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TT Electronics Wins Ultra PCS Award
October 8, 2019 | TT ElectronicsEstimated reading time: 1 minute
TT Electronics, a global provider of engineered electronics for performance critical applications, has announced the company’s Fairford facility has been awarded a multi-million dollar contract by long-time customer, Ultra Electronics Precision Control Systems (Ultra PCS). Ultra PCS is a leading provider of high integrity control products for aerospace, military vehicle and soldier applications. With this award, TT will build highly complex electronic assemblies for Ultra PCS’ engine ice protection systems for modern combat aircraft.
This latest win extends the decades-long relationship TT holds with the wider Ultra group. Throughout the years, TT has delivered a variety of innovative solutions to fulfil Ultra’s requirements for its aerospace and defence customers worldwide. With renewed focus on customer alignment and satisfaction, TT’s new leadership has invested extensively within the company—in state-of-the-art equipment, strategic recruitment efforts and progressive training and development programmes.
“Our Fairford location is an excellent example of how focused investment in our people and facilities are impacting our customers and paving the way for future partnerships. Our teams, integrated across business units, have the capabilities, resources and skills necessary to deliver on the additional requirements of Ultra PCS’ new order and those of many others,” said Michael Leahan, executive vice president, Global Manufacturing Solutions, TT Electronics. “This award provides a firm foundation for future growth, in addition to strengthening TT’s position as a major supplier to the global aerospace industry.”
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Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
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