Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Emerging Technologies Take Center Stage at IPC Electronics Materials Forum
September 11, 2019 | IPCEstimated reading time: 2 minutes
The IPC Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing for board fabrication, assembly and post-assembly protection. The three-day forum, to be held November 5-7 in Bloomington, Minn. will be co-located with a Pb-free Electronics Risk Management (PERM) Council meeting.
Geared toward engineers and managers that procure materials or seek an understanding of advancements in materials for the board, assembly, components and protective layers, the IPC Electronics Materials Forum will emphasize the emerging technologies that challenge the existing materials set. Interactive panels and networking opportunities will provide attendees an open forum to discuss solutions to challenges.
The Forum will feature a keynote by Lenora Clark, director, autonomous driving and safety technology for MacDermid Alpha Automotive, who will present insights into all aspects of electronics, uniting circuitry, semiconductor and assembly solutions to support future automotive market needs.
“You can envision many future technologies, but you cannot create them without materials and processes to manufacture them,” said Brook Sandy-Smith, technical conference program manager. “Emerging technologies that challenge our existing materials set will inform the developments needed for the future, and we have an impressive lineup of speakers, including Lenora Clark as our keynote, at IPC Electronics Materials Forum to lead the way.”
More than 20 companies will be represented at the Forum, including Continental Automotive Systems, Averatak, Calumet Electronics, Indium, Lockheed Martin and Raytheon, among others.
Topics to be presented include:
- Semi-additive processes for high density interconnect
- Additive textile manufacturing for electrical connections
- SIR test method for underfill reliability in automotive electronics
- Digitization of organic electronics information: Materials, manufacturing and devices
- Reliable and cost-effective nickel-free solutions for high-frequency/high-density applications
- Evaluation of PCB through hole plating, drill, and desmear quality for new laminate materials
- Trends and developments in electronic protection materials
For more information about the IPC Electronics Materials Forum or to register, click here.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,500 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.
Critical Minerals: The New Power Play in Global Trade
10/13/2025 | Marcy LaRont, I-Connect007Access to critical minerals essential for electronics manufacturing, and China’s monopoly of them, is increasingly under scrutiny, with gallium (Ga) and germanium (Ge)at the forefront of this discourse. However, all critical minerals imported from China share a similar narrative, and understanding the implications of this dependency and the risks to both U.S. commercial and defense sectors has created an urgent need for a comprehensive electronics strategy to secure and diversify access to these vital minerals. In this candid interview, USPAE Executive Director Jim Will discusses the issues and the mitigation steps that must be taken to adequately address them.