Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Electronics Industry Pioneer Jim Raby Passes Away
June 19, 2017 | IPCEstimated reading time: Less than a minute
Long-time IPC member, industry leader and founder of STI Electronics Inc., Jim Raby, 82, passed away on Friday, June 16.
For more than 40 years, Jim worked on industry standards, including IPC-J-STD-001, IPC-A-610 and standards for wire harnesses. He was also involved in research for lead-free solder processes and materials. His seminal paper, “Standardization of Military Specifications,” was the roadmap for reducing some 219 specifications into a single four-document set known as MIL-STD-2000, the precursor to J-STD-001 and IPC-A-610.
He worked on more than a dozen standards and training programs, and chaired or vice-chaired committees on soldering, rework and repair, component mounting, and product assurance. He wrote the curriculum and conducted beta testing for IPC training programs for IPC-J-STD-001, IPC-A-610D, IPC/WHMA-A-620, and IPC-7711/7721A, and received the IPC Presidents Award in 1984.
Jim will be missed by his fellow IPC committee members, staff and his colleagues in the electronics manufacturing industry.
In a statement, the company said, "… Although Jim's passing will leave a huge void in each of our lives, his legacy will live on. His love for family, friends, colleagues and country will remain in our hearts and memories for years to come."
Funeral arrangements are pending.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.