional printed electronics.
About Nano Dimension
Nano Dimension, founded in 2012, focuses on the development of advanced 3D printed electronics systems. Nano Dimension's unique products combine three advanced technologies: 3D inkjet, 3D software and nanomaterials. The company's primary products include the first 3D printer dedicated to printing multilayer PCBs (printed circuit boards) and advanced nanotechnology-based conductive and dielectric inks.
Share on:
Suggested Items
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
Eiyu Electronics Launches Pre-Assembled Module Product Line to Simplify Sourcing for Embedded Projects
07/02/2025 | BUSINESS WIREEiyu Electronics Co., Ltd., a Hong Kong-based electronic component trading company, today announced the official launch of its pre-assembled module product line, designed to help engineers and procurement teams save time when sourcing complex modular components.
Kitron Receives EUR 4 Million Contract for Defense Airborne Radar Application
07/02/2025 | KitronKitron has received an order valued at EUR 4 million to produce electronics modules for airborne radar application, destined for the US market.
Horizon Sales Celebrates 10 Years of Exceptional Service by Sales Leader David Smith
07/02/2025 | Horizon SalesHorizon Sales, a premier manufacturers’ representative and distributor for the electronics assembly industry, is proud to announce that David Smith is celebrating 10 years with the company this month.
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.