Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.

In this issue of SMT007 Magazine, we explore some of the emerging soldering technologies: photonic, vacuum reflow and condensation soldering. And our columnists deep-dive into advanced packaging and international trade.

Features

• Advancing Photonic Soldering with Stan Farnsworth
• Overview of Soldering Systems With Vacuum by Dr. Paul Wild
• Book Excerpt: The Assembler’s Guide to Low-Temperature Soldering, Vol. 2

Article

• Working on a Personal Level at Stellar Technical Products with Mike Min

Columns

• Soldering Technologies by Nolan Johnson
• The Era of Advanced Packaging by Mike Konrad
• The Future of U.S.-China Collaborations by Tom Yang

Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?

Features

• The Rise (and Risk) of Data by Nolan Johnson
• Is It the Death of the Dashboard? with Tim Burke
• Cybord’s Accurate One-Two Punch with Oshri Cohen
• Data-driven Precision in PCBA Manufacturing by Julie Cliche-Dubois

Articles and Interviews

• Automating Test Processes in Modern PCBA Manufacturing by Josh Casper
• Advanced Packaging: Preparation Is Now with Matt Kelly and Devan Iyer
• Private Wireless Networks for Digital Transformation of Manufacturing by Aroon Tungare, et al

Columns

• What I’ve Learned About the American PCB Business by Tom Yang
• The Impact of Harsh Environments on Residue Tolerance by Mike Konrad

The distribution of counterfeit parts has become much more sophisticated in the past decade, and there is no reason to believe that trend is going to be stopping any time soon. What is the current state of counterfeit detection? What have we learned from past mistakes? What might we expect to see from the counterfeit channel in the future? What have we learned from past mistakes? What might we expect to see from the counterfeit channel in the future?

Features

• Battling Counterfeit Electronics in Manufacturing with Paul Jarski
• ERAI: The Counterfeit Watchdog with Rick Smith
• Counterfeit Concerns: Navigating the Risks with Diganta Das and Michael Azarian
• Combatting Advanced Techniques in Counterfeiting by Anthony Bryant

Feature Columns

• Deepfake Components by Nolan Johnson
• X-ray Everything! by Bill Cardoso

Columns

• The AI Era, Part 3: LLMs, SLMs, and Foundation Models by Dr. Jennie Hwang
• Comparing and Contrasting the U.S. and China PCB Industries by Tom Yang

Article

• Untapped Potential: Automating Warehouse Management Into the Present by Josh Casper

One ubiquitous component in PCB assembly is solder paste. It’s what makes assembly happen. We can’t attach components without solder, and solder paste is a requirement for surface-mount components.

It hardly seems like there’s much room for innovation in something so common and basic. Yet, much is changing when it comes to applying solder paste: dispensing and jetting evolve right along traditional stencil printing techniques. Each is carving out their own niche of specialization on the manufacturing floor. Of course, the solder paste needs are changing to enable that evolution in print technologies as well.

Come along as we dive into the latest in solder printing in the September 2024 issue of SMT007 Magazine.

Features

• Scrutinizing Solder Printing With Adam Murling and Ron Lasky
• The Pivotal Role of Solder Paste by Mike Konrad
• Mycronic’s Jet Set Technology With Wolfgang Heinecke
• Making Waves With Solder Jet Printing by Josh Casper
• Auguring in on Dispensing With Sunny Agarwal
• Solder Printing: A 1:1 Ratio of Technical and Creative by Nolan Johnson

Articles

• PCB Surface Topography and Copper Balancing Under Large Form Factor BGAs by Neil Hubble and Gary Briste
• Some Fundamentals of Tin-bismuth Metallurgy and Electromigration, by PJ Singh, et al.

Columns

• Our Strength Comes From Working Together by Tom Yang

One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally—so you can grow your business in the process and create a culture of thriving.

Features

• Thriving by Nolan Johnson
• From Surviving to Thriving by Mark Wolfe
• To Thrive, Surround Yourself With Good People by John Mitchell
• Why a Culture of Thriving Matters by Audrey McGuckin
• Enhancing Customer Loyalty and Product Quality by Mike Konrad
• Wriggling Out of ‘the Squeeze’ by Timothy McLean
• From Concept to Reality: Building Alpha Circuit with Prashant Patel

Technical Article

• Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle by Thomas Sanders, Seth Gordon, Reza Ghaffarian

Column

• The Nexus of Chinese and American Business Relations by Tom Yang

In the EMS industry, most certifications are administered within the industry, either internally within the company or through a third-party organization. This issue of SMT007 Magazine tackles the topic by examining the value of certification, where to get certified, and why it matters for both the employer and the employee.

Features

• Fueling Up With Certifications by Nolan Johnson
• The Importance of a Certification and Training Program with Revco Products
• Getting Clear About Certifications With Charlie Capers
• The Value of Industry Certifications by Mike Konrad
• Certificate vs. Certification: Achieving Your Organization’s Goals by Carlos Plaza
• Training and Education in the Electronics Industry by Tara Dunn
• Justin Worden: Success Through Knowledge
• Counterfeit Detection Course: It’s the Real Deal with Anthony Bryant

Article

• Innovative and Cost-effective BGA Re-balling by Shavi Spinzi

Columns

• A Dose of Wisdom by Dr. Jennie Hwang
• Bringing Two Cultures Together in PCB Manufacturing by Tom Yang

The basis of chaos theory is a key concept known as the “butterfly effect.” It’s the idea that a small event in one place (a butterfly flapping its wings in Spain) creates a cascading set of follow-on events that just might turn into a storm across Africa that becomes a hurricane striking Florida. The connections between cause and effect are not always obvious, but nevertheless are there—if you look for them. Again, choosing to look outward rather than inward.

What are some of those small changes bringing about big results? Come with us as we consider supply chain issues, workforce shortages, post-tariff and geopolitical shifts, and new opportunities in other countries.

This issue of SMT007 Magazine takes a closer look at the shifting EMS landscape and provides an insider’s view of what’s happening, and how to use these tips for your own company.

Features 

• The Changing EMS Landscape by Nolan Johnson
• Has It Really Been Survival Mode? by Mark Wolfe
• Where Is the China Business Going? with Jered Stoehr and Paul Forker
• Effectively Using Dashboards at Ascentron by David Hollingsworth
• Governments Struggle with Silicon-to-Systems Approach with Chris Mitchell
• New IPC Europe Report, Advocacy Campaign by Alison James
• The Difference Between Critical and Distracting Decision-making by Mike Konrad
• Diversifying PCB Manufacturing Through Nearshoring by Preeya Kuray

Extras 

• Audio Interview: Leveraging AI and Advanced Inspection Technologies with Brad Ward
• Solving Problems and Validating Excellence with Randy Cherry

In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.

Features

• Using AI to Redefine Productivity with Amin Arbabian, Anders Holden, Raj Vora, and Luis Vidal
• Empowering the Smart Factory Era With AI by Joel Scutchfield and Brent Fischthal
• A Glossary of Artificial Intelligence Terms
• Chiplet Architecture for AI Will Create New Demands for Assembly with Arvind Kumar
• The Rise of Collaborative Intelligence in Manufacturing by Jennifer Davis

Columns

• Coming To Terms With AI by Nolan Johnson
• The Transformative Role of AI and ML by Mike Konrad

Article

• High Temperature Component Warpage as a Function of Moisture by Neil Hubble

Keeping an existing customer is much easier than finding and winning a new one. But what do we do when our customers are looking for ways to localize or simplify their manufacturing chain? One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.

Features 

• Thinking Inside the Box for a Change interview with Joe O’Neil
• A CM’s Perspective on Box Build Practices by Mike Konrad
• Determining the Value-add of a Box Build interview with Jonathan Schmitz
• The Connection between Wire Harness and Box Build interview with Christina Rutherford

Articles 

• ADCO Circuits Case Study: From Inspection Skeptic to Innovative Enthusiast by Brent Fischthal 
• Tech Paper Excerpt: Analysis of Pull Force Test Results for Crimped Connections by Alvin Boutte, Alejandra Constante and Christopher Fitzgerald 
• Tech Paper Excerpt: The Brave New World of PCB Design Validation – Cloud-based DFM and Collaboration by Susan Kayesar

Columns 

• Do More, Get More by Nolan Johnson 
• AI Opportunities, Challenges and Possibilities by Dr. Jennie Hwang 

This month’s issue of SMT007 Magazine devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical, business, whether your experience level is new-to-the-industry or seasoned veteran, you will find value throughout the IPC APEX EXPO program.

IPC APEX EXPO 2024 Features

• Electronics Circuit World Convention: A Brief History by David Bergman
• Keynote Preview: Reshaping our Engagement With the World by Shawn DuBravac
• ECWC16 Technical Conference Special Sessions by Julia Gumminger
• Much Ado About Factory of the Future by Chris Jorgensen
• Women in Electronics Reception by Alicia Balonek
• EMS Roundtables: Leaders Helping Each Other by Glenna Carrell
• Professional Development: From AI to DFM by Julia Gumminger
• There's an App for That by Kim DiCianni
• Technical Conference: Innovation Communication by Nolan Johnson

Feature Columns

• The Time is Now by Nolan Johnson
• What’s Next Becomes Now by Dr. John Mitchell
• Dip Your Hand in the IPC APEX EXPO Candy Jar by Hannah Grace
• Mastering Trade Show Success for Exhibitors by Mike Konrad

Articles

• IPC Mourns Loss of Former Vice President of Industry Programs, Tony Hilvers
• Real Progress Toward Solving U.S. Workforce Problems interview with Cory Blalock

Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. What are the key steps to achieving that optimization? In this issue, we ask industry experts in marketing and sales for their best advice on how to turn the art of sales into a science.

Features

• Boost Your Sales by Nolan Johnson
• Sales and Marketing—Our Roundtable of Experts with Dan Beaulieu, Dan Feinberg, Barry Matties, Nolan Johnson, Marcy LaRont
• Effectively Conveying Your Brand—And Your Message by Barry Matties
• The Evolution of Conscious Marketing by Mike Konrad
• Relationship Selling Never Grows Old by Dan Feinberg
• Shifting From Prospect to Customer by Nolan Johnson
• Set Your CM Business on Fire by Dan Beaulieu

Columns

• The Journey Was Worth It by Ron Lasky

In this issue of SMT007 Magazine, we visit the rework processes, arguably one of the highest-skilled, highest-pressure jobs on the manufacturing floor. What is the cost to you in rework? Does it make sense to build your own team of experts in-house or contract it out to a rework specialist? What are the technical challenges? How is the rework job function being changed by new packaging technologies and increasing board densities? How will the skill sets for rework need to evolve? Doing the build right the first time is the best strategy, of course, but we can rarely be fully 100%. As we start 2024, let’s take a look at this critical piece of the assembly process.

Features

• A New Generation of AI AOI with Roberto Gatti
• The High Cost of Rework with Nash Bell, Dan Patten, and Laura Ripoli
• Cold Milling as an Alternative PCB Component Removal Method by Bob Wettermann
• Novel Automatic Repair of Populated PCBs in a Cost-effective and Adaptive Way by Irving Rodriguez
• Rework: A Perspective From the Source with Maria Mejias
• The Hanwha Future-proof Proposition with Jonny Nichols

Feature Columns

• The Cost of Rework by Nolan Johnson
• Mastering the Art of Reworking Circuit Assemblies by Mike Konrad
• Making Rework a Smart Business Opportunity by Michael Ford

Columns

• Critical Materials: A Compelling Case, Part 3 by Jennie Hwang
• ‘Blocking and Tackling’ During Tough Economic Times by John Mitchell
• A Lesson from Elon Musk’s Playbook by Ron Lasky

While many of you might well be into your fiscal year, we have a strong suspicion you’re constantly adjusting your “sails” to stay afloat in strong headwinds. This issue takes stock of the current economic outlook and how companies are using current conditions to move themselves through technological evolutions, workforce shifts, and financial changes. Even with these headwinds, there’s forward progress to be made.

Feature Interviews

• IPC Chief Economist’s Industry Forecast for 2024 with Shawn DuBravac
• Joe O’Neil Has More Optimism Than Concerns
• What’s Happening With Financing Solutions? with Amy Pine and Brian Carey
• Mil/Aero Gaining Altitude and Velocity at Axiom with Rob Rowland
• Here and Abroad, Governments Investing in Industry with Chris Mitchell and Rich Cappetto
• Overcoming the Growth Bottleneck with Charles Capers
• Cascade Systems Technology: The Confluence of Assembly and Advocacy with Shantanu Gupta
• Lightspeed Manufacturing Sees Company Growth in Industry Consolidation with Rich Breault

Columns

• Set Your Sails Properly by Nolan Johnson
• The Sustainability Gold Rush by Michael Ford
• The Pivotal Role of Optimization by Mike Konrad
• It’s Just One of Those Days by Ron Lasky

Special Coverage

• productronica 2023 Photo Gallery

To get different results in staffing, you must change how you define, promote and recruit your job opportunities. How do you become magnetic to high-quality early-career candidates? Industry research shows that employees are interested in manufacturing, but it has to have a purpose.

Features

• SEL’s Intentional K-12 Outreach Paying Off with John Cassleman
• Advice from High School Students with Rae Wetzel and Logan King
• A Unique Engineering Program in Mankato with Robert Sleezer
• Twin Cities Engineering: Student Engineers with Benjemin Redlin and Joey Stam
• Inside the Minds of Gen Z with Paige Fiet and Dylan Nguyen
• Hiring for Today’s Manufacturing with Hannah Nelson
• Building a Company Legacy Through Internship with Marisa Hemingway and EMa Freiberger
• Meet the New Workforce at IPS by Barry Matties

Columns

• Gen Z in Manufacturing by Nolan Johnson
• Today’s Manufacturing Jobs Require a New Skill Set by Michael Ford
• Truth Revealed, Balance Restored by Ron Lasky

Test and inspection methods are undergoing rapid change. In this issue, we consider the influence of AOI, AI, and human eyes. How exactly are these pieces of the puzzle changing the role of test and inspection?

The fundamental image processing technology that works for medical also works for industrial applications. Both application spaces–medical imaging, and test and inspection–benefit from the advances in vision and computing hardware. Predictive algorithms, such as AI engines, provide fewer false positives, more sophisticated capabilities, and perhaps most important of all, data—both raw and analyzed—for useful process feedback in the automated factory.

Features

• ‘Testing’ a Strategy interview with Raj Vora and Darren Carlson
• Using Test Strategies Simulation in Test and Inspection Workflow by Will Webb
• Smarter Design Means Smarter Test and Results interview with Bert Horner
• Collaborating to Develop AI-powered Smart Assembly Processes by Brent Fischthal

Feature Columns

• The Eyes Have It by Nolan Johnson
• AI: A Prelude to Opportunities, Challenges, and Possibilities by Jennie Hwang
• The Role of Automated Inspection by Mike Konrad

Article

• Closing the Inspection Gap: Enhancing Electronics Manufacturing Quality With Reflow Process Inspection by Miles Moreau

Columns

• Compose Yourself, Mr. Ford by Michael Ford
• The Big Reveal by Ron Lasky

In Europe and the U.S., legislation is under way to revitalize unified circuit manufacturing—PCB fabrication and packaging. To help make the most of this legislative work, industry advocates strive to make a difference by educating legislators and their staff on the electronics supply chain including the dire need for local substrate sources. Which gives rise to the rallying cry: “Chips Don’t Float!”

What is the status of this work as we approach the end of 2023, and how specifically does this change the industry landscape for EMS companies? What will all this mean to circuit assembly?

In this issue of SMT007 Magazine, we bring you a slice of the wide-ranging message industry advocates have been communicating on our behalf along with a special introduction to the upcoming 2023 SMTA International Conference and Exhibition.

Features

• CHIPS Act, One Year On interview with Travis Kelly
• A Catalyst for Advanced Packaging and Substrates interview with Kirk Thompson
• Bipartisan Legislation Reintroduced to Bring Electronics Manufacturing to America and Strengthen Supply Chains
• PCBs Garnering Legislative Support by Nolan Johnson
• Towards a Silicon to Solutions Industrial Strategy by Alison James
• Chips Act Priorities, Q&A with Matt Kelly
• Unlocking Synergies: The US CHIPS Act Propels Collaboration Between Semiconductor Manufacturers and Equipment Suppliers by Miles Moreau
• The End of Solder? interview with Andy Mackie

Feature Columns

• Chips Don’t Float by Nolan Johnson
• The Smart Business Case for Local PCB Manufacturing by Michael Ford

Special Coverage

• An Invitation from SMTA President Martin Anselm
• SMTA International 2023 Conference & Exposition General Information
• A Closer Look at SMTAI’s Technical Program by Mike Konrad
• Conference Program Highlights
• Women’s Leadership Program
• SMTAI Conference Schedule at a Glance

Regular Columnist

• What is the Profit Potential? by Ron Lasky

We’ve been accustomed to the idea of a digital twin in the OEM and design worlds, so why not a digital twin for your manufacturing processes? The opportunity to use manufacturing simulation as a test bed for job planning and process optimization brings continuous improvement into the modern age. This may be an all-or-nothing type of project, but it’s worth the investment.

Features

• Lockheed Martin: Flying High With Digital Twin with Don Kinard
• Drilling Down on Digital Twin with Phil Voglewede
• It All Starts With Sensors by Happy Holden
• The Vision: Virtual to Support Real Operations by Óscar Martins
• Manufacturing Digital Twin: Spanners in the Works by Michael Ford
• Digital Twin in Manufacturing by Nolan Johnson

Columns

• A Tale of Two Lawn Mowers by Dr. Ronald C. Lasky
• AI in the Electronics Manufacturing Space by Mike Konrad

Articles

• Manufacturing Isn’t Linear: Stop Planning That Way by Sylvain Perron
• Unveiling the Harsh Reality of Traceability Data by Eyal Weiss

In this issue, we (and AI) explored how and when artificial intelligence plays a role in manufacturing today. Whether on the factory floor, or in the front office, AI applications are emerging and changing how we approach planning, processes and problem solving.

Features

• The Turing Test by Nolan Johnson
• A Vision for Machine Learning in Optical Inspection interview with Sheldon Fernandez
• Machines, People, and AI by Michael Ford
• Advancing Automation interview with Philip Voglewede
• AI and the Company Strategy by Happy Holden

Columns

• Pearls of Wisdom by Dr. Jennie Hwang
• A ‘Cost of Ownership’ Project by Ron Lasky

Articles

• The IPC-CFX Train Is Approaching Your Station by Chris Jorgensen
• Driving Without a Map: Automotive OEMs Need Exploratory Traceability by Dr. Eyal Weiss

Sustainability is happening. Your organization either sees it as a cost of doing business, or an opportunity to improve overall business operations. So, how do we embrace this shift? How do we keep up—or ahead—so we don’t get swept to the side?

Thinking sustainably touches virtually every aspect of our lives, from how we conduct ourselves personally to how we conduct our businesses: Don’t use something unless you have to, design products that minimize raw materials, and reclaim the materials once you’re done with them—these are the new maxims for us all. We don’t need to be misers; we just need to be smarter about our usage.  

The big question is, “How do we get started?” In this issue of SMT007 Magazine, we take on that challenge. We asked several organizations either in the industry, or tangential to it, and as was expected, the responses lined up closely with their mission statements.

Sustainability is happening. Your organization either sees it as a cost of doing business, or an opportunity to improve overall business operations. So, how do we embrace this shift? How do we keep up—or ahead—so we don’t get swept to the side?

Features

• Getting Real About Sustainability by Nolan Johnson
• Why Does Sustainability Matter? with Kelly Scanlon
• Siemens Experts Introduce New Sustainability Podcast
• iNEMI Develops Tools for Sustainable Electronics by Mark Schaffer
• Is Sustainability in Manufacturing a Benefit or Burden? by Michael Ford
• The Role of ‘Sustainable’ Automation with Jeff Forster
• The Right to a Safe, Healthy Work Environment by Pamela Brody-Heine
• Finding Sustainability in Additive Processes by Art Wall
• Sustainably Clean with Tom Forsythe

Article

• Filling Critical Traceability Gaps with AI by Dr. Eyal Weiss

Columns

• Data Collection and Analysis by Mike Konrad
• A Solution to the Cost-Estimate Problem by Ron Lasky

Hiring the right employees is always a challenge, especially in today’s business environment where there are fewer technical experts in the candidate pool and a shortage of labor overall. Once you’ve hired someone, how do you get them up to speed quickly? In this issue, we look at skill training to maximize new hire effectiveness.

Features

• A Solid Training Ground in New Hampshire by Marc Carter
• Workforce Development and Networking Mindset by Tara Dunn
• Shopping for a Soldering Robot by Ed Zamborsky
• Training for New Hires by Brenda Clunie
• SMTA Process Engineer Certification by Ron Lasky
• Successful Skills Training by Sharon Montana-Beard

Columns

• Ready to Hire? by Nolan Johnson
• Building Reliable Electronics for Harsh Environments by Mike Konrad
• The Tale of the Cost-Estimate Problem by Ron Lasky

Interview

• Custom Is Never a Commodity with Bob Duke

Electronics manufacturing services face some key strategic opportunities to not only grow their businesses but also to advance the industry economically and technologically. In order do this effectively, the challenge is to collaborate as well as simultaneously compete. Cue the re-emergence of technical conferences as a forum for responding to the changing EMS landscape.

Features

• Why the EMS Leadership Summit Matters by Mark Wolfe
• A Complex and Contradictory Economic Outlook by Shawn DuBravac
• Trends in Supply Chain Dynamics by David Sharp
• Keep Your Foot on the Gas interview with Mike Slater
• Panel Discussion CMMC and Cybersecurity by Maribel Hernandez

Articles

• Bob Wettermann: Making the ‘BEST’ of His Career interview with Bob Wettermann and Nash Bell
• Immersion Tin Plating for QFN Wettable Flank Connections by Britta Schafsteller, Hubertus Mertens, Gustavo Ramos

Columns

• The Rise of the EMS Summit by Nolan Johnson
• The Role of Bismuth (Bi) in Electronics, Part 7: A Case Study in Fillet-lifting by Jennie Hwang
• Manufacturing: Meet the Flintstones by Michael Ford
• Package on Package Rework–Still Required by Bob Wettermann
• Calculating Operating Costs by Ron Lasky

In this issue, we deliver a wide-angle view of the industry–a perspective from a somewhat higher altitude–where we look for common areas of thought. Is there a “hive mind” to discover?

Many of you have shared with us the buzz–the vibration–of an industry in ascent. We’ve seen it, felt it, heard it at industry gatherings. There’s plenty for us to do, so the question becomes, what’s on everybody’s mind?

We took a higher-level perspective and asked that very question. To understand the general mindset, we conducted a series of interviews with EMS providers in order to gather a sense of how business is progressing. The result was frank and insightful commentary.

Now, our question to you is, does this match what’s on your mind?

Features

• The Manufacturer's Mindset by Nolan Johnson
  
• Five Issues Troubling EMS Companies by Mark Wolfe
• Schweitzer: Building Inner Strength interview with Frank Harrill, Jessi Hall and John Hendrickson
• Differentiation, Community, and Composability by Michael Ford
• Automation and Flexibility: The Essential Components for Future-thinking EMS Companies by Norihiro Koike
• Darwin AI: Evolving the Islands of Automation interview with Sheldon Fernandez
• The EMS ‘State of the Union’ by Mark Laing
• Finding Stability in the Supply Chain interview with Misha Govshteyn

More Content

• Special Session: eMobility/EV by Tracy Riggan
• Vayo Technology Continuously Brings Forth the New Through the Old interview with Howard Liu
• The Finishing Touch by Ron Lasky

Conferences and trade shows are valuable resources. Now that the 2022 trade show season has closed and IPC APEX EXPO 2023 is behind us, it’s time to make a strategic plan from all the pieces of information you’ve gathered for the year ahead.

Conferences and trade shows are valuable resources. Now that the 2022 trade show season has closed and IPC APEX EXPO 2023 is behind us, it’s time to make a strategic plan from all the pieces of information you’ve gathered for the year ahead.

On our cover, we showcase a mass of LEGO^® Bricks because it represents the pieces of separate bits of information gleaned from networking with other industry professionals that we must then assemble into a cohesive strategy afterward. For us engineer types, the compulsion to make order out of those bricks is very real. Turning your conference and trade show knowledge into action in the factory should feel just the same.

Feature Articles and Interviews

• Making the Most of Trade Show Leads by Barry Matties
• Alpha Takes the Greenfield Route with Prashant Patel, Steve Smith, and Steve Ryan
• Ten Expert Reasons to Walk a Trade Show by Dan Beaulieau
• Koh Young: Getting Equipment In-Line and Customers Online with Mitchell Kim, Brent Fischthal, and David Nemeth
• After the Show, Share What You’ve Learned with Kris Moyer

Columns

• The Trade Show Is Over: Now What Do You Do? by Nolan Johnson
• 2023’s Top Challenges in BGA Rework by Bob Wettermann?Slow and Steady is Still Progress by Ron Lasky

Interview

• Rocket EMS: Growing with Greenfield Sites with Michael Kottke

As semiconductor companies seek ways to prolong Moore's Law, new advanced component packaging techniques are moving the boundaries between printed circuit fabrication and semiconductor fabrication. What will be the impact on the EMS industry? In this issue, we open the discussion about how advanced packaging will change the structure of our industry.

Features

• The Nuts and Bolts of Advanced Packaging interview with Matt Kelly
• Advanced Packaging Beyond the Zetabyte Era by Tom Rucker
• Key Findings From Semiconductor Fabrication Research by IPC
• Integra Redefining Die Prep in the U.S. by Matt Bergeron
• Durability and Cost Benefits Drive Mil-Aero Demand for OCPP by Sam Sadri

Articles

• A CMMC ‘Plan B’ by Divyash Patel
• Real Time with... IPC — Top 5 Things Special Section

Columns

• Advanced Packaging by Nolan Johnson
• Creating a Better World Through Engineering by Jennie Hwang
• An Unblinkered View by Michael Ford
• Fair and Square by Ron Lasky

In this issue, we bring you preview information for IPC APEX EXPO 2023. In the spirit of helping to plan your time at this event, consider this issue your roadmap for success before you even cross the threshold onto the show floor at the San Diego Convention Center.

FEATURED CONTENT

• Let’s Get Technical by Julia Gumminger
• Standards Committees: Moving Faster, Working Better interview with Teresa Rowe
• STEM Program: Evolving and Growing by Charlene Gunter du Plessis
• Women In Electronics Reception by Alicia Balonek
• Next-level Professional Development by Julia Gumminger
• It’s All in the App by Kim DiCianni
• The First India Pavilion by Gaurab Majumdar
• Special Session Sneak Peek by Julia Gumminger

FEATURED COLUMNS

• Traditions: The Old and The New by Nolan Johnson
• Advance In a New Era by Dr. John Mitchell

SPECIAL APEX COVERAGE

• Reconnecting the Social Network by Alicia Balonek
• The Value of Training Committees by Zenaida Valianu
• Turn E-textiles Concepts into Real-World Products by Julia Gumminger
• Schedule of Events
• Show Floor Highlights
• 2023 COVID Guidelines

COLUMNS

• Eliminating Solder Balls in Hand Soldering by Bob Wettermann
• AIs Without Context Are Dumb by Michael Ford
• Charting the Path to Improvement by Ron Lasky

ARTICLES

• Launching IPC Community Magazine by Michelle Te
• Professional Development: Reflow Profiles Simplified by Rob Rowland

One of the most expressed struggles in electronics assembly today is the constant fluctuation of component availability. Don’t get us wrong; component availability is not the root cause, it’s simply the symptom that is the most obvious and painful at the moment. Workflow management is an ongoing challenge, a candidate for continuous improvement. Parts shortages may, however, cause EMS companies to look harder at processes that worked before, but don’t now.

In this issue, we look at just some of the challenges in navigating the maze of workflow management. We look for the new best practices emerging from EMS firms. How does one best protect from parts issues and scheduling changes? How do your new best practices stack up?

Features

• Laying It on the Line Interview with Jason Sciberras
• Your Shortage is Someone Else’s Excess by Chintan Sutaria
• Material Management and Control by Davina McDonnell
• Modern Inventory Management Secrets by Michael Ford

Feature Columns

• The Conveyor Belt Effect by Nolan Johnson
• Clinging to Best Practices in Worst-case Scenarios by Michael Ford

Special Coverage

• Advanced Packaging Symposium 2022 by Nolan Johnson
• Advanced Packaging Symposium Recap: A Real Conversation Starter with Matt Kelly and Jan Vardaman
• The ‘Intel’ on Advanced Packaging Options with Tom Rucker
• Working on the Hill to Build a Future with Will Marsh
• Trailblazing Substrates in PCB Fabrication with Todd Brassard
• The Critical Nature of High-Performance Computing with Dale McHerron

Columns

• Cybersecurity Requires an Active Approach by Jennie Hwang
• An ‘Engaging’ Conversation by Ron Lasky

Article

• Advanced Packaging Gets an Additive Upgrade by Art Wall

One of the best places to get back into the swing of trade shows is SMTA International (SMTAI), taking place Oct. 31–Nov. 4, in Minneapolis. The event is co-located with the four other shows that comprise the MD&M show. Besides providing an expo floor showcasing what’s new in the market, SMTAI also delivers one of the strongest technical conferences in the electronics manufacturing space. In response, we’re devoting this issue of SMT007 Magazine to pre-show coverage of SMTA International. One of our goals with this issue is to give attendees and exhibitors a detailed guide to the event. In addition, if you, or perhaps your supervisor, need some convincing as to why you should attend SMTAI this year, then this issue will help you make your case.

Features

• It’s an Exciting Time in Electronics by Sal Sparacino
• SMTAI: Packed With Content! interview with Martin Anselm
• Rob Boguski Interview: Hot on the Trail of SMTA
• Technical Conference: Trending on Topic by SMTA Staff
• Women’s Leadership Program: Technology Innovations and Career Advancement by Priyanka Dobriyal
• SMTA Members of Distinction Award Announced by Ryan Flaherty
• Time to Go ‘Exploring’ at SMTAI by Michelle Te

More Show Information

• Charging Forward: An EV Keynote Presentation
• Technical Program Schedule
• Conference at a Glance
• Infographic: Anatomy of a Trade Show
• Show Hours and General Information
• SMTAI Exhibitor List

Columns

• Have Passport, Will Travel, by Nolan Johnson
• Melancholy Endings and Exciting Beginnings by Ron Lasky

Our September issue examines the wider set of challenges currently in the supply chain. Managing one’s suppliers takes extra work and attention right now, but there are methods and solutions available.  There is light at the end of the tunnel, so to speak. The question is, are you taking advantage of as many of these methods and solutions as you should?

Features

• Finally, Some Good News About Supply Chain interview with Shawn DuBravac
• Four Silver Linings in the Stormy Clouds of Pandemic, Supply Chain, and Inflation by Ronald C. Lasky
• Breathing Room in Parts Supply interview with Chris Lentz and Joe Garcia
• Axiom Inspired by Industry Challenges by Michael Schindele
• The Critical Balance of Supply and Inventory Control interview with Foad Ghalili, Lillian Lin, Meghan Zou, and Crystal Zhang
• Altium’s EDDI Report Tracks Component Availability–Today and Historically interview with Dan Schoenfelder
• Infographic: Is There Light at the End of the Tunnel?

Feature Columns

• The Light at the End of the Tunnel by Nolan Johnson
• The Progress of Machine Intelligence by Michael Ford

Columns

• Tips for Today’s SMT Challenges by Chris Ellis
• Opening a Trace on the Surface of a PCB by Bob Wettermann
• Solving for ‘X’ by Ronald C. Lasky

After two years in survival mode, it’s time for electronics manufacturers to go on the offensive. Finding relief from pain points should be a mix of both strategic and tactical responses. In this issue, we examine a variety of steps being taken in the industry, from the halls of government to the manufacturing floor—all meant to relieve the pressure and move you forward.

Feature Interviews
Digi-Key Drilling Down on Counterfeit with Levy Olson and Kelsey Lawrence
Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
Printed Circuit Boards: Past the Lobby and Onto the Floor with U.S. Rep. B. Moore and T. Kelly

Feature Articles
A Framework for Managing Supply Chain Disruption by Chintan Sutaria
Thriving Through Greater EMS Collaboration by Christopher Peters

Columns
Supply ‘Pain’ Management by Nolan Johnson
In Search of Wisdom by Jennie Hwang
Soldering for QFP and Other Gull Wing Leaded Parts by Bob Wettermann
Teaching About Solder Paste by Dr. Ronald C. Lasky

Article
The CMMC 2.0 Countdown: Will You Be Ready When the Clock Hits Zero? By Divyash Patel

• Time to Get Serious About CMMC Readiness Interview with Divyash Patel
• Excerpt: Don’t Hit the Snooze on Cybersecurity by Divyash Patel
• Zombie Cars: The Next Pandemic Is Digital by Michael Ford
• How Important Is Trust? By Randy Cherry
• CMMC 2.0: Are You Ready? Interview with Ryan Bonner
• Business Email Compromise: The $43 Billion Scam an announcement from the FBI 
• The Virtual Via Drum by Mehul Dave
• Infographic: Mitigating Your Security Risks

• Balancing Talent and Procurement Challenges Interview with Ron Preston
• Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells by Narahari Pujari and Krithika PM 
• Opening New Opportunities in Mexico by Dave Hernandez 
• Breaking Down the Math by Dr. Ronald C. Lasky 
• Lean Digital Thread: The Secure Digital Thread by Zac Elliott 

While there’s a place for competition in the current market, collaboration is even more effective as a growth strategy. But when and how? Whether your goal is to expand capabilities without investing in a new facility, or encourage customer loyalty through purchasing convenience, the point is that collaboration and partnership can play a pivotal role in achieving those goals.

Features

• Partnership and Collaboration, Interview with Brigitte Lawrence, Christopher Kalmus, Jeff Brandman, and Dan Beaulieu
• Anaya Vardya: An Advocate for Great Partnerships A Compilation by the I-Connect007 Editorial Team
• What’s the Point of Collaboration? by Nolan Johnson

Articles

• Social Responsibility and Ethics in Manufacturing by Lea Maurel
• Mining for Metals Requires a Long View Interview with Shaun Dykes
• Clean Energy and Critical Minerals: The Dichotomy and Divergence by Noelle Lovern
• The Double-edged Sword of CMMC 2.0 by Divyash Patel

Columns

• Resourceful Solutions During Nationwide Shortages by Emmalee Gagnon
• Learning the Basics by Ron Lasky

The requirements for assembly continue to move toward smaller components and higher densities. But what are the challenges that accompany this steady shift? In a series of interviews, articles and columns, we learn what assemblers are really facing.
 
Features

• Exploring High Density With Axiom interview with Rob Rowland and Kevin Bennett
• ?Finding Solutions in the Quoting Process by Duane Benson ?
• The Data Format Effect on Business Costs interview with Rob Rowland and Kevin Bennett ?

Feature Columns

• Changing Expectations by Nolan Johnson
  
• Optimize Throughput: High-Mix, Low Volume Manufacturing by Emmalee Gagnon?
• Fractional Materials and High-Mix Manufacturing by Michael Ford

Interviews

• Automating the X-ray Inspection Process with Brennan Caissie
• KIC Adds Wave Monitoring Technology to Industry 4.0 Ecosystem for Thermal Processes with Miles Moreau ?

Columns

• Critical Materials—A Compelling Case, Part 2 by Jennie Hwang ?
• Take Your Assembly Skills to the Next Level by Ron Lasky 
• ?Reworking of SMT Connectors With Center Ground Connection by Bob Wettermann

Features 

• The Digital Factory Is Now Interview with Matt Kelly 
• How Smart Are You? by Michael Ford 
• The Future is Driven by Data Interview with Michael Kottke 
• The Journey to Your Smart Factory by Happy Holden 
• The Reality of Regulated Manufacturing Interview with Ryan Bonner 
• Big Data Can Bring Your Business Back by Zac Elliott 
• Are Your Existing Machines Enough to Keep Up? by Jennifer Davis 

• What Are We Waiting For? by Nolan Johnson 
• Has the Industry 4.0 Gold Rush Ended? by Michael Ford 
• What’s That Noise? Is It Your Data? by Bill Cardoso

• Improved Thermal Interface Materials (TIM) For Cooling High-Power Electronics by Jeff Brandman 
• Report and Verify by Ron Lasky 

Two high-profile pieces of legislation in the United States and Europe seek to encourage semiconductor capacity but leave out the equally important reliance on printed board fabrication and assembly. In this issue, we look at the state of the industry: What is being done about the supply chain? Will governments recognize what’s missing? And can the U.S. ever gain back what it once had?

Features

• A Hard Look at Strategic Chip Investment Interview with Jan Vardaman
• More Than a Supply Chain Problem by Nolan Johnson
• Lean on Me: A U.S.-Europe Partnership Interview with Alison James
• It’s Time for Government to Step Up to the Plate by Chris Mitchell
• M&A Activity: Keep Your Eye on the Ball Interview with Tom Kastner
• What Happens in Washington Happens to Us All by Travis Kelly
• The Legislative Chokepoint by Nolan Johnson

Real Time with… IPC Video Interviews

• A Global Collaboration with Sanjay Huprikar
• Advanced Packaging Report with Matt Kelly
• Update from PCBAA with Travis Kelly
• Advocacy in Washington with Chris Mitchell

An Interview and More Articles

• Dave Hillman on Living Your Passion
• How to Minimize Quote Time and Increase Accuracy in EMS Production by Mark Laing
• Where Have All the Board Shops Gone? by Stanley Bentley

Columns

• Our Introduction to the Electronics Industry by Paige Fiet and Hannah Nelson
• Solder Mask Repair Techniques for PCB Repair by Bob Wettermann
• CFX IIoT Open-Source Hardware by Michael Ford
• A Tale of Two Perspectives by Dr. Ronald C. Lasky

Rising input costs are causing EMS companies to rethink pricing, suppliers and supply chains, labor, and how all those interrelationships function. In this issue we report on the current status of increased input costs and explore strategies to help reduce the risk and cost associated with today's marketplace. 

• Alex Stepinski: Taking Control of Input Costs  
• Supply Chain’s Risky Behavior with Joe O’Neil 
• Going Global: Bridging Today’s Labor Gap with Foad Ghalili 

• Real-time Strategies to Offset Soaring Expenses by Nolan Johnson 
• Preparing the Next-gen Tech Workforce by Marc Carter 
• Feeling the Heat of Rising Input Costs by Nolan Johnson 
• Reduce Costs With In-House Production, Out-of-the-Box Thinking by Emmalee Gagnon 

• Critical Materials, a Compelling Case, Part 1 by Dr. Jennie S. Hwang 
• A Buying Strategy Primer by Dr. Ronald C. Lasky 

Just as with consumer goods, supply chain concerns can easily lead to counterfeiting issues in electronics manufacturing.?Meanwhile, cybersecurity is equally concerning. In this issue, we bring you several articles on cybersecurity, and we discuss what you need to know to leverage smart factory offerings to better manage supply chain and counterfeiting challenges.
 
Features

• Making the Most of a Smart Factory Initiative interview with Joel Scutchfield ?
• Every Cloud Has a Silver Lining by Dan Beaulieau ?
• Who Will Maintain Control of Global Chip Manufacturing? by Dan Feinberg ?
• ‘Trust Me–I Have Your Chips Right Here!’ by Michael Ford ?
• The Under-reported Story of the Semiconductor Shortage: Counterfeits by Bill Cardoso ?
• Sunstone Growing With Supply Chain Strategies interview with Mathew Stevenson, Kelly Atay, and Dawn DelCastillo ?
• Don’t Hit the Snooze on Cybersecurity by Divyash Patel ?
• The Impact of Obsolescence and Shortages on Counterfeit Risk by Vernon Densler ?
• Counterfeit Mitigation by In-line Deep Visual Inspection by Eyal Weiss ?
• Component Level Traceability in a Counterfeit World by David Mills ?

Columns

• The Bottom Line on Cybersecurity and Counterfeiting by Nolan Johnson ?
• Is There a Need for ESD Control in PCB Rework/Repair? by Bob Wettermann ?
• Can a Dirty Factory Be Fixed? by Ron Lasky ?

Article

• Getting the Most Out of IPC APEX EXPO 2022 by Dan Beaulieau ?

Special Section: IPC APEX EXPO 2022 on the Show Floor—Factory of the Future 

• Factory of the Future, Today With FactoryLogix Platform ?
• Working With Arch Systems’ ArchFX Manufacturing Excellence Platform ?
• KIC’s Action Plan for Factory of the Future ?
• Koh Young: Leveraging the IPC CFX Qualified Product List ?
• Yamaha Debuts One Stop Smart Solution

• John Mitchell: Focus on the Future  
• Technical Track Opportunities with Matt Kelly 
• STEM Program on the Grow with Charlene Gunter du Plessis 
• EMS Leadership Summit Expands its Reach with Tracy Riggan and Mark Wolfe 
• Industry Market Drivers, Inflation and the Supply Chain with Shawn DuBravac 
• IPC Standards Committees: Thoughts on a Changing Landscape with Teresa Rowe 
• Francisco Fourcade: Meeting During a Pandemic with Francisco Fourcade

• Keynotes Educate and Entertain Featuring David Pogue 
• Revving Up Design by Patrick Crawford 
• What to Expect Regarding COVID Restrictions by Alicia Balonek 
• The Value of Training Committees by Zenaida Vallanu 
• Jackie Mattox Keynotes Women in Electronics Reception by Alicia Balonek 
• Hey, Mr. DJ: Trivia Networking Night by Alicia Balonek

• Preparing for APEX: The 2022 Edition by Nolan Johnson 
• Digital Transcendence: Fear of the Unknown by Michael Ford 
• The Power of Pareto by Ronald C. Lasky

For this month’s issue, we spoke with the experts to see what’s currently going on with test and inspection. EMS companies have new options to consider in their inspection practices with the latest technologies and methods, along with AI and advancing data collection. We look at how new capabilities drive on-floor best practices, and how new manufacturing challenges are influencing equipment design.

Feature Interviews?

• Test Strategies and Pain Points with Bert Horner
• Where AI Meets Test and Inspection with Yan Manissadjian, Alexia Vey, and Jesse Dowd
• Market Changes Require Re-evaluating Your Testing Processes with Bob Neves
• Research and Development Leads to Biogreen Coatings with Phil Kinner
• Conformal Coatings and Legacy X-rays with Ed Moll
• Keysight’s Massively Parallel Board Test with Christopher Cain

Articles

• Three Pages That Changed the World (Kind Of) by Eric Camden
• Explore the Depths of Your Dispensing Process by Axel Lindloff, Heriberto Cuevas, and Brent A. Fischthal
• IPC-J-STD-001: The State of the Standard by Jonathon Vermillion

?
Columns

• Test and Inspection: Take a Good Look by Nolan Johnson
• The Costs of Legacy Thinking by Michael Ford
• New Feeder Design for Eliminating Errors Prior to Placement by Emmalee Gagnon
• Methods for Underfilled Component Rework by Bob Wettermann
• Taking a Team Approach by Dr. Ronald C. Lasky

Now more than ever, market drivers, technical advances, factory automation and customer demand are pushing assembly capabilities into new territory. With these advancements, comes the need to incorporate new equipment or even new facilities. In this issue, we investigate strategies and tactics for planning capital expenditures.

Features

• CapEx Planning With Summit Interconnect with John Vaughan, Greg Halvorson, and Brett McCoy
• Maximizing ROI and Usage of Test Equipment by Dirk de Waart
• Book Excerpt: Factory Automation–Planning and Implementing by Happy Holden
• Fane Friberg on Capital Expenditure Project Planning with Fane Friberg
• Perfecting the Application of Conformal Coatings Without a Capital Investment by Zsolt Pulai
• Financing Simplifies Process Improvement through Capital Expenditures by Emmalee Gagnon
• Increase Production Yield by Investing in Leading-Edge Equipment by Brent Fischthal

Columns

• CapEx Planning by Nolan Johnson
• Reliability Primer–A Pragmatic SMT Perspective by Jennie Hwang
• Flux and Cleaning—How Clean is Clean? Part 2 by Ray Prasad
• The Law of Exponential Profits by Ronald C. Lasky

Article

• Naprotek: Knowing Your Value and Maximizing It with Daniel Everitt

This month in SMT007 Magazine, we’re considering the bill of materials (BOMs) and the unique challenges facing procurement and manufacturing under current market conditions. Components are hard to find, which is a situation that starts the discussion, of course. But as we find in this issue, the role of the BOM is becoming even more influential as Industry 4.0 becomes more the norm. No longer can a design team short-cut the BOM process. Join us as we explore BOMs and their future role and discover the need to control all the complexity as the impetus to a creative new process in BOM management.

Features:

• The Bill Comes Due: BOMs and the Digital Twin Interview with Michael Ford
• A Multi-Tenant PLM Software Solution Interview with George Lewis
• Whizz is Da BOM Interview with Muhammad Irfan
• BOM Connector: A Ready-built Solution Interview with Kevin Decker-Weiss and Mark Laing
• BOMs and the Supply Chain From an Assembler’s Point of View Interview with Duane Benson
• Luminovo Cuts BOM Waste, Improves OEM/EMS Communication Interview with Sebastian Schaal

Articles

• Reducing the Cost of Solder Alloys Used in Wave and Selective Soldering Assembly Applications by Mitch Holtzer
• A Conversation With Javad EMS Interview with Gary Walker

Columns:

• BOM: The Path to Managing Parts by Nolan Johnson
• Making Progress on Uptime by Ron Lasky
• X-Ray Imaging and BGA Work by Bob Wettermann

We hope that his issue will help define some of the communication gaps and needs between PCB designers and electronic manufacturing services. Our interviews and articles highlight the tools and methods that help to bridge the gaps in the communication channel.

Features

• A Deep Dive into Digital Twin Interview with Michael Ford
• EMS/Designer Relationships: Building Communication Interview with John Vaughan and Kelly Dack
• Communicating Effectively with EMS Providers by Charles Capers
• We Must Talk to Each Other by Dan Beaulieu
• The EMS/Designer Relationship: Kelly’s Story Interview with Kelly Dack

Articles

• How to Get Started With IIoT by David Turbide
• Catching Up With the Latest at Datest Interview with Rod Boguski
• Factors Affecting Quality of Solder Joints in Multi-Busbar Connection by Narahari Pujari

Columns

• The Designer to EMS Communication Process by Nolan Johnson
• A How-To Guide: Avoiding Pitfalls When Purchasing SMT Equipment by Emmalee Gagnon
• What is Your Uptime? by Ron Lasky

In this issue we look at the key contributing factors that affect reliability challenges on your manufacturing floor. We help you run the gamut from specifications and standards to assembly and testing. And because reliability ultimately boils down to the solder joint, this issue includes details on the latest thinking on cleanliness, solder joints, industry standards, and more.

Features

• Cleanliness Behind Many Assembly Challenges Interview with Eric Camden
• The Meaning of (PCB) Life by Bob Neves
• Ductility is Your Greatest 'Alloy'—Avoiding Drop Shock by Ranjit Pandher
• How to Troubleshoot Your Testing Processes by Graham Naisbitt
• IPC-WP-019: The How to Behind the Cleanliness Requirements in IPC J-STD-001G by Debora Obitz

Featured Columns

• Hands-off Manufacturing by Michael Ford
• Flux and Cleaning—How Clean is Clean? Part 1 by Ray Prasad
• Cleaning of ‘No Clean’ Fluxes in PCB Rework by Bob Wettermann

Articles

• Get Your Industry 4.0 Here! IPC-CFX Momentum Builds by Dave Bergman
• Conformal Coating Evaluation Test Development by Prabjit Singh and Larry Palmer
• From the Archives: Karl's Tech Talk—Visiting Photochemical Machining by Karl Dietz

Columns

• Reliability by Nolan Johnson
• Digital Manufacturing—Just-in-Case or Just-in-Time by Jennie Hwang
• Maggie Benson’s Journey: SMT Process Optimization by Ron Lasky

One key factor to a strong, reliable, successful solder joint is ensuring the right conditioning of the surfaces to be soldered. Then, once the solder joints are in place, protecting those joints from environmental stresses is crucial. In this issue, we investigate the current state of cleaning and coating as forms of surface preparation and protection.

Features

• Surface Prep vs. Cleaning Interview with Tom Forsythe
• The State of the Coating Industry by Phil Kinner
• Cleaning and Inspection by Graham Naisbitt
• Cleaning and Coating Webinar Highlights by Phil Kinner

Articles

• Failure Analysis Cases Studies on Solder De-Wetting for Electronics Products by Jasbir Bath, et. al
• ICAPE Group Offers Boots on the Ground Support in Asia Interview with Roger Harts
• Joe D’Ambrisi Discusses MacDermid Alpha Acquisition of HK Wentworth Interview with Joe D’Ambrisi
• A Framework for Large-Scale AI-Assisted Quality Inspection Implementation in Manufacturing Using Edge Computing by Feng Xue, et. al

Columns

• If It Don’t Stink... by Nolan Johnson
• Maggie Benson’s Journey: Making the Announcement by Ron Lasky
• Security is Key by Imran Valiani
• It’s Pronounced ‘Tooling Hole’ by Chris Young

In this important issue, we work to raise the awareness of 3,000 volunteers working IPC committees, and the value they bring to the industry. We bring you status reports from key committees, along with trends the committees are identifying, as well as a historical perspective of past achievements.

We just can’t seem to keep the supply chain out of the news, now can we?

In this issue, we once again take a firm hold on the supply chain. We investigate how to manage the reliability and the quality coming from your supply chain. We question typical thinking about suppliers and criteria for success, and we ask what sort of skills your supply chain manager should possess.

After navigating through the content in this issue, you should be able to throw another loop of chain around the capstan and deliver more meaningful leverage to keep your own supply chain from going sideways.

In this issue of SMT007 Magazine we invite you to put on your “thinking cap” of exploration into smart processes in assembly. First, we ask, “What is a smart process?” We also look wider and deeper at smart processes, including the value of a chief process improvement manager (CPIM) in your organization. We consider just how smart and optimized procurement practices can positively affect more than simply finding the lowest prices. We also bring you a recent technical paper on PCQR², and we discuss the role process engineering has on the profitability of your business.

Think we’re done? Not yet. Our columnists explore UL certification, how IoT is changing how we design boards, salvaging valuable components for reuse, and counterfeit components. Plus, we include a short overview of control theory for deeper smart process background. 

So, put on your “thinking cap” and join us!

Features

• Smart Is Not a Binary Concept by Michael Ford
• What Makes a Good Process Engineer? Interview with Tuan Tran
• Coming Out Ahead With Smart Processes Interview with Tim Rodgers
• PCB Sourcing Using PCQR² by Al Block, Naji Norder and Chris Joran
• Hailo-8 AI Processor Targets Small Factory Applications Interview with Liran Bar
• IPC CFX Update v1.3 by Michael Ford
• Do You Have a CPIM? by Barry Matties
• Smart Processes and Continuous Improvement Seminars at IPC APEX EXPO
• IPC APEX EXPO 2021 Schedule of Events
• A Short Overview of Control Theory by Martin Tarr

Columns

• Who’s Feeling the Pinch in a Smart Process by Nolan Johnson
• Achieving Operational Excellence Is a ‘Must Have’ by Sagi Reuven
• IPC-2231A–Insights from the IPC 1-14 DFX Subcommittee by Patrick Crawford
• The Dark Side of the Chip Shortage–Counterfeits by Bill Cardoso
• UL Certification for the Safety of PCBs by Jeffrey Beauchamp
• IoT Is Changing How We Design PCBs by Sunstone Circuits
• Salvaging Components for Other Uses by Bob Wettermann

Article

• A Library Management Cautionary Tale by Stephen Chavez

Imagine, if you will, an IPC APEX EXPO without a physical venue. Join your colleagues as we all journey into “The Virtual Zone.” We also include highlights from the recent virtual edition of the CES 2021 show.

Features IPC APEX EXPO 2021 Preview

• Join Us for IPC APEX EXPO–Virtually by Dr. John Mitchell
• Ebullient Trade Events Going Virtual by Jenny Hwang
• Tech Program Preview Interview with Matt Kelly and Chris Jorgensen
• Schedule at a Glance
• Making the Most of a Virtual Event Interview with Alicia Balonek
• Managers Forum Preview Interview with Gene Weiner
• Managers Forum Schedule
• Here We Go (Virtual) Again by Eric Camden
• Membership Benefits Interview with Brian Knier

Real Time with... IPC APEX EXPO VIRTUAL: The Top Five Things You Need to Know About...

• Solder Masks by Taiyo America
• Direct Imaging by Burkle North America
• Manufacturing Training by Blackfox Training Institute
• Moisture Management by Super Dry Totech

CES 2021 Special Coverage

• A Virtual Show Floor by Dan Feinberg
• Kick-off Keynote: 5G as the Framework of the 21^st Century by Pete Starkey
• New Innovations at CES: Fluo Labs Light-based Allergy Treatment Interview with Jan Enemaerke
• CES Overview by Happy Holden
• Pepcom: A Show Within a Show by Nolan Johnson

Columns

• IPC APEX EXPO and CES: The Virtual Zone by Nolan Johnson
• Strengthen Your Design Transfer Process with Agile NPI by Alfred Macha
• IPC Education Foundation Update and Looking Ahead by Charlene Gunter du Plessis

Continuous improvement not only can improve the targeted process, but often results in additional hidden benefits. Moreover, continuous improvement need not be a large project; numerous small improvements can snowball into large gains.

As we start the new year—what we are calling the year of continuous improvement—it’s a good time to start with the simple process improvement formula: X = X_c – 1. When you look at any current process (X_c), the question you want to ask (and have your coworkers ask) is, “How can we reduce (X_c) by (1)?” It could be one day, one hour, one minute, one less piece of material, one less percent of scrap, one less form to fill out, or it could even be lowering a risk factor or other even less tangible things. By reducing (X_c) by (1) we now have a new (X) and the process starts over.

The tricky part can be deciding what to choose for your first (X). In the early phases of process improvement, the common advice is to start with small improvement projects and grow from there. By doing so, you and your team will be able to feel and celebrate the success and benefits gained.

Features

• Continuous Improvement: As Simple as X = X_c – 1 Interview with Ron Lasky
• Your Greatest Competition is Yourself by Barry Matties
• 2021: The Year of X = X_c – 1 by Nolan Johnson
• 5 Keys to Smart Process Success by Steve Williams
• The Skilled Worker by Leo Lambert

Columns

• X = X_c – 1: A Year of Continuous Improvement by Nolan Johnson
• Is U.S. Production Ready for Advanced Medical Devices? by Zulki Khan
• How to Audit OEM-EMS Assembly Capability, Part 3 by Ray Prasad
• Fixing Vertical Hole Fill in Plated Holes by Bob Wettermann
• 2020 M&A Wrap Up by Tom Kastner

Technical Article

• Building a Better, Brighter LED Headlamp by Glenn Farris

Even in our skilled, technology-heavy industry, some entry-level manufacturing positions seem to turn over as rapidly as the drive wheels of a locomotive. You can, however, stop the churn-and-burn approach and start recruiting young, well-trained employees more likely to stay put. How, exactly? That’s what this issue is all about.

As the wise conductor on The Polar Express says, "One thing about trains: It doesn't matter where they're goin'. What matters is deciding to get on."

It's time to start believing in the process of hiring and training for the long haul.

Features

• Lorain County Community Colleges’ Successful MEMS Program Interview with Johnny Vanderford and Courtney Tenhover
• IPC Addresses Critical Industry Skills Gaps With Electronics Workforce Training by Dave Hernandez and Carlos Plaza
• Training Is Hard, But It’s Also Soft by Jahr Turchen
• Happy’s Essential Skills: Recruiting and Interviewing by Happy Holden

Feature Columns

• Hiring and Training by Nolan Johnson
• Put Your Operators in the Driver’s Seat by Eric Camden
• Redefine Recruiting to Attract and Hire the Right Talent by Alfred Macha
• Changing Roles in the Digital Factory by Michael Ford

Articles

• High-Density PCB Technology Assessment for Space Applications by Maarten Cauwe, et al.
• High-Tech, High-Value Cleaning Answers Made Easy With KYZEN’s Tech-2-Tech by Pete Starkey

The role of test and inspection is shifting and it is this shifting that we set out to study for this issue. We explore answers to the following questions: How does the role of test and inspection change? What are manufacturers asking of their inspection equipment? What are manufacturers supplying in response? Who’s leading the changeover—equipment manufacturers or their customers? These questions—and this shift in role for inspection—is the natural result of digital factory infrastructure development in the form of AI, interoperability protocols and big data. In the long term, expect a lot of development attention to go from collecting data to analyzing and using that data.

Features

• Using True 3D Inspection Data as a Process Control Tool in the Smart Factory by Joel Scutchfield and Brent Fischthal
• Quality Starts With the Design by Kevin Jobsky
• Test and Measurement in a Smart Factory Interview with Brian D’Amico
• Passing the Test by Happy Holden
• Test and Inspection With Industry 4.0 Interview with Bert Horner and William Webb
• Smart Factories: Indirectly the Death of Test and Inspection by Michael Ford

Columns

• Test and Inspection in the Kitchen by Nolan Johnson
• 5 Habits to Make Your Soldering Iron Tips Last Longer by Bob Wettermann
• How to Audit OEM-EMS Assembly Capability, Part 2 by Ray Prasad

Article

• IPC Standards Development: Business Challenges and an Inside View by Graham Naisbitt

We reached out to a number of organizations doing roadmap work, as well as industry professionals volunteering during their personal time. What’s clear is that creating a technology roadmap is not an easy task. This month (just in time for strategic planning), we talk roadmaps with those who make them and those who use them.

Features

• IEEE’s Heterogeneous Integration Roadmap, Part 1 Interview with Rita Horner
• How the HIR Impacts Design Through Assembly Interview with Paul Wesling
• The Aerospace and Defense Chapter of the HIR Interview with Jeffrey Demmin
• The Heterogeneous Integration Roadmap for Aerospace and Defense by Jeffrey Demmin
• The HIR Hits the Road With the Automotive TWG Interview with Rich Rice

Articles/Interviews

• Monsoon Solutions: Achieve Greatest Reliability With Optimized Panelization, Part 2 Interview with Jennifer Kolar and Dan Warren
• Reducing Flux Splatter in Sensors and Camera Modules by Jasbir Bath, et al.
• Programs for Veterans: A Blackfox Update with Al Dill, et al

 Columns

• Roadmaps: Driving Into the Future by Nolan Johnson
• Joint Industry Standard IPC J-STD-006: Electronic Solder Alloys, Part 2 by Jennie Hwang
• What’s Lurking in the Shadows? by Eric Camden
• Process Effectiveness Qualification by Alfred Macha

As sure as the sun rises, defects cost you resources. They cascade through the product’s life cycle and can affect your company’s reputation. Businesses lose money when they burn extra resources, like labor, capacity, employee morale, and potential customer liability. This month, we ask the question, “What are the best methodologies for maximizing manufacturing reliability?”

Features

• Robustness Is Not the Same as Reliability Interview with Bob Neves
• Reliability Starts at the Bottom by Eric Camden
• Ensuring Definitive Manufacturing Reliability Interview with Russell Steiner
• The Value of the Last One Percent by Andrew Scheuermann
• How to Find Reliability in Box Build Assembly Interview with Roger Malmrose and Lilia Castro
• Monsoon Solutions: Achieve Greatest Reliability With Optimized Panelization, Part 1 Interview with Jennifer Kolar and Dan Warren

Happy Holden Presents: Special Coverage From IPC High-Reliability Forum

• 2020 IPC High-Reliability Forum Review
• Denny Fritz Unpacks Weak Interface and Stacked Microvia Reliability
• Gerry Partida Emphasizes Current Concerns Over Microvia Failures

Articles

• Improving Tech Support During a Pandemic Interview with Quintin Armstrong
• 90% Solder Dross Recovery: Eliminate Waste, Save Money Interview with Jay Hardin
• Can All Liquid Fluxes Work Well on A Reflowed OSP Pad Finish? by Ansuman Das

Columns

• Racing Toward Reliability by Nolan Johnson
• How to Audit OEM-EMS Assembly Capability, Part 1 by Ray Prasad
• PCB Rework of 0201 Packages by Bob Wettermann

If inventory management is still mostly a manual procedure on your shop floor, then there’s an opportunity to reduce labor, increase efficiencies, and improve profit margins. We take stock of the industry protocols, blockchain solutions, and new inventory management hardware and software.

Features

• IBM: Supply Chain Blockchain Interview with Christophe Begue and Michelle Lam
• Increase Traceability, Prevent Counterfeiting Interview with Michael Ford
• Automating Inventory Control Interview with Bill Astle and Bob Black
• An EMS Perspective on Inventory Management Interview with Foad Ghalili
• Trust in Time by Michael Ford
• Inventory Management by Nolan Johnson

 Articles

• IPC’s Certified Electronics Program Manager Course Goes Digital Interview with Susan Mucha and Carlos Plaza
• Real Stories of Applied Advanced Analytics in the Electronics Manufacturing Smart Factory by Derek Ong

During this COVID-19 outbreak, businesses around the world are rethinking their manufacturing and supply chain strategies. Join us as we consider the process of rethinking manufacturing. We reached out to a wide range of thought leaders on the topic, and they certainly had something to say. Inside the issue, you’ll find feature interviews with IPC’s Shawn Dubravac and Matt Kelly, Robert Murphy from Rockwell Automation, Dave Ryder and Eric Cormier from Prototron, and Chris Peters from the U.S. Partnership for Assured Electronics. You will also find insights from Robert Murphy, Ross Berntson, and Dan Beaulieu.

Features

• Supply Chain Shock and the Factory of the Future Interview with Shawn DuBravac and Matt Kelly
• Cyberattack! Think It Couldn't Happen to You? Think Again! Interview with Eric Cormier and Dave Ryder
• Human Factors in Automation Interview with Bob Murphy
• Organizational and Team Management in Times of Change Interview with Ross Berntson
• Electronics Manufacturing: A Critical Industry and Supply Chain Interview with Chris Peters
• The Future Just Isn’t What It Used to Be by Dan Beaulieu

Columns

• Rethinking Manufacturing by Nolan Johnson
• Rethinking Manufacturing: Bracing for and Embracing a Post-Pandemic Decade by Jennie Hwang
• Industrial Revolution 4.0: Hype, Hope, or Reality? by Ray Prasad
• Reliability Reboot by Eric Camden
• Working Remotely: Redesign Your Information Systems by Alfred Macha
• Removing Conformal Coatings for PCB Rework by Bob Wettermann

Responding to rapid changes in our industry and the demands put on it is a test of leadership and corporate skill sets. This issue looks at how we adapt, respond, and change in order to move forward. As we all try to make sense of the world around us these days, we invite you to put your brain to the test with our optical illusion cover. How many levels do you see? Illusions like this remind us that we don’t always see what we think we do at first glance.

Features

• Navigating the Current Supply Chain Interview with Robb Engle
• Times of Crisis = Times of Innovation by Dan Beaulieu
• Handling Supply Chain Disruption in Silicon Valley Interview with Najat Badriyeh
• Leadership in Times of Crisis Interview with Dr. John Mitchell
• TQM: The Tyranny of the Urgent Interview with Ron Lasky
• Know Your Cybersecurity Risks Interview with Mike Landeck
• Leaning on Leadership Interview with Tom Forsythe

Feature Columns

• Lessons Learned by Nolan Johnson
• It’s Not What You Have: It’s How You Use It by Michael Ford
• Correlating COVID-19 With Reliability? by Eric Camden

There is more happening in the solder and soldering technology space than one might think. In this issue, we chart the flux and flow of advancements in soldering. In our February "Fine Pitch" issue, we learned that the critical point for the manufacturing of electronics using smaller and smaller components was the soldering process—sticking the components to the board, simply put. There was so much information in this space that we decided to come back with a focus solely on the topic of solder technology.

Features

• Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview Interview
• How Engineers Can Use SPI Tools for Verification Interview with Ray Welch and Brent Fischthal
• High-reliability, Low-temperature Solder Alloys by Pritha Choudhury, et al.
• MTV Offers Solder Paste Testing Solution Interview with Chrys Shea
• NovaCentrix Offers Photonic Soldering Solution Interview with Stan Farnsworth and Dr. Rudy Ghosh
• Indium Metal Forecast: Supply Chain Strong, Demand Continues to Grow by Donna Vareha-Walsh
• Current Advances in Soldering Technology Interview with Clemens Jargon
• Fume Extraction in Electronics Interview with Andy Mitchell

Feature Columns

• Advancements in Soldering Technology by Nolan Johnson
• New Solder, Same Old Testing by Eric Camden
• Solutions for Customer Support During Social Distancing by Chris Ellis
• Developing A Reflow Profile by Ray Prasad

Columns

• Update Your Business Contingency Plan by Alfred Macha
• Getting to the Root Cause of BGA Assembly Problems by Bob Wettermann

We continue our exploration of implementation details for smart factories with resources and ongoing examples demonstrating that the real innovation in a smart factory comes from your business practices. Don't miss our exclusive in-depth conversation with aviation design superstar Burt Rutan following his January 2020 keynote at IPC APEX EXPO.

Features

• Automation War Stories From ICM Controls Interview with Andy Kadah and Kevin Jobsky
• Business Practices Drive the Smart Factory, Not the Other Way Around (Part 2) Interview with Sagi Reuven
• The Convergence of Technologies and Standards in Smart Manufacturing by Ranjan Chatterjee and Dan Gamota
• The Journey to an eSmart Factory, Part 1 by Happy Holden
• Digital Factory Implementation, Part 2 by Nolan Johnson
• Smart Factory Implementation­: How Smart is Smart Enough? by Dr. Jennie S. Hwang
• Seeing Around Corners by Michael Ford

Articles

• When Your Fabricator Is Late Interview with John Watson
• Exclusive Interview With Burt Rutan, Aerospace Legend Interview with Burt Rutan

Columns

• Improving Reliability for Free by Eric Camden
• The Gemba Transformation of Manufacturing with AI by Alfred Macha

In part 1 on this subject, we set out to explore implementation details for smart factory concepts and expected to talk about sensors and protocols. As we dug deeper, it became clear that, in the end, the real smart factory innovation involves your business practices.

Next month, we continue our look at smart factory implementations from planning to rollout and from investment to profitability. Stay tuned!

Features

• Business Practices Drive the Smart Factory, Not the Other Way Around (Part 1) Interview with Sagi Reuven
• CFX: Industry 4.0 Ready by Chris Jorgensen
• Smart Factories: Readers Share their Progress and Priorities I-Connect007 Survey
• Cimetrix Helping to Digitalize Factories Interview with Ranjan Chatterjee
• Book Excerpt: The Foundation of Industry 4.0 by Oren Manor
• Happy’s Smart Factory Protocol Primer by Happy Holden

Articles

• Case Study: ASKEY Applying IPC QML Validation by Edy Yu

Columns

• The Smart Factory Means Being Smart About Your Factory by Nolan Johnson
• Developments in BTC Guidelines: IPC-7093A, Part 1 by Ray Prasad

While this issue may be about finer pitches in manufacturing and packaging, to successfully manufacture circuit boards in this time of shrinking components and board features, the secret is to ensure success with the solder joints. Manufacturers will need the tools, options, and human expertise to succeed at this level.

Features

• Semiconductors in Charge: The Changing Face of Board Manufacturing Interview with Chuck Bauer and Dana Korf
• What’s Driving AOI Innovation and Collaboration? by Brent Fischthal
• The Big Picture on Small Components Interview with Ray Prasad
• LPKF on Stencils and Depaneling Interview with Stephan Schmidt and Mirela Orlowski
• Increased Miniaturization Poses Soldering Challenges Interview with Chris Nash
• Evolving Solder Capabilities for Shrinking Components Interview with Yuya Suzuki

Feature Columns

• Fine Pitch by Nolan Johnson
• Big Trouble Comes in Tiny Packages by Eric Camden
• Size Matters: The Digital Twin by Michael Ford

Articles

• Solder in PCBA: Can’t Live Without It… Or Can We? by Joe Fjelstad
• Market Insights From Epoch International’s President Interview with Foad Ghalili
• Embedding Semiconductors by Vern Solberg
• Solder Paste Evaluation and Simple Tricks of the Trade by Pete Starkey

Columns

• Dealing With Package Parasitics by Ray Prasad
• Sharpening Your Organization’s Competencies by Alfred Macha

Our IPC APEX EXPO preview issue! IPC APEX EXPO celebrates 20 years, which makes the event’s history a 21^st-century story.

In this issue, you will find the history, the present, and the future of the electronics manufacturing industry. See you in San Diego!

Features

• Engaging STEM Students at IPC APEX EXPO 2020 by Nolan Johnson
• IPC Government Relations Team Offering Education and Fun at IPC APEX EXPO by Chris Mitchell
• Let’s Play a Game of True or False: CFX Edition by David Bergman
• IPC Asia Continues Solid Growth interview with Phil Carmichael
• CFX Preview at IPC APEX EXPO 2020 interview with Chris Jorgensen
• Sunshine and Circuit Boards by Eric Camden

Special Features

• Mycronic productronica 2019 Special Coverage
• Celebrating 20 Years, IPC APEX EXPO Recognizes Exhibitors
• Real Time with... IPC APEX EXPO 2020 Sponsor List

Article

• Molex on Connectors and Successful Manufacturing an interview with Frank Ruffino and Jim Hines

 Columns

• IPC APEX EXPO 2020 Preview by Nolan Johnson
• Joint Industry Standard J-STD-006: Electronic Solder Alloys by Dr. Jennie Hwang
• Hiring and Retaining Top Employees by Alfred Macha
• Underfill Rework and Solder “Squirt Out” by Bob Wettermann

No matter your age or experience level, we all need to be continuous learners. In this issue we bring you some of the newest and highest impact topics. Read about insightful industry perspectives and the latest announcements from productronica 2019 to help further your expertise.

FEATURES

Interviews:

• What You Need to Know About the Digital Factory with Oren Manor
• The Convergence of 5G and Automotive with Karthik Vijay
• Altium’s Roadmap: Beyond PCB Design with Ben Jordan
• Clean vs. No-clean: A Generational Difference with Tom Forsythe
• Upgrading to a Digital Line with Ridhi Kantelal
• PCB Repair: Thoughtful Best Practices with Curtis Smith

Article:

Risk Mitigation: An Essential Guide by Kimberly Johnson and Tony Torres

Columns:

• Choosing the Right Defect by Ray Prasad
• What You No Longer Need to Learn by Michael Ford
• What You Need to Know by Nolan Johnson
• Old Dogs, New Tricks by Eric Camden
• Take Your CAPA to the Next Level With 8D by Alfred Macha

More content:

Photo Coverage from productronica 2019

This month, we embark on a tour of the industry, capturing different perspectives and bringing them to the fore. Sometimes, the best view of an industry or a community is through individual experiences. In this issue, we talk to members of the electronics industry who were willing to share their voices and points of view.

Features

• Supply Chain Update and the Impact of 5G Interview with Nolan Johnson
• David Meyers on Digital Twin and ‘Cobots’ Interview with the I-Connect007 Editorial Team
• André Bodegom on European Challenges, Automation, and Automotive Interview with Pete Starkey
• The Digital Medical Revolution Interview with Nolan Johnson

Feature Columns

• A Tour of the Industry by Nolan Johnson
• Voices Carry by Eric Camden
• Are CMs Ready to Embrace Project Management? by Alfred Macha
• Electronics Assembly Industry Outlook by Bob Wettermann
  

Articles

• The Future of the World Is Truly in the Hands of Our Youth Interview with Barry Matties
• Practical Verification of Void Reduction Method for BTC Using Exposed Via-in-pad by Alfredo Garcia, et al.

With so many new and emerging market drivers and influences—from technology to new product applications, environmental and government pressures, and human factors, such as staffing and expertise—the landscape of the industry is undergoing multiple changes.

This issue launches a multi-month, thoughtful look across all of our magazine titles as we explore the shifts and the trends causing these changes.

Features

• Digi-Key on Adapting to the Changing Industry Landscape, Part 1 Interview with Chris Beeson
• AI Cameras Help Park Rangers Stop Poachers Interview with Eric Dinerstein
• Merger and Acquisition Trends Interview with Joe O’Neil
• Global Political Turmoil Creating Uncertainties for the Industry by Chris Mitchell
• The Changing Industry Landscape by Nolan Johnson
• Revisiting Globalization: Technology, Jobs, Trade by Dr. Jennie S. Hwang

Article

• Maximising Performance and Reliability of Automotive Electronics With Conformal Coatings by Phil Kinner

Columns

• Dromology: Time-space Compression in Manufacturing by Michael Ford
• Today’s Soldering Options by Ray Prasad
• Artificial Reliability Over Intelligence by Eric Camden
• Faster, Cheaper, Simpler by Chris Ellis

There are rules, and then there are recommendations; one person’s rule might be another person’s recommendation and vice versa. That is where standards come into play. What are they? What do they mean? How do they get specified? And what are the impacts on our industry?

This month, we hear from a variety of industry leaders who weigh in on how standards are created and their impact on us all.

Features

• To Improve the Standards Process, Get Involved Interview with Jan Pedersen and Ray Prasad
• The Convergence: IPC Merging CFX With IPC-12581 Interview with Gary Carter and Michael Ford
• The Long Road to a New Standard Interview with Gary Carter and Michael Ford
• Standards Through Time: Changing to Stay the Same by Nolan Johnson
• Reliability by the Book by Eric Camden
• The Ecosystem of Industry Standards Interviews with Dave Bergman, Marc Benowitz, Scott Miller, and Wilfried Bair
• How Standards Impact You and Your Company by Ray Prasad
• Explaining the QSFP-DD Data Center Interconnect Standard by Scott Sommers

Articles

• Comparing Soldering Results of ENIG and EPIG Post-steam Exposure by Jon Bengston and Richard DePoto

Columns

• Rules or Recommendations? by Nolan Johnson
• Recognizing the Need for Change by Michael Ford
• Transform Your Operations With Nadcap by Alfred Macha
• Process Methods for Reworking High Lead Count SMT Parts by Bob Wettermann

In this issue, we look at how the new manufacturing demands are driving change and innovation in conformal coating products, systems, and technologies.

Features

• Conformal Coating Selection: Conventional vs. Two-part by Phil Kinner
• Conformal Coating Processes and Trends An Interview with Camille Sybert
• The Role of Parylene Conformal Coatings in Next-gen Electronics by Tim Seifert
• Solder Mask Evolves Into a Truly Additive Process by John Fix
• Selecting the Proper Flex Coverlayer Material by Dave Lackey
• Automated Conformal Coating of CCSs Using Polyurethane by Marissa Pati and Ana “Lety” Campuzano-Contreras
• Dispensing EMI Shielding Materials: An Alternative to Sputtering by Garrett Wong and Jinu Choi

Columns

• Conformal Coatings by Nolan Johnson
• Sealing Your Fate by Eric Camden
• Custom Reflow Ovens and Curing by Chris Ellis
• Becoming the Preferred Supplier, Phase 3: Re-Engineer Your Quality System by Alfred Macha

It should come as no surprise that solder and solder joints are often at the center of attention in electronics assembly when discussing failures and reliability. This issue includes articles and columns from industry experts as well as insightful technical papers from IPC APEX EXPO 2019 on the cutting-edge of failure and reliability research.

Features

• Optimizing Solder Paste Volume for Low-temperature Reflow of BGA Packages by Keith Sweatman
• Size Matters: The Effects of Solder Powder Size on Solder Paste Performance by Tony Lentz
• Low-temperature SMT Solder Evaluation by Howard “Rusty” Osgood, David Geiger, Robert Pennings, Christian Biederman, Jie Jiang, and Jon Bernal
• Surface Treatment Enabling Low-temperature Soldering to Aluminum by Divyakant Kadiwala
• Failures and Reliability in Soldering by Michael Gouldsmith and Zen Lee
• Approaches to Overcome Nodules and Scratches on Wire-bondable Plating on PCBs by Young K. Song, Vanja Bukva, and Ryan Wong

Feature Columns

• Reliability vs. Failure by Nolan Johnson
• Would You Prefer Shorts or Opens in Your Products? by Ray Prasad
• The F Word by Eric Camden
• Common Machine Errors and How to Avoid Them by Chris Ellis

Articles

• Smart Manufacturing Roadmap: Data Flow Considerations for the Electronics Manufacturing Industry by Ranjan Chatterjee and Dan Gamota

Columns

• Learn From the Wise by Jennie Hwang
• BGA and PCB Warpage: What to Do by Bob Wettermann
• Becoming the Preferred Supplier, Phase 2: The Six Pillars by Alfred Macha

Do we really think that we can speed up existing processes? Will faster workers or a new line with more throughput be enough to grow with the increased demand? Or does this new market require thinking about the capacity problem in a completely new way?

Michael Ford, senior director of emerging industry strategy at Aegis Software, sets the tone in his conversation with Barry Matties. Ford makes a strong case that the easiest way to streamline your facility is to reduce downtime.

We follow with Brent Fischthal and Jenny Yuh discussing the role optical inspection can have in streamlining assembly both on the floor and as a process improvement.

Denis Barbini, general manager at Laserssel, continues the streamlining theme where they’ve been raising awareness about their novel laser-based soldering technology.

Features

• Data Is the Key to Automating Right the First Time A conversation with Michael Ford
• 3D Optical Inspection Provides ‘Eyes’ for Process Improvements in Industry 4.0 by Jenny Yu and Brent Fischthal
• Reflow Your Solder and Your Data for Industry 4.0 A conversation with Phil Kazmierowicz and MB Allen
• Smart Factory Transitions: Attainable With a Plan A conversation with Zac Elliott
• Laserssel Brings High-speed Soldering to New Application Areas A conversation with Denis Barbini
• First Time With In-house SMT Assembly? Start With a Great Design by Mike Fiorilla

Columns

• Streamlining, but Streamlining What? by Nolan Johnson
• Becoming the Preferred Supplier, Phase 1: Transform Your Company’s Culture with Lean Sigma, by Alfred Macha
• Benchmarking Defect Levels in Your Product, by Ray Prasad

This issue features extensive in-depth discussions with six different contract manufacturers and assembly houses representing a wide range of specialties, from prototype/startup specialists to medium-scale production and high-complexity mil/aero. Learn how these companies help their clients succeed and grow into #happySMTcustomers.

We start with part six of Dr. Jennie Hwang’s ongoing column featuring the role of bismuth in electronics.

Next, we kick off our coverage of how to make customers successful with “That One Thing,” the first of our overview features. Our showcase contract manufacturers all had a lot to say about the question, “What is the one thing your customers can do to be successful?” Read their insights here.

Then, we give the podium to our returning columnist, Ray Prasad. Following Prasad is our second overview feature, “The Perfect Job,” where our showcase companies share their insight on how to make the handoff to manufacturing as worry-free as possible.

What follows are shortened interviews with each showcase company: mil/aero specialist, Zentech (John Vaughan); Milwaukee Electronics/Screaming Circuits (Duane Benson); Green Circuits (Joe Garcia); Whizz Systems (Muhammad Irfan); and the whole team at Data Electronic Devices (DataED).

Intermixed with the interviews, you’ll also find Mike Fiorilla’s column, The Mannifest. Mike shares practical insight on how to manage your double-sided assemblies. You’ll also meet Alfred Macha with his column on performance improvements through process validation.

In the anchor slot on this issue is columnist Bob Wettermann with his discussion on damaged corner repair techniques.

Features

• The One Thing by Nolan Johnson
• The Perfect Job by Nolan Johnson
• Mission-critical Tips for Program Success - interview with John Vaughan
• Communication and Information: Two Keys to Success - interview with Duane Benson
• Green Circuits’ Three Tips to Be a Well-prepared Customer - interview with Joe Garcia
• Whizz Systems on Knowing Your Strengths and Building Customer Relationships - interview with Muhammad Irfan
• From DataED’s NPI Center to the Manufacturing Floor - interview with Jeff Hamlett, et al.
• How Assemblers Can Help Their Customers Reduce Cost and Improve Reliability by Ray Prasad

Columns

• Customer Success—Plans and Projects by Nolan Johnson
  
• The Role of Bismuth in Electronics, Part 6 by Dr. Jennie Hwang
• Managing Your Double-sided Assemblies by Mike Fiorilla
• Process Validation Can Take You to a Higher Level of Performance by Alfred Macha
• Straightening Out Those Corners by Bob Wettermann

In our industry, the sheer number of new technologies in development will change not only what our industry builds but how we build it. And the youth coming up behind us are perfectly willing to make use of these new technologies. It's not a brave new world; it is a courageous new world. Apparently, no one told these young people that it couldn’t be done.

Our issue launches with coverage of the IEEE Rising Stars Conference. Next, columnist Eric Camden ponders the impact of “tribal knowledge” in the evolution from design concept to production in his aptly-titled “These Darn Kids/Back In My Day.”

Speaking of kids, our next piece takes us back to Rising Stars perspectives from conference attendees. Following right behind is Barry Matties’ conversation with Jeffrey Diament, a young engineer (and Princeton graduate) developing new sensors at startup Instrumems. Next, Craig Reiselt, CEO at Octane Open Concepts, discusses Octane’s innovative tools for CM floor optimization.

Turning our attention to emerging technologies, we bring you two interviews on battery and sensor technology currently under development with help from the Nano and Advanced Materials Institute (NAMI) based out of Hong Kong. Tracy Liu and David Yeung discuss their work and the forthcoming rollout of their products.

We’re also delighted to premiere a brand-new column! Mike Fiorilla from Manncorp Inc. kicks it off with “When Is It the Right Time To Automate?” Closing the latch on this issue is Vic Markarian from Cadence Systems.

Features

• From Participant to Volunteer to Leader: The IEEE Rising Stars Conference Interview with Matt Smith
• IEEE Rising Stars Founder: Empowering Young Professionals Interview with Michael Andrews
• These Darn Kids / Back in My Day by Eric Camden
• Rising Stars at Rising Stars by Nolan Johnson
• A Young Engineer’s Perspective Interview with Jeffrey Diament
• Octane Open Concepts: Workflow Optimization Meets Factory Automation Interview with Craig Reiselt
• Innovative Battery and Pressure Sensor Technologies Interview with Tracy Liu
• Lionrock Delivers Foldable, Industrial-grade Battery Technology Interview with David Yeung
• Cadence Design Systems Takes Their Tensilica Product to the CES Show Floor Interview with Vic Markarian

New Column

• When Is It the Right Time to Automate? by Mike Fiorilla

We’ve been building automated factories for quite a while. However, the time has come for smart factories in our segment of the electronics industry. In this issue, we explore smart factories, the technologies required, and the shift in thinking that Industry 4.0 and smart factories will bring to our world.

For our first practical example, Barry Matties brings us up to date with DSG’s facility in China. In this factory tour and interview with Mauro Dallora, we learn about the current ongoing expansion and future plans that illustrate how smart factory fundamentals can be a big help to your business.

In “Building a Smart Factory Supply Line”, Barry relays his experiences from his tour of the 236,000 square meter Victory Giant Technology Campus. VGT is a Chinese-based manufacturer implementing smart factory solutions as they continue their growth from traditional manufacturing to automated systems, with an impressive expansion plan.

Neil Sharp discusses four core electronic component packaging issues in “Improving the Efficiency of Your PCBA Production.” Then, Happy Holden’s feature article lays the philosophical groundwork for thinking about smart factories of the future.

A few more interesting interviews come to you from Phoebe Francis, a representative for the Wireless Power Consortium (WPC)—a group at the center of standardizing wireless power systems and Anfield Group’s Chris Humphreys who discusses current cybersecurity concerns in the industry.

Happy Holden returns with “A Working Definition of Automation” and a 10-question quiz about smart factory data in “What Do You Know About Automation?”

In “How Smart is Your Factory?” regular columnist, Eric Camden, reminds us that working smart is not simply equipment and data capture. Bob Wettermann’s column this month focuses on “Inspection of BGAs After Rework.”

Features

• DSG: Breaking Ground on the Smart Factory Revolution by Barry Matties
• Automation and the Smart Factory: Introduction to Industry 4.0 by Happy Holden
• Building a Smart Factory Supply Line by Barry Matties
• Interview: Anfield Group: Industrial Cybersecurity Needs to Be in Front of Regulators, with Chris Humphreys
• A Working Definition of Automation by Happy Holden
• What Do You Know About Automation? a Quiz by Happy Holden

Columns

• How Smart Is Your Factory? by Eric Camden
• Smart Factories: A Shift in Thinking by Nolan Johnson
• Inspection of BGAs After Rework by Bob Wettermann

Articles

• Improving the Efficiency of Your PCBA Production by Neil Sharp
• Interview: WPC’s Standardized Cordless Power Solutions, with Phoebe Francis

• Selling Your Services: Welcome to the Jungle by Nolan Johnson
• Filling the Skills Gap: Strategic Hiring and Succession Planning Interview with Terry McNabb
• Dan Beaulieu on Magnetic Marketing A Conversation with Barry Matties
• Nate Ramanathan on Choosing a Prototype Partner and Production Supplier, an interview by Nolan Johnson
• Eureka Park: Chock Full of New Customers for a Market-maker by Nolan Johnson
• Tom Lavoie on Career Planning and Professional Development, an interview by Nolan Johnson
• The Cost of Quality and the Higher Cost of Failure by Eric Camden

• The Role of Bismuth (Bi) in Electronics, Part 5 by Dr. Jennie S. Hwang
• The Truth Behind AI by Michael Ford
• Controlling Oxidation and Intermetallics in Moisture-sensitive Devices by Richard Heimsch

Component supplies, prices, and lead times are in a great deal of turmoil. And there are a LOT of moving parts to this set of circumstances, ranging from a sustained increase in demand for parts, to pricing pressures on manufacturers and premature parts obsolescence. All these factors wreak havoc on electronics manufacturing. In this issue, we explore the drivers and the coping mechanisms from all points of the supply chain.

Feature Articles

• The Electronic Component Shortage Crisis: A Veteran Engineer's Perspective by John Watson, CID
• Digi-Key's Dave Doherty: Tweaking the Supply Chain by Nolan Johnson and Andy Shaughnessy
• Dan Schoenfelder: Searching for Parts in Real Time by the I-Connect007 Editorial Team
• Stephanie Martin: Component Supply Challenges from the Catbird Seat by the I-Connect007 Editorial Team
• Sunstone's Matt Stevenson on Supply Chain Issues in Quick-turn Fabrication by Barry Matties and Nolan Johnson
  
• No Rest for the Weary: Supply Chain Pressures Are Here to Stay! by Jamey Mann
  
• Natasha Baker: Supply Chain Transparency Inside the CAD Tool, by Nolan Johnson

Columns

• Nolan's Notes: Supply Chain in Crisis by Nolan Johnson
• Quest for Reliability: The Effect of Thermal Profiles on Cleanliness and Electrical Performance by Eric Camden
• Knocking Down the Bone Pile: How Much is Too Much? by Bob Wettermann
• Mil/Aero Markets: The Fourth Pillar of Defense Acquisition—Cybersecurity by John Vaughan

The electronics manufacturing industry continues to grow and change, and there’s no better place to participate in the excitement than at IPC APEX EXPO 2019. In this issue we preview the show, the new events, exhibitions, new technologies, awards, competitions, and standards work. We even step back with two members of the APEX EXPO board of directors responsible for starting APEX. So take your seat, whether as an attendee or as an industry representative, and let’s get this show started.

Table of Contents

Features

• Welcome to the BIG Show! by Nolan Johnson
• Opening Keynote Preview: Accelerating and Disrupting Innovation, The Tesla Story by Nolan Johnson
• Who’s the Best of the Best in Hand Soldering? by Nolan Johnson
• Shopping at IPC APEX EXPO: Evolutionary or Revolutionary Products? by Andy Shaughnessy
• Executive Forum at IPC APEX EXPO 2019 Focuses on Advancing Automotive Electronics by Patty Goldman
• IPC Recognizes Volunteers at Awards Luncheons, by Patty Goldman

Articles

• In The Studio: Real Time with…IPC, by Andy Shaughnessy
• Mark Friedman on IPC Membership, by Barry Matties

Interviews

• IPC APEX EXPO Offers a Full Operating CFX Demo Line by I-Connect007
• STEM: The Future of Our Industry, by Barry Matties
• APEX Pioneers Discuss the Original EXPO, an interview of Jim Hickman by Dan Feinberg

Whether or not you believe this is a golden age for medical devices, there’s no denying that the amount of innovation underway in medical electronics is staggering. If you’re not currently contributing to medical device development, chances are you might find yourself working with medical devices at some time in the future. In this issue, we take you deeper into the technologies, trends, and compliance constraints you’re likely to encounter in your next (or first) medical device.

Table of Contents

Features

• Experts Interview: A Look at Medical Electronics Design and Assembly Challenges by the I-Connect007 Editorial Team
• 3D Printing and Medical Electronics: A Beneficial Disruptive Technology by Dan Feinberg
• FDA Approvals: Clearing the Hurdles by Nolan Johnson
• Printed Electronics and The Fast, Flexible, Future of Connected Healthcare by Girish Wable & Ralph Hugeneck
• Vital Points in Medical Electronics Manufacturing Interview with Zulki Khan

Columns

• Is This a Golden Age for Medical Devices? by Nolan Johnson
• SMT Manufacturing: Why Soldering? by Dr. Jennie S. Hwang
• Does Medical Device Reliability Worry You Sick? by Eric Camden
• Proper Thermal Shielding Yields Highest Rework Results by Bob Wettermann

Bonus article

• AOI Programs with a Magic Click, by Jens Kokott & Matthias Müller

The PCB assembly industry is edging closer to the true vision of Industry 4.0. With IPC’s Connected Factory Exchange (CFX) standard—a common machine communications standard for the electronics assembly supply chain—electronics manufacturing is on its way to become even smarter. This issue of SMT007 Magazine looks at the latest developments in the CFX standard and its overall impact on the PCB assembly process.

FEATURES:

• CFX: Building the Foundation for Industry 4.0, Interview with Dave Bergman
• Understanding the Benefits of CFX, Interview with David Fenton
• Challenges and Opportunities with CFX, Interview with Larry Chen
• The Truth About CFX by Michael Ford
• Are You Connected to Reliability? by Eric Camden
• CFX: The Data Train is Now ‘Boarding’ by Nolan Johnson

MORE CONTENT:

• Do’s and Don’ts of Thermal Management Materials, by Jade Bridges
• Process, Design and Material Factors for Voiding Control for Thermally Demanding Applications by Ranjit Pandher, et. al

When it comes to megatrends, resistance is futile! Internet of Things (IoT), Industry 4.0, artificial intelligence (AI), automation, virtual reality/augmented reality/mixed reality (VR/AR/MR)—and now extended reality (XR)—these are just a few of the trends that are expected to shape the world we are living in today. How will these megatrends impact PCB manufacturing and assembly?

Articles:
IoT: Driving Change in Manufacturing by Stephen Las Marias
XR Update: Emerging Realities by Dan Feinberg
How CIM and IoT Can Make Your Factory Smart by Zac Elliott
AI-Powered Inspection Interview with Peter Krippner
Innovation is the Motto, Efficiency is the Aim: The Smart Robot Revolution is Here by Pratik Kirve

Columns
The Megadrivers by Stephen Las Marias
Artificial Intelligence: Super-Exciting, Ultra-Competitive by Dr. Jennie S. Hwang
Are Megatrends Putting Your Product at Megarisk? by Eric Camden
Filling the Gap: Underfill Rework by Bob Wettermann
Conformal Coatings: An Evolving Science by Phil Kinner

There are many pros and cons to cleaning your PCB assemblies. Cleaning can be an additional capital expenditure, and with miniaturized devices and components, cleaning has become quite difficult to accomplish given the low-standoff heights and component densities in boards. There’s also the issue on shorter and shorter product lifecycles—your phone, for instance. On the other hand, cleaning ensures quality and reliability. So, cleaning depends on many factors. This issue of SMT007 Magazine features the challenges, latest developments, and strategies for cleaning, and will help you decide whether to clean, or not clean your PCB assemblies.

Table of Contents

Features

• Getting More with Cleaning, by the I-Connect007 Editorial Team
• Cleaning a No-Clean Flux: The Worst Decision You’ve Ever Made? by Eric Camden, Foresite Inc.
• Whitepaper: Electronics Cleanliness Testing, by Jason Fullerton, Alpha Assembly Solutions
• Towards a Data-driven Cleaning Environment, by Stephen Las Marias, I-Connect007
• Is Component Testing Using ROSE Practical? by Joe Russeau, Precision Analytical Laboratory, and Mark Northrup, IEC Electronics
• PCBAs: To Clean or Not Clean, by Stephen Las Marias, I-Connect007

Columns

• Editor’s Note: Why Clean?, by Stephen Las Marias, I-Connect007
• Accelerating Tech—Insights from the Smarter Factory: Advanced Digitalization Makes Best Practice, Part 2: Adaptive Planning, by Michael Ford, Aegis Software

Articles

• Interview with a High School Robotics Team Mentor, by Happy Holden, I-Connect007
• Newly Re-branded Optel Software Lays Down China Strategy, by Stephen Las Marias, I-Connect007
• 3D Printing: Enabling a New Manufacturing Landscape, by Happy Holden, I-Connect007

While it is not set in stone, following best practices helps ensure manufacturing excellence. This month we look at best practices in the PCB assembly industry and how to incorporate them into your own manufacturing environment.

Table of Contents

Features:

• Practicing Best Practices, Interview with Jason Keeping and Bob Willis, I-Connect007
• How DFA Converts Complexity into Freedom for Medical Device Development, by C. Stott, Ed Sermanoukian, and G. Wable, Nypro Inc.
• Strategies for Choosing Solder Paste for Successful Electronics Assembly, by Jason Fullerton, Alpha Assembly Solutions
• Essential Task Order Execution in Contract Manufacturing, by Stephanie Weaver, Zentech Manufacturing
• Cross-Functional Teams Drive Strong Focus on Risk Mitigation and Quality, by Sandy Kolp, Firstronic
• Demand Forecasting: The Art of Knowing What You Need Before You Need It, by Patty Rasmussen, East West Manufacturing
• Best Practices in Manufacturing – Wave Soldering, by Brian Morrison, Vexos Corp.

Columns

• Editor’s Note: We Have the Best Practice for That, by Stephen Las Marias, I-Connect007
• SMT Prospects & Perspectives: The Role of Bismuth (Bi) in Electronics, Part 3, by Dr. Jennie S. Hwang, H-Technologies Group
• Quest for Reliability: Contamination: The Enemy of Electronics, by Eric Camden, Foresite Inc.
• Knocking Down the Bone Pile: Replating of Gold Fingers: Getting the Shine Back, by Bob Wettermann, BEST Inc.

Articles

• Use of Lean Manufacturing Principles Enhances Quality and Productivity, by Mike Baldwin, Spectrum Assembly Inc.
• AXI 4.0 in a Smart Factory Environment, by Matthias Müller and Andreas Türk, Goepel electronic GmbH
• Full Material Declarations: Removing Barriers to Environmental Data Reporting, by Roger L. Franz, TE Connectivity

Manufacturers are having to navigate critical challenges that rock their boat when faced with assembling flexible printed circuits. The flex market continues to be one of the fastest growing segments of the circuit board industry, mainly driven by the significant rise in the consumer electronics sector. In this issue, we examine these concerns and highlight some of the strategies and techniques used to address them.

Table of Contents:

Features

• Flex Circuit Assembly: Challenges and Strategies for Success, by Stephen Las Marias, I-Connect007
• Reflow Perspectives to Flex Circuit Assemblies, by Stephen Las Marias, I-Connect007
• Conversation with… Miraco: Strategies for Successful Flex Circuit Assembly
• Conversation with… Vexos: Doing it Right the First Time
• Conversation with… Thermaltronics: Addressing Temperature Challenges in Flex Circuit Rework

Columns

• Editor’s Note: Tackling the Challenges in Flexible Circuit Assembly, by Stephen Las Marias, I-Connect007
• Accelerating Tech—Insights from the Smarter Factory: Advanced Digitalization Makes Best Practice Part 1: Digital Remastering, by Michael Ford, Aegis Software
• One World, One Industry: IPC Addresses Skills Gap, by John Mitchell, IPC

Articles

• Novel Approach to Void Reduction Using Microflux Coated Solder Preforms, by Anna Lifton, Paul Salerno, Jerry Sidone and Oscar Khaselev, Alpha Assembly Solution
• Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency, by Timothy O’Neill, Carlos Tafoya, and Gustavo Ramirez, AIM Metals and Alloys

In line with its significant improvement over current generation of wireless technologies, 5G also offers device and systems manufacturers a challenge—electrical and functional testing, among others—as they deal with the technology’s millimeter wave frequencies. This month’s issue of SMT007 Magazine looks into how the industry can successfully tackle this process.

Table of Contents:

Features

• 5G Requires New Approach to Testing, by Stephen Las Marias, I-Connect007
• Challenges and Opportunities in Testing 5G, a conversation with Keysight
• DFT Strategy Necessary for 5G Assembly, a conversation with Asteelflash

Feature Column

• 5G: Testing the Future Impact, by Stephen Las Marias, I-Connect007

Columns

• SMT Prospects & Perspectives: The Role of Bismuth (Bi) in Electronics, Part 4, by Dr. Jennie S. Hwang, H-Technologies Group
• Knocking Down the Bone Pile: Masking of Conformal Coating During Assembly and Rework, by Bob Wettermann, BEST Inc.

Articles

• It’s Time to Retire ROSE Testing, by Joe Russeau, Precision Analytical Laboratory and Mark Northrup, IEC Electronics
• Modeling an SMT Line to Improve Throughput, by Gregory Vance, Rockwell Automation Inc., and Todd Vick, Universal Instruments Corp.
• Enabling an Intelligent Supply Chain for Electronics Manufacturing, by Thilo Sack, Alex Chen, James Huang, and Sam Khoo, Celestica Inc.
• Elements to Consider on BGA Assembly Process Capability, by Dora Yang, PCBCart

This month’s issue of SMT007 Magazine looks into the latest developments, challenges, and opportunities in automotive electronics, and why this market continues to drive the overall electronics manufacturing industry.

Features

• Editor’s Note: Automotive Electronics Still in the Front Seat, by Stephen Las Marias, I-Connect007
• Vehicle Electrification: Disrupting the Automotive Industry and Beyond, by Chandran Nair, National Instruments
• Solving Reliability and Thermal Management Challenges in Automotive Electronics, an interview with Paul Salerno
• System-Driven Approach Ensures Automotive Electronics Assembly Success, an interview with Mathieu Kury
• Under the Hood: Solder Joint Reliability, by Burton Carpenter, NXP Semiconductors Inc.

Articles

• CFX: The Next Step Toward the Future of Factories, by Stephen Las Marias, I-Connect007
• How the Factory Ecosystem Positively Drives Exponential Value, by Freddie Chan, KIC
• 3D Printing and Additive Manufacturing in PCBA, by Zohair Mehkri, David Geiger, Anwar Mohammed, and Murad Kurwa, Flex

In this month’s issue of SMT007, we examine how Industry 4.0 trends and the increasing power of data impact the PCB assembly industry. How will these two elements take assembly processes to the next level? Our experts weigh in.

Table of Contents

Features

• Editor’s Note: Electronics Manufacturing (R)evolution, by Stephen Las Marias, I-Connect007
• Cleaning with Data, by Barry Matties, I-Connect007
• Industry 4.0 Technologies: If Only I Had Known, by Michael Ford, Aegis Software
• Is it a Cloud or is it Fog? The Climate Change of Data, by Michael Ford, Aegis Software

Columns

• Knocking Down the Bone Pile: Device “Dead Bugging”, by Bob Wettermann, BEST Inc.

Articles

• Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications, by Mark Whitmore and Jeff Schake, ASM Assembly Systems
• Manufacturability: Pad Relief and Mask Relationship to Solder Joint Volume, by Ken Horky, Peterson Manufacturing

Working closely with your customers is critical, now more than ever. Nothing is more reassuring to customers than your willingness to listen and communicate with them no matter what the situation is. This month’s issue of SMT007 Magazine highlights the challenges between the customer-supplier relationship, the feedback that matters, and how electronics assemblers ensure 100% customer satisfaction.

TABLE OF CONTENTS

Features

• Communications: Bridging the Customer-Supplier Gap, by Andy Shaughnessy, Patty Goldman, and Stephen Las Marias, I-Connect007
• Defining Customer-Supplier Relationships and Customer Satisfaction, by I-Connect007
• Working with Customers: A Consultant’s Perspective, by Stephen Las Marias, I-Connect007
• Exceeding Customer Expectations, by Stephen Las Marias, I-Connect007
• Growing with the Customer, by Stephen Las Marias, I-Connect007

Columns

• Editor’s Note: Talk to Your Customers, by Stephen Las Marias, I-Connect007
• SMT Prospects & Perspectives: New Year Resolutions and Best Wishes, by Dr. Jennie S. Hwang, H-Technologies Group

 Articles

• Tips & Tricks: Machine Assist Time, by Ken Horky, Peterson Manufacturing
• Improving SMT Yield and Reducing Defects: A Rauland Case Study, by Edward Hughes, Aculon

SMT007 Magazine looks into the key considerations when investing in new equipment—not just on who’s got the latest and the greatest, but on how people decide what to buy, when to buy it, and how those decisions are made.

 Table of Contents

Features

• Making the Right Equipment Selection, by Stephen Las Marias and Patty Goldman, I-Connect007
• Selecting X-ray Inspection Equipment, by Russell Poppe, JJS Manufacturing
• Creating a Healthy Work Environment: A Conversation with ULT’s Wolfgang Koehler

IPC APEX EXPO 2018 Pre-Show Coverage

• A Sneak-Peek at IPC APEX EXPO 2018 with John Mitchell
• Keeping it New, Current and Relevant: IPC Conference Director Jasbir Bath
• CFX: Updates and Developments with Nancy Jaster
• All the Details on IPC’s Emerging Engineer Program with Teresa Rowe & Nancy Jaster
• What to Expect at IPC APEX EXPO 2018: EXPO Veteran Alicia Balonek Shares
• IPC APEX EXPO App is Where It’s At with Kim DiCianni

Columns

• Focus on the New, by Stephen Las Marias, I-Connect007
• Configure to Order: Different by Design, by Michael Ford, Aegis Software
• PCB Pad Repair Techniques, by Bob Wetttermann, BEST Inc.

Articles

• Tips & Tricks: Assembly Panelization, by Ken Horky, Peterson Manufacturing
• Assigning IDs within the Internet of Things, by Hubertus Grobbel, Swissbit AG

The solder paste printing process accounts for almost 70% of PCB assembly defects. This month, we look into the critical factors causing these issues, and features strategies, tips and tricks to help assemblers improve the yield and quality in their solder paste printing operation.

Table of Contents

Features

• Equipment Matters in Solder Paste Printing, by Stephen Las Marias, I-Connect007
• Step Stencil Technologies and Their Effect on the SMT Printing Process, by Tony Lentz, FCT Assembly, and Greg Smith and Bill Kunkle, BlueRing Stencils
• Tips & Tricks: Generating Stencil Tooling, by Ken Horky, Peterson Manufacturing
• The Effect of Area Shape and Area Ratio on Solder Paste Printing Performance, by Stefan Härter, Jens Niemann, Jörg Franke, Institute for Factory Automation and Production Systems (FAPS); Friedrich-Alexander, University Erlangen-Nürnberg (FAU); and Jeff Schake and Mark Whitmore, ASM Assembly Systems
• Solder Printing Process Inputs Impacting Distribution of Paste Volume, by Marco Lajoie and Alain Breton, C-MAC Microelectronics
• Evaluation of Stencil Technology for Miniaturization, by Neeta Agarwal, Robert Farrell, and Joe Crudele, Benchmark Electronics Inc.; Chrys Shea, Shea Engineering Services; Ray Whittier, Vicor Corp.; and Chris Tibbetts, Analogic Corp.

Columns

• Editor’s Note: Improving Solder Paste Printing, by Stephen Las Marias, I-Connect007
• SMT Prospects & Perspectives: The Role of Bismuth (Bi) in Electronics, Part 2, Dr. Jennie S. Hwang, H-Technologies Group

Interview

• Industry 4.0 and the Platform-Based Approach to Testing, by Stephen Las Marias, I-Connect007

This month we look into the issues facing assemblers when dealing with HDI boards, and highlight why close collaboration and communication with the  designers right from the very start will ensure assembly success.

Table of Contents

Features

• Communication Still the Best Tool,  by I-Connect007
• Three Perspectives on HDI Design and Manufacturing Success, Discussion with Mike Creeden
• DFX on High-Density Assemblies, by Jonas Sjoberg, Chris Nash, David Sbiroli, and Wisdom Qu, Indium Corporation
• Dealing with Vias in Pads, Discussion with Duane Benson
• Via-In-Pad Plated Over Design Considerations to Mitigate Solder Separation Failure, by S.Y. Teng, P. Peretta and P. Ton, Cisco Systems Inc.; and V. Kome-ong and W. Kamanee, Celestica Thailand
• HDI Considerations: Interview with ACDi’s Garret Maxson, by Stephen Las Marias, I-Connect007

Columns

• Editor’s Note: What Matters Most is Communication, by Stephen Las Marias, I-Connect007
• Jumping Off the Bandwagon: The Proper Position to Take on Voids in Solder Joints, Part 1, by Tom Borkes, The Jefferson Institute
• Knocking Down the Bone Pile: Two Prevalent Rework Heating Methods—Which One is Best?, by Bob Wettermann, BEST Inc.

Interview

• Optimal Electronics Sets Sight on Growth, with Dr. Ranko Vujosevic

There are many perspectives and challenges in creating perfect solder joints. We present parameters and strategies that can help assemblers improve their soldering process to achieve reliable solder joints.

Table of Contents

Features

• Achieving the Perfect Solder Joint: The Many Perspectives on Soldering, by Stephen Las Marias, I-Connect007
• Moving Toward the Zero-Defect Line: An Interview with Vi TECHNOLOGY’s Olivier Pirou
• Choosing Solder Processes: Getting it Right: A Conversation with Rehm’s Ralf Wagenfuehr
• Soldering Tip: Key to Good Solder Joints, an Interview with Enrique Moreno
• Addressing Voids to Achieve Good Solder Joints, an Interview with Jonas Sigfrid Sjoberg
• Reliability of ENEPIG by Sequential Thermal Cycling and Aging, by Reza Ghaffarian, Ph.D. Jet Propulsion Laboratory

Columns

• Editor’s Note: Creating the Perfect Solder Joint, by Stephen Las Marias, I-Connect007
• SMT Prospects & Perspectives: The Role of Bismuth (Bi) in Electronics, Part 1, by Dr. Jennie S. Hwang, H-Technologies Group
• Accelerating Tech—Insights from the Smarter Factory: Counterfeit: A Quality Conundrum, by Michael Ford, Aegis Software
• Jumping Off the Bandwagon: Analyzing Material Cost in Today’s Global Economy—Hit the 'Pause' Button, by Tom Borkes, The Jefferson Institute

Interview

• The Best Approach Towards Industry 4.0 Adoption, by Stephen Las Marias, I-Connect007

There are many challenges when it comes to the rework and repair of PCB assemblies. This month, our technical authors highlight the strategies they suggest to improve the process.

Table of Contents

Features

• Editor’s Note: Improving the Rework Process, by Stephen Las Marias, I-Connect007
• A Look into PCBA Rework and Repair, by Stephen Las Marias, I-Connect007
• Rework and Reliability: Less is More!, by Karen Tellefsen, Alpha Assembly Solutions
• Drying Boards after Rework Cleaning—To Do or Not to Do?, by Bob Wettermann, BEST Inc.
• BTC and SMT Rework Challenges, by Joerg Nolte, Ersa GmbH
• Rework and Reball Challenges for Wafer-Level Packages, by Lauren Cummings and Priyanka Dobriyal, Ph.D., Intel Corp.
• Top 5 BGA Rework Challenges to Overcome, by Bob Wettermann, BEST Inc.

Bonus Articles

• Implementing a Capacity Planning Tool, by David Prunier, MC Assembly
• interview: IPC’s David Bergman on Industry Training and Education, by Stephen Las Marias, I-Connect007

This month, we take a look into the importance of workforce training and education on the continuous improvement of the PCB assembly process.

Table of Contents

Features

• Editor’s Note -- Assembly Training and Education, by Stephen Las Marias, I-Connect007
• Training and Education: Key to Improving Electronics Assembly, by Stephen Las Marias, I-Connect007
• Empowering the Workforce Through Training: An Investment Return, by Daniel Prina, MC Assembly
• The EMS Skills Gap Epidemic, by Steve Williams, The Right Approach Consulting LLC

Columns

• SMT Prospects & Perspectives: The Role of Bismuth (Bi) in Electronics: A Prelude, by Dr. Jennie S. Hwang, H-Technologies Group
• Jumping Off The Bandwagon: Analyzing the Cost of Material in Today’s Global Economy, Part 3, by Tom Borkes, The Jefferson Project

Articles

• Process Step Elimination: Driven by Cost and Efficiency, Enabled by Process and Materials Innovation, by Westin Bent, Alpha Assembly Solutions
• Verification of Inspection Results: Local, Central, Global?, by Jens Kokott, Goepel electronic GmbH
• Soldering Fumes in Electronics Manufacturing: Damaging Effects and Solutions for Removal, by Stefan Meissner, ULT AG, and Arne Neiser, SEHO Systems GmbH

Interview

• Cleaning that Matters, by Stephen Las Marias, I-Connect007

In this issue, we look into the latest technology trends, new manufacturing challenges, and outlook for the military and aerospace markets, and how they are impacting the PCB assembly industry.

Table of Contents

Features

• Mil/Aero Electronics Supply Chain Facing New Challenges, by Stephen Las Marias, I-Connect007
• Counterfeit Electronic Components Identification: A Case Study, by Martin Goetz and Ramesh Varma, Northrop Grumman Corp.
• Thermal Indicator Technology for Aerospace Wire Harness Assemblies, by Jerry Sidone, Alpha Assembly Solutions
• Field Failure is Not an Option, an interview with Audra Gavelis
• Mil/Aero Assembly Success, an interview with Davina McDonnell
• Using Lead-Free BGA in a Tin/Lead Soldering Process, by David Hillman, Rockwell Collins

Special Section

• IPC’s IMPACT Washington, D.C. 2017: You Had to Be There!, by Patty Goldman, I-Connect007

Columns

• Editor’s Note: Today’s Mil/Aero Enemies: Counterfeits, Obsolescence and Failure, by Stephen Las Marias, I-Connect007
• Jumping Off the Bandwagon: Analyzing the Cost of Material in Today’s Global Economy, Part 2, by Tom Borkes, The Jefferson Project
• More than Just Dry Air: PCBs are MSDs, by Rich Heimsch, Super Dry-Totech
• Knocking Down the Bone Pile: Using Paste Flux for Rework, by Bob Wettermann, BEST Inc.

Articles

• An Alternative Approach to Vertical Integration in Manufacturing, by Richard Kelly, MC Assembly

This month we look into the myriad challenges in inspection, and highlights the need for newer AOI technologies to improve production yields and ensure reliability.

Table of Contents

Features

• 3D: Towards Better Inspection Capability, by I-Connect007
• 3D Inspection Is the Way to Go, by Stephen Las Marias, I-Connect007
• AOI Capabilities Study With 03015 Components, by David Geiger, et al., Flex International
• Saki Discusses Industry 4.0 and True 3D Technology, by Stephen Las Marias, I-Connect007
• Koh Young Discusses Latest 3D AOI Innovations, by Stephen Las Marias, I-Connect007
• 2D X-ray Inspection With Materials and Thickness Identification, by Paul D. Scott, Ph.D., IBEX Innovations, and Evstatin Krastev, Ph.D., P.E., Nordson Dage

Columns

• Editor’s Note: The Need for 3D AOI, by Stephen Las Marias, I-Connect007
• Jumping off the Bandwagon: Reading, Writing, Listening, Speaking and Analyzing Material Cost in the Global Economy, Part 1, by Tom Borkes, The Jefferson Project
• More Than Just Dry Air: Long-Term Storage of Electronic Components and Compositions, by Rich Heimsch, Super Dry-Totech

Interview

• Shenzhen Axxon Discusses Acquisition and Dispensing Market Trends, by Stephen Las Marias, I-Connect007

This month, we explore the challenge of finding the right talent in the electronics manufacturing industry.

TABLE OF CONTENTS

FEATURES

• Finding, Nurturing, and Growing the Right Talent, by Stephen Las Marias
• Hiring, Training and Retaining Millennials, by Davina McDonnell
• Grow Your Own Training Programs, by Davina McDonnell
• Keeping an Eye on the Next Generation, by Rick Short
• The Challenge of Filling Positions in the PCB Assembly Industry, by John Talbot
• Manufacturing Through the Eyes of Human Resources, Recruitment and New Hire Training, by Brian Kingston
• Blackfox Program Trains Vets for Manufacturing Jobs, Interview with Allen Dill
• Enhancing Recruitment Efforts with Public-Private Partnerships, by Susan Mucha

ARTICLES

• Tape and Reel Solder Preforms: A Success Story for the UD00 X86 SECO Board, by Donato Casati and Alessandro Severi
• Mentor Graphics: Connecting the Manufacturing Environment, Interview with Oren Manor

COLUMNS

• Do Acquisitions Bear Fruit? A Pragmagtic Perspective, by Dr. Jennie S. Hwang
  
• If It’s My Data, I Can Do What I Want, Right?, by Michael Ford

It is of the utmost importance that the soldering process should be perfect. But soldering is just too complex a process, and further complicating the situation, the requirements and technologies vary between our industry’s market segments. This month, we look into some of the different factors and challenges impacting yield when it comes to soldering, and provides strategies on addressing them.

Table of Contents

Features

• Interview: The Complex World of Soldering, with Cathy Cox and Happy Holden
• Predicting Solder Paste Transfer Efficiency and Print Volume, Alpha Assembly Solutions
• Voiding Control at High-Power Die-Attach Preform Soldering, Indium Corporation
• OK International Brings Disruptive Technology in Hand Soldering, Real Time With…IPC
• Vapor Degreasing Chemistries to Remove Difficult Lead-Free and No-Clean Fluxes from PCBs, MicroCare Corp.
  

Columns

• Editor’s Note: What a Tangled (Soldering) Web We Weave, by Stephen Las Marias, I-Connect007
• More than Just Dry Air: Solutions for Long-term Storage of Electronic Components and Compositions, by Rich Heimsch, Super Dry-Totech EU

Interviews

• VirTex on Military and Aerospace Electronics Requirements, with Brad Heath
• Tim O’Neill Discusses Latest Developments in Lead-Free Soldering Market, Real Time with…IPC

We take a look into the different challenges that assemblers face when dealing with flex circuits, and highlights strategies to address them in this issue.

Table of Contents

Features

• Assembly of Flexible Circuits, by John Talbot, Tramonto Circuits
• Strategies for Addressing Flex Circuit Assembly Pain Points, Interview with Steve Fraser
• Supportive Tooling: The Magic Ingredient for Flex Circuit Assembly, by Davina McDonnell, Saline Lectronics
• Rework and Repair on Flex Circuits, by Bob Wettermann, BEST Inc.
• JJS Manufacturing Stresses the Need for Baking Prior to Flex-Circuit Assembly, Interview with Russsell Poppe
  
• Fixturing: Key to Accurate Flex Circuit Assembly, Interview with Adrian Nishimoto
• Flex Circuit Assembly Success Hinges on MSL Control and Panelization, Interview with Mike Galloway
• Achieving Successful Flex Circuit Assemblies, by Stephen Las Marias, I-Connect007