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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

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The rapid growth of demand for AI semiconductors is driving the evolution of advanced packaging technologies, with Fan-Out Panel-Level Packaging (FOPLP) emerging as a new battleground across the industry.

EPTAC: The ‘Ivy League’ of High-tech Training

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It’s been an exciting time for EPTAC, an IPC training and certification center based in Salem, New Hampshire, which recently opened a new state-of-the-art training facility to much fanfare. To help celebrate this accomplishment, we spoke with some key individuals who tell the story of what truly makes EPTAC successful. For over 35 years, EPTAC has built a reputation as a leading provider of IPC training and certification for the electronics manufacturing industry.

Smart Automation: When Traditional Depaneling Methods Reach Their Limits

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The Hidden Enabler of Autonomous Warfare: Advanced PCB Technologies Behind Defense AI

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Follow the Story: The Chemistry Behind PCB Fabrication

06/16/2026 | I-Connect007 Editorial Team
Many of the decisions that shape reliability, yield, sustainability, and cost happen long before a board reaches final inspection. The choice of metallization process, surface finish, water treatment strategy, or etching approach can significantly impact manufacturing outcomes. Here are four articles worth revisiting that tackle different aspects of the same conversation: the chemistry and processes behind modern PCB manufacturing.
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