FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

Vertical Conductive Structures, Part 4: Tuning Your Signal Performance

November 18, 2019 | Joan Tourné, NextGIn Technology BV

The objective of this article is to demonstrate the possibility of using a stitching element as an alternative to the point-to-point connections that are used with traditional via technology. Point-to-point connections have the best performance in terms of signal integrity (one via less in the connection that distorts the signal). A via is mainly a capacitive element that causes signal loss/ dispersion.

Trouble in Your Tank: Via Hole Filling and Plugging, Part 2

November 15, 2019 | Michael Carano, RBP Chemical Technology

In my previous column, I presented several options with which to accomplish blind and through-hole via filling. In this edition of “Trouble in Your Tank,” I will discuss filling blind vias and through-holes with polymeric pastes.





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It’s Only Common Sense: Treat Your Customers Like Prospects

November 18, 2019 | Dan Beaulieu, DB Management

After sharing a story from "Be Amazing or Go Home: Seven Customer Service Habits That Create Confidence With Everyone" by Shep Hyken, Dan Beaulieu advises readers to advise anyone who is serious about customer service to...

Flex Talk: Additive Electronics Momentum

November 14, 2019 | Tara Dunn, Omni PCB

I have been involved with additive electronics for the past several years, and I have seen the discussion of and demand for sub-75-micron feature sizes slowly grow. Conversations, questions, and research about SAP and mSAP increased...

One World, One Industry: Opportunities Abound for Learning at IPC

November 13, 2019 | John Mitchell, IPC--Association Connecting Electronics Industries

It’s fall, and students are heading back to school. Will you be joining them? IPC offers many opportunities for continuous learning, enabling you to enrich your career and increase your value to your...

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