FEATURED NEWS AND INFORMATION:

Latest News

UK Enterprises Step Up Intelligent Automation Projects as Brexit, Pandemic Pose Long-Term Business Challenges
03/05/2021 | Business Wire
Molybdenum Disulfide Ushers in Era of Post-Silicon Photonics
03/05/2021 | MIPT
Quantum Building Blocks
03/05/2021 | ORNL
New I-007eBook Highlights SMT Inspection: Today, Tomorrow, and Beyond
03/05/2021 | I-Connect007
IDTechEx Explores Thermoelectric Perpetual Submarine
03/04/2021 | PRNewswire
EMD Performance Materials Boosts Investments, Changes Name to EMD Electronics
03/04/2021 | PRNewswire
Crestone Services Group Acquires Diversified Solutions
03/04/2021 | PRNewswire
Future of Hyperconnectivity Offers Billion-dollar Opportunities in Connected Living Ecosystem
03/04/2021 | PRNewswire
X-86m2, F-86: New SATA III Portfolio with 3D-NAND from Swissbit
03/04/2021 | Swissbit AG
LG Innotek Develops First Automotive Wi-Fi 6E Module
03/03/2021 | PRNewswire
FEATURED ARTICLES AND COLUMNS:

Headset Advisor: Can You Hear Me Now?

February 15, 2021 | I-Connect007 Editorial Team

Dan Feinberg and Nolan Johnson recently spoke with David Merritt of Headset Advisor, a company that specializes in supplying headsets to businesses and call centers of all sizes. They discuss the company’s business model, how the pandemic has affected their business, and how the needs of employees have changed in the past year.

CES 2021 Coverage: A Virtual Show Floor

January 17, 2021 | Dan Feinberg, Technology Editor, I-Connect007

I write this on the final day of CES 2021, and I expect CES will never be the same. It will not revert back to what it once was. I also cannot imagine it stays a totally virtual show; in doing so, I feel it would fail. Does that mean I think the 2021 show was a failure? No, not at all. In fact, it was a very good event, particularly in light of the medical and political pandemic that we have been enduring.

My View from CES 2021: Day 1

January 12, 2021 | Dan Feinberg, Technology Editor, I-Connect007

What a difference a year makes. One year ago, those of us who cover and attend CES were going from one press conference to the next; this year, we are at home going from link to link. Confusing and challenging, yes, but there are some advantages: no masks, only five steps to get to a restroom, being able to have three of four events or more displaying on your screens at the same time and being able to download press kits as needed. So far, many new devices are being introduced, but of course, they are all online, so you wonder if some of them really exist or are truly operational as yet.

More news...


Smart Processes Featuring:

  • Smart Is Not a Binary Concept by Michael Ford
  • What Makes a Good Process Engineer? Interview with Tuan Tran
  • Coming Out Ahead With Smart Processes Interview with Tim Rodgers
  • PCB Sourcing Using PCQR2 by Al Block, Naji Norder and Chris Joran
  • Hailo-8 AI Processor Targets Small Factory Applications Interview with Liran Bar
  • IPC CFX Update v1.3 by Michael Ford
  • Do You Have a CPIM? by Barry Matties

Get Smart About Your Processes Featuring:

  • Join Us for IPC APEX EXPO–Virtually by John Mitchell
  • Ebullient Trade Events Going Virtual by Jennie Hwang
  • Tech Program Interview with Matt Kelly and Chris Jorgensen
  • Managers Forum Interview with Gene Weiner
  • Here We Go (Virtual) Again by Eric Camden
  • Membership Has Its Benefits Interview with Brian Knier ­­­
  • IPC Education Foundation Update and Looking Ahead by Charlene Gunter du Plessis

Footprints and Library Management Featuring:

  • Best Practices for Footprint Design and CAD Library Management, a conversation with John Watson, CID
  • Footprint Design Techniques: Don’t Trust Datasheets, a conversation with Tom Hausherr, CID+
  • Managing Footprints with Integrated EDA Tools, by Matt Walsh, Siemens EDA
  • A Library Management Cautionary Tale, by Stephen V. Chavez, CID+
  • Circuit Material Library Considerations, by John Coonrod
  • The Case for Expansive Parts Libraries, by Bob Tise
  • Footprints—Small Steps with a Giant Impact, Kelly Dack, CID+
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