KIC and Indium to Hold Voiding Clinic at IPC APEX EXPO 2019

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KIC and Indium Corporation will hold a voiding clinic in booth #1215 at the IPC APEX EXPO 2019, scheduled to take place January 29-31 at the San Diego Convention Center.

Two of the most effective ways to reduce voiding in solder joints is to analyze the assembly process from a materials perspective and from a reflow profiling perspective. Voiding experts from both KIC and Indium Corporation will be on hand to analyze customers’ soldering processes and recommend adjustments to help them to minimize their solder joint voiding.

Customers can drop by the KIC booth anytime between 1-3 p.m. Tuesday and Wednesday, January 29-30. If those times are not convenient, they can email MB Allen at mballen@kicmail.com to make an appointment.

Indium Corporation’s award-winning Indium8.9 No-Clean Pb-free Solder Paste has been proven to avoid the void by reducing voiding to as low as 10 percent. Together with KIC’s reflow profiling systems, customers can reduce overall voiding and improve the reliability of their end product.

08/06/2019 | A. Prasad, L. Pymento, S.R. Aravamudhan, and C. Periasamy, Intel Corp.

This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

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In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

07/24/2019 | Neil Sharp, JJS Manufacturing

The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.