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BESTProto Announces the Addition of Solder Paste Jetter
October 18, 2019 | BESTProto Inc.Estimated reading time: 1 minute
BESTProto Inc. is pleased to announce the acquisition and installation of a new Mycronic MY-600 solder paste printer to support its (3) lines.
The new MY-600 will assist BESTProto in assembling complex low volume and prototype electronic assemblies. It reduces the design and lead time associated due to stencil fabrication. The main advantage to BESTProto customers is the consistent solder paste depositions of the jetter-especially when it comes to ultraminiature components as well as when there are components requiring both large areas of solder paste deposition along with micro areas of paste application.
This capability, along with its recently-added 3rd assembly line, will add to the capabilities of BESTProto to absorb more work from both existing and new clientele.
“Our customers continue to challenge our technological capabilities, and this is another investment along those lines to better serve existing and new customers. We have been fortunate to have the confidence as a business to make this new investment.” Garth Cate, business development manager at BESTProto Inc stated.
The equipment started producing prototypes and small volume complex builds in the second half of August 2019.
About BESTProto Iinc.
Headquartered in South Elgin, Illinois BESTProto specializes in EMS services in the prototype and small volume build arena. BESTProto services military, medical, industrial and complex communications markets and ISO 9001 and ITAR registered as well as being NIST compliant.
For more information visit www.bestproto.net.
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BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    