Focus on the New

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Hello, 2018! Wow, it seems like it wasn’t too long ago when I was writing about the optimism of the electronics manufacturing and assembly industry going into 2017. Now, here we are again at the beginning of the new year, looking at new trends, disruptive technologies, and emerging markets for 2018.

First things first!

I am sure you have noticed our name has changed from SMT Magazine to SMT007 Magazine. Not only did we update our magazine’s name, we also refreshed the interior pages of the publication, as well. As an I-Connect007 publication, SMT007 Magazine fits nicely with our other publications, which also carry through with the naming convention starting this month: PCB007 Magazine and Design007 Magazine. We hope you enjoy this fresh new look.

What else have we been up to?

Last month, our team attended the HKPCA & IPC Show in Shenzhen, China, to talk to industry leaders in the PCB supply chain about trends and technologies to watch for in the coming year.

The consensus is that everyone’s excited about the continuing growth in the electronics assembly industry. Last year, the industry was beset with the copper foil shortage. While the same shortage can be expected this year, given the strong growth of the automotive electronics industry, manufacturers and suppliers remain bullish that this same growth will fuel other aspects of the electronics manufacturing industry.

Show attendees and vendors were also generally excited about 5G, highlighting the pilot deployment of the first 5G network at the 2018 Winter Olympics in South Korea. Other notable technologies with expected growth include medical electronics, and the proliferation of devices for the Internet of Things (IoT).

This Month’s Lineup

In this issue, we have taken a close look at the many facets and considerations associated with investing in new equipment. Do you buy new equipment just to say you have the latest systems in your processing lines? Of course not. But what are the key reasons that will drive you to invest in new equipment, and what decision process goes on behind the scenes that justifies your investment in these new machines?

To read the full version of this article, which appeared in the January 2018 issue of SMT007 Magazine, click here.

01/08/2020 | Barry Matties, I-Connect007

Karthik Vijay is head of the applications engineering team for customers in Europe at Indium Corporation. He spoke with Barry Matties about what EMS or assemblers for automotive should consider, as well as how he thinks 5G will affect the marketplace and manufacturing.

09/30/2019 | Nolan Johnson, I-Connect007

The SMTA International conference—held September 22–29, 2019, at the Stephens Convention Center in Rosemont, Illinois—honored industry members with awards for their contributions to the industry. I-Connect007 has compiled an unofficial list of award recipients. The official list from SMTA will be released shortly, and I-Connect007 will publish it as soon as it is available.

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA

Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.