Orbotech Launches Nuvogo Fine at JPCA 2016


Reading time ( words)

ORBOTECH LTD. today launched the Nuvogo Fine at JPCA 2016 in Tokyo, Japan. The Nuvogo Fine is specifically designed for new production methods and technologies, in particular for advanced high density interconnect (HDI), including modified semi-additive process (mSAP) and flexible printed circuits (FPC) at exceptionally high throughput on all types of resists. As the industry continues to move towards thinner, smarter and smaller devices and existing production technologies are reaching their limits, new production processes such as mSAP are enabling the high-volume manufacture of ultra-fine resolution printed circuit boards (PCB) to achieve superior imaging quality. This next-generation solution is designed to enable this process as the PCB manufacturing industry adapts to mSAP to tackle these upcoming challenges.

"As the industry moves toward wearables and smartphones with increasingly thinner form factors and higher functionality, HDI manufacturing processes must adapt in order to support this demand," said Arik Gordon, Corporate Vice President and President of Orbotech's PCB Division. "Orbotech's quick response time to these changing dynamics, ensures our ability to stay at the forefront of PCB manufacturing. The Nuvogo Fine provides exceptional precision to support today's advanced designs with streamlined production processes. This winning combination will, in turn, ensure that our customers stay ahead of the competition and answer designers' needs with fast throughput, increased yield and lower total cost of ownership."

About the Nuvogo Fine 

The Nuvogo Fine is driven by Orbotech's proven state-of-the-art optics, mechanics and electronics. Capable of providing a line width of 10μm and yields of up to 5500 panels per production line, per day, the solution offers exceptionally fast panel production speeds, accelerating time-to-market while enabling a very low cost-per-print.

With its dual table, the Nuvogo Fine is able to print in advanced scaling modes with nearly no loss of throughput.  The system is built to streamline and optimize high volume PCB production of extremely dense designs, offering advanced quality and efficiency features.  In addition, the Nuvogo Fine boosts registration accuracy enabling the high precision stacking of microvias.

Enabling Industry Leading Precision with Exceptional Yield 

Powered by Orbotech's MultiWave Laser Technology™ and Large Scan Optics Technology™ (LSO), the Nuvogo Fine offers precision line quality and pattern uniformity without sacrificing production speed. The field-proven LSO technology enables line structure and uniformity with exceptional depth-of-focus (DoF) using a single panel scan, ensuring superior results even on the most challenging of topologies. The MultiWave Laser Technology™ produces sharper edge patterns and maximizes flexibility by matching any resist to fit all practices. The adaptable multi-wavelength laser offers superior uniformity of in-line structure quality.

Orbotech's advanced manufacturing technologies provide PCB manufacturers with the precision and accuracy needed for the fast growing electronic devices industry. The Company remains focused on the need to maintain exceptional throughput and yield to ensure manufacturers' profitability and to satisfy end user requirements for fast time-to-market.

The Nuvogo Fine is now available to customers worldwide.

About Orbotech Ltd. 

Orbotech Ltd. (NASDAQ: ORBK) is a global innovator of enabling technologies used in the manufacture of the world's most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device in the world is produced using Orbotech systems.

Share

Print


Suggested Items

2020 EIPC Winter Conference, Day 1

03/09/2020 | Pete Starkey, I-Connect007
Pete Starkey recaps how the 2020 EIPC Winter Conference, held in mid-February, attracted around 90 delegates from a dozen European countries—as well as a few from North America—to an outstanding learning and networking experience for members of the PCB community. The theme of this year's event was: “The Needs for Next-Generation Electronic Devices and Changes in Fabrication Solutions for PCBs, PCBAs, Materials, and Technologies.”

Meet Sharon Cohen, I-Connect007 Columnist

02/21/2020 | I-Connect007 Editorial Team
Meet Sharon Cohen, one of our newest I-Connect007 columnists! Sharon’s columns will share Orbotech’s expert knowledge on how to maximize the value of manufacturing systems. Mr. Sharon Cohen is the president of Orbotech West, where he is responsible for the PCB division’s organization in North America and EMEA (Europe, Middle East, and Africa).

EIPC Summer Conference 2019, Day 2

09/12/2019 | Alun Morgan, EIPC
In this article, EIPC Chairman Alun Morgan provides the highlights of the second day of the EIPC 2019 Summer Conference, which was held in the beautiful city of Leoben in central Austria. He also talks about key points of the numerous technical presentation at the conference.



Copyright © 2020 I-Connect007. All rights reserved.