-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Volunteers Honored for Contributions to IPC and the Electronics Industry
February 11, 2019 | IPCEstimated reading time: 3 minutes
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on January 28 and January 30 at IPC APEX EXPO 2019 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Receiving Special Recognition Awards for their contributions to the 2018-2019 Technical Program Committee were Steve Butkovich, Test Innovation, LLC; Weifeng Liu, Flex; Russ Nowland, Nokia; Julie Silk, Keysight Technologies; and Bhanu Sood, NASA Goddard Space Flight Center.
For his leadership of the 8-81 PERM Self-Mitigation of Tin by SMT Task Group that developed IPC/PERM-WP-022, Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow, David Pinsky, Raytheon Company, received a Committee Leadership Award. Ben Gumpert, Lockheed Martin Missiles & Fire Control; Thomas Hester, Raytheon Space and Airborne Systems; David Hillman, Collins Aerospace; Anduin Touw, The Boeing Company; Ross Wilcoxon, Collins Aerospace; and Paul Zutter, U.S. Army AMRDEC, received a Distinguished Committee Service Award.
For their leadership of the 7-31FT IPC/WHMA-A-620 Technical Training Task Group that developed IPC/WHMA-A-620C, Requirements and Acceptance for Cable and Wire Harness Assemblies, Catherine Hanlin, Prevision Manufacturing Company, Inc; Shelley Holt, L3 Communications; and Debbie Wade, Advanced Rework Technology-A.R.T, earned a Committee Leadership Award. For their extraordinary contributions to IPC/WHMA-A-620C, Garry Maguire, NASA Marshall Space Flight Center; Michelle Morring, STI Electronics Inc; and Pat Scott, STI Electronics Inc, received a Special Recognition Award.
Symon Franklin, Custom Interconnect Ltd. And Debbie Wade, Advanced Rework Technology-A.R.T, were honored with Committee Leadership Awards for their leadership of the 5-22BTEU European Technical Training Task Group that developed IPC/WHMA-A-620C, Requirements and Acceptance for Cable and Wire Harness Assemblies.
For his leadership of the D-33AA IPC-6012 Automotive Addendum Task Group that developed IPC-6012DA, Automotive Applications Addendum to IPC-6012D, with Amendment 1, Qualification and Performance Specification for Rigid Printed Boards, Jan Pedersen, Elmatica, earned a Committee Leadership Award. For their extraordinary contributions, Kelvin Chang, Veoneer Canada Inc.; Nancy Deng, Ford Motor Research & Engineering; Emma Hudson, Gen3 Systems Limited; Andrew Goddard, ZF TRW Automotive; Todd MacFadden; Bose Corporation; Laurent Nardo, Continental Automotive France SAS; Michael Schoening, Q-Products Enterprise Limited; and Udo Welzel, Robert Bosch Co. Ltd., received a Special Recognition Award.
For their leadership of the 5-22a J-STD-001 Task Group that developed J-STD-001G, Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1, Dan Foster, Missile Defense Agency, and Kathy Johnston, Raytheon Missile Systems, earned a Committee Leadership award. Doug Pauls, Collins Aerospace, and Udo Welzel, Robert Bosch GmBH, received a Committee Leadership Award for their leadership of the Rhino Team that developed IPC-WP-019A, An Overview on the Global Change in Ionic Cleanliness Requirements/ J-STD-001G, Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1.
Dock Brown, DfR Solutions; Karen McConnell, Northrop Grumman Corporation; and Steve Golemme, Google Inc., were honored with a Committee Leadership Award for leading the 1-14 DFX Standards Subcommittee that developed IPC-2231, Design for Excellence Guideline during the Product Lifecycle. Don Dupriest, Lockheed Martin Missiles & Fire Control, received a Special Recognition Award. Jimmy Baccam, Lockheed Martin Missiles & Fire Control; Benny Barbero, Allied Telesis Inc; Scott Bowles, L3 Fuzing and Ordnance Systems, Cincinnati; Peter Fernandez, Lab 126; Michelle Gleason, Plexus Corp.- Neenah Operations; Kayleen Helms, Intel Corporation; Eddie Hofer, Rockwell Collins; Waleid Jabai, Zentech Manufacturing; Kevin Kusiak, Lockheed Martin Space Systems Company; Dale Lee, Plexus Corp.- Neenah Operations; Kristopher Moyer, CSUS; James Pierce, Axiom Electronics, LLC; Robert Rowland, Axiom Electronics, LLC; Steven Roy, Hamilton Company; Rainer Taube, Taube Electronic GmbH; Theodore John Tontis, Rockwell Automation/Allen-Bradley; Cheryl Tulkoff, DfR Solutions; Louis Ungar, Advanced Test Engineering Solutions, Inc.; Pietro Vergine, Leading Edge; and Linda Woody, LWC Consulting, received a Distinguished Committee Service Award for their contributions to IPC-2231, Design for Excellence Guideline during the Product Lifecycle.
Suggested Items
AirBorn Announces Agreement to be Acquired by Molex
11/18/2024 | PRNewswireAirBorn, a global manufacturer of high reliability electronics and components, announced it has entered into an agreement to be acquired by Molex, a leading global connectivity and electronics solutions provider.
RTX's Collins Aerospace to Provide UK Chinook Helicopters with Interoperable Avionics System
11/12/2024 | RTXCollins Aerospace, an RTX business, has received a $19 million contract from the Department of Defense to equip a fleet of new H-47 Chinooks for the UK Royal Air Force with its Common Avionics Architecture System (CAAS) avionics management suite.
Lockheed Martin Skunk Works, the Royal Netherlands Aerospace Centre (NLR) Announce Strategic Collaboration
10/21/2024 | Lockheed MartinSkunk Works®, the renowned advanced development organization within Lockheed Martin Corporation and the Royal Netherlands Aerospace Centre (NLR), a premier knowledge institute and connecting link among science, industry, and government in the Netherlands, announced a strategic collaboration to advance mutual interests for enhanced security at the Netherlands Defense Industry Days event.
Altair Drives Aerospace Innovation at Motivo
10/17/2024 | AltairAltair, a global leader in computational intelligence, is proud to announce its collaboration with Motivo, a product engineering firm focused on translating forward-thinking visions into best-in-class products for clients in the mobility, energy, agriculture technology, and aerospace sectors. Motivo utilizes Altair’s unique combination of engineering consulting and software to drive innovation for organizations in the aerospace industry.
Airbus, Toshiba to Partner on Superconductivity Research
10/16/2024 | AirbusAirbus UpNext, a wholly-owned subsidiary of Airbus, and Toshiba Energy Systems & Solutions Corporation (Toshiba), Toshiba Group’s energy arm, will cooperate and mutualise experience on superconducting technologies for future hydrogen-powered aircraft.