The On the Line with... Engineering What’s Next podcast expands on Qnity’s six-part advanced electronics series, exploring the materials and engineering challenges shaping the next generation of electronics. From AI and advanced packaging to miniaturization, reliability, thermal management, and sustainability, the guide examines why increasingly complex systems require a broader, more collaborative approach to innovation. Readers will learn how materials, interconnects, substrates, packaging technologies, and system architectures must work together to meet rising performance demands. Drawing on insights from Qnity experts, this guide highlights the importance of systems-level thinking, early collaboration, and materials innovation in enabling tomorrow’s high-performance electronic technologies.
