Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets

07/08/2026 | Vern Solberg -- Column: Designer's Notebook
The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects. Passive surface mount components are relatively small, while the packaged semiconductor die is significantly larger than the tiny die element it encases. The plastic-packaged semiconductor, although suitable for use on PCBs, is far too bulky for those developing electronics that require miniaturization: new product introduction systems for physically stressful operating conditions, such as aeronautics, military ordinance, and space missions.

Building Better HDI Boards: Driving Quality Through Lamination

06/29/2026 | Marcy LaRont, I-Connect007 Magazine
All4-PCB, a technology-focused supplier serving the PCB, IC substrate, chemical milling, and LTCC markets, works with manufacturers across North America to deliver equipment, materials, and process solutions that address the lamination challenges of HDI, advanced packaging, and complex multilayer designs. Under the leadership of Managing Director Ralph Jacobo, the company has continued expanding its support for advanced electronics manufacturing operations.

Renesas Promotes Gaurang Shah to Senior Vice President

06/26/2026 | Renesas
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that Gaurang Shah will be promoted to Senior Vice President, effective July 1, 2026.

KYZEN’s Rueda and Bivens to Present at Parts Cleaning Conference 2026

06/25/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announced that Fernando Rueda, KYZEN’s Global Product Line Director – Industrial, and Beth Bivins, KYZEN’s Global Product Line Manager - Solvents will each present at the 2026 Parts Cleaning Conference scheduled to take place Tuesday, July 7, 2026, at the Hilton Columbus Downtown in Columbus, OH.

Balancing Performance, Cost, and Reliability When Selecting a Cleaning Machine

06/24/2026 | Vladimir Sitko, PBT Works
Even the most advanced cleaning chemistry requires an effective delivery system, so selecting the appropriate cleaning machine is crucial. Cleaning equipment must do far more than simply wash boards. As assemblies move toward lower standoff heights, finer pitches, and increasingly complex geometries, the equipment must deliver chemistry into confined spaces, reliably remove contamination, rinse thoroughly, and dry completely, all while balancing throughput, operating costs, and long-term reliability requirements.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in